IT1067486B - Procedimento per fabbricare un componente elettrico costituito da perlomeno due elementi separati da unos strato isolante - Google Patents

Procedimento per fabbricare un componente elettrico costituito da perlomeno due elementi separati da unos strato isolante

Info

Publication number
IT1067486B
IT1067486B IT25285/76A IT2528576A IT1067486B IT 1067486 B IT1067486 B IT 1067486B IT 25285/76 A IT25285/76 A IT 25285/76A IT 2528576 A IT2528576 A IT 2528576A IT 1067486 B IT1067486 B IT 1067486B
Authority
IT
Italy
Prior art keywords
procedure
manufacturing
insulating layer
electric component
component consisting
Prior art date
Application number
IT25285/76A
Other languages
English (en)
Italian (it)
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Application granted granted Critical
Publication of IT1067486B publication Critical patent/IT1067486B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • H01L21/4807—Ceramic parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1056—Perforating lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/109—Embedding of laminae within face of additional laminae
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092—All laminae planar and face to face
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
IT25285/76A 1975-07-17 1976-07-14 Procedimento per fabbricare un componente elettrico costituito da perlomeno due elementi separati da unos strato isolante IT1067486B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2532009A DE2532009C3 (de) 1975-07-17 1975-07-17 Verfahren zur Herstellung eines elektrischen Bauteiles aus mindestens zwei Einzelteilen, die durch eine Isolierschicht getrennt sind

Publications (1)

Publication Number Publication Date
IT1067486B true IT1067486B (it) 1985-03-16

Family

ID=5951781

Family Applications (1)

Application Number Title Priority Date Filing Date
IT25285/76A IT1067486B (it) 1975-07-17 1976-07-14 Procedimento per fabbricare un componente elettrico costituito da perlomeno due elementi separati da unos strato isolante

Country Status (5)

Country Link
US (1) US4147579A (enExample)
AT (1) AT359584B (enExample)
CH (1) CH603019A5 (enExample)
DE (1) DE2532009C3 (enExample)
IT (1) IT1067486B (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2820403C2 (de) * 1978-05-10 1984-09-27 Siemens AG, 1000 Berlin und 8000 München Verfahren zum Ankleben und zum Kontaktieren eines elektrischen Bauteils mit einer flächenförmigen Elektrode
DE3544526A1 (de) * 1985-12-17 1987-06-19 Telefunken Electronic Gmbh Montagegeraet zum einkleben von bauteilen in ein gehaeuse
US4700473A (en) * 1986-01-03 1987-10-20 Motorola Inc. Method of making an ultra high density pad array chip carrier
US4678529A (en) * 1986-07-02 1987-07-07 Xerox Corporation Selective application of adhesive and bonding process for ink jet printheads
JPH02197183A (ja) * 1988-03-29 1990-08-03 Pennwalt Corp 積層圧電構造及びその形成方法
JP2008537461A (ja) * 2005-04-13 2008-09-11 アダプティブエナジー・リミテッド・ライアビリティー・カンパニー フレキシブル膜上に導体を備える圧電ダイヤフラムアセンブリ
US8198547B2 (en) 2009-07-23 2012-06-12 Lexmark International, Inc. Z-directed pass-through components for printed circuit boards
US8735734B2 (en) * 2009-07-23 2014-05-27 Lexmark International, Inc. Z-directed delay line components for printed circuit boards
US8752280B2 (en) 2011-09-30 2014-06-17 Lexmark International, Inc. Extrusion process for manufacturing a Z-directed component for a printed circuit board
US8943684B2 (en) * 2011-08-31 2015-02-03 Lexmark International, Inc. Continuous extrusion process for manufacturing a Z-directed component for a printed circuit board
US9009954B2 (en) 2011-08-31 2015-04-21 Lexmark International, Inc. Process for manufacturing a Z-directed component for a printed circuit board using a sacrificial constraining material
US8790520B2 (en) * 2011-08-31 2014-07-29 Lexmark International, Inc. Die press process for manufacturing a Z-directed component for a printed circuit board
US9078374B2 (en) 2011-08-31 2015-07-07 Lexmark International, Inc. Screening process for manufacturing a Z-directed component for a printed circuit board
US8822840B2 (en) 2012-03-29 2014-09-02 Lexmark International, Inc. Z-directed printed circuit board components having conductive channels for controlling transmission line impedance
US8822838B2 (en) 2012-03-29 2014-09-02 Lexmark International, Inc. Z-directed printed circuit board components having conductive channels for reducing radiated emissions
US8912452B2 (en) 2012-03-29 2014-12-16 Lexmark International, Inc. Z-directed printed circuit board components having different dielectric regions
US8830692B2 (en) 2012-03-29 2014-09-09 Lexmark International, Inc. Ball grid array systems for surface mounting an integrated circuit using a Z-directed printed circuit board component

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2969300A (en) * 1956-03-29 1961-01-24 Bell Telephone Labor Inc Process for making printed circuits
US3113287A (en) * 1956-03-29 1963-12-03 Raytheon Co Electroacoustical transducer mounted on boat hull
US3131557A (en) * 1960-10-03 1964-05-05 Union Carbide Corp Specular surface analysis
US3290479A (en) * 1963-12-09 1966-12-06 Western Electric Co Apparatus for bonding
US3448516A (en) * 1966-02-14 1969-06-10 Norman R Buck Method of preparing printed wiring
US3517438A (en) * 1966-05-12 1970-06-30 Ibm Method of packaging a circuit module and joining same to a circuit substrate
US3520751A (en) * 1967-01-30 1970-07-14 Valve Corp Of America Method of securing a label to an article
US3547724A (en) * 1967-02-07 1970-12-15 Rogers Corp Method of and apparatus for producing printed circuits
US3629042A (en) * 1968-06-20 1971-12-21 W R Frank Packaging Engineers Method of embossing a three dimensional medallion into a thermoplastic resin substrate

Also Published As

Publication number Publication date
DE2532009B2 (de) 1978-09-28
DE2532009A1 (de) 1977-01-20
ATA423076A (de) 1980-04-15
AT359584B (de) 1980-11-25
CH603019A5 (enExample) 1978-08-15
US4147579A (en) 1979-04-03
DE2532009C3 (de) 1979-05-31

Similar Documents

Publication Publication Date Title
IT1067486B (it) Procedimento per fabbricare un componente elettrico costituito da perlomeno due elementi separati da unos strato isolante
SE7604944L (sv) Forfarande for att forbettra de elektriska egenskaperna hos organopolysiloxanelastomerer och kompositioner derfor
SE7605097L (sv) Sett for tillverkning av en isolerad elektrisk ledare
SE7600541L (sv) Forfarande for ytbehandling av en aluminiumtrad avsedd for elektriska endamal
SE7606218L (sv) Forfarande for framstellning av elektriska stapel- eller skiktkondensatorer
SE413329B (sv) Forfarande for forbettring av elektriska kretskorts lodbarhet
SE7603439L (sv) Klemdon for isolerande ledare
SE7513400L (sv) Forfarande for forbettring av forlengningen hos kornforfinade kopparlegeringar
SE428278B (sv) Forfarande for kontinuerlig vulkanisering av langstreckta foremal
AT357617B (de) Elektrische steckverbindung
DK456176A (da) Fremgangsmade til fremstilling af elektriske ledninger
FR2334183A1 (fr) Procede de fabrication de cables electriques sous-marins multipolaires
ATA732876A (de) Elektrische steckverbindung
AT355153B (de) Elektroisolierlack
SE7606306L (sv) Forfarande for framstellning av elektriska ledare al-mg-si
SE7613173L (sv) Sett att framstella vesentligen oxidfri koppar
IT1057326B (it) Procedimento per il fissaggio di elementi coibenti
AT358645B (de) Elektrische steckverbindung
SE417615B (sv) Forfarande for insmeltning av jernhaltigt material i elektrougn
BE845857A (fr) Perfectionnements relatifs aux connecteurs electriques
IT1070081B (it) Procedimento e dispositivo di fabbricazione di contati elettrici
DK131177A (da) Fremgangsmade til fremstilling af isolerende overtrek pa elektriske ledere
GB1551985A (en) Manufacture of insulating boards
BE838007A (fr) Perfectionnements aux revetements isolants electriques
IT1029296B (it) Procedimento per la fabbricazione di un condensatore elettrico di tipo avvolto e condensatore ottenuto