IT1011209B - Dispositivo di raffreddamento per componenti a forte dissipazione termica - Google Patents
Dispositivo di raffreddamento per componenti a forte dissipazione termicaInfo
- Publication number
- IT1011209B IT1011209B IT4998674A IT4998674A IT1011209B IT 1011209 B IT1011209 B IT 1011209B IT 4998674 A IT4998674 A IT 4998674A IT 4998674 A IT4998674 A IT 4998674A IT 1011209 B IT1011209 B IT 1011209B
- Authority
- IT
- Italy
- Prior art keywords
- components
- cooling device
- thermal dissipation
- strong thermal
- strong
- Prior art date
Links
- 238000001816 cooling Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/08—Cooling, heating or ventilating arrangements
- H01C1/082—Cooling, heating or ventilating arrangements using forced fluid flow
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR7311980A FR2224875B1 (enrdf_load_stackoverflow) | 1973-04-03 | 1973-04-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IT1011209B true IT1011209B (it) | 1977-01-20 |
Family
ID=9117343
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT4998674A IT1011209B (it) | 1973-04-03 | 1974-04-02 | Dispositivo di raffreddamento per componenti a forte dissipazione termica |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPS49131385A (enrdf_load_stackoverflow) |
| BE (1) | BE813190A (enrdf_load_stackoverflow) |
| DE (1) | DE2415893A1 (enrdf_load_stackoverflow) |
| FR (1) | FR2224875B1 (enrdf_load_stackoverflow) |
| GB (1) | GB1454836A (enrdf_load_stackoverflow) |
| IT (1) | IT1011209B (enrdf_load_stackoverflow) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5722449Y2 (enrdf_load_stackoverflow) * | 1977-12-28 | 1982-05-15 | ||
| CH659735A5 (de) * | 1982-05-13 | 1987-02-13 | Bbc Brown Boveri & Cie | Kuehlkoerper zur fluessigkeitskuehlung von leistungshalbleiterelementen. |
| US4965658A (en) * | 1988-12-29 | 1990-10-23 | York International Corporation | System for mounting and cooling power semiconductor devices |
| US5099311A (en) * | 1991-01-17 | 1992-03-24 | The United States Of America As Represented By The United States Department Of Energy | Microchannel heat sink assembly |
| DE4217289C2 (de) * | 1992-05-25 | 1996-08-29 | Mannesmann Ag | Fluidgekühlte Leistungstransistoranordnung |
| DE4217598A1 (de) * | 1992-05-27 | 1993-12-02 | Siemens Nixdorf Inf Syst | Einbausystem für auf Leiterplatten montierte hochintegrierte, gehäuselose Bausteine |
| DE4217599C2 (de) * | 1992-05-27 | 1994-08-25 | Siemens Nixdorf Inf Syst | Einbausystem für auf Leiterplatten montierte, hochintegrierte, gehäuselose Bausteine |
| DE4327895A1 (de) * | 1993-08-19 | 1995-02-23 | Abb Management Ag | Stromrichtermodul |
| US7228888B2 (en) * | 2005-10-13 | 2007-06-12 | International Business Machines Corporation | Rotatable liquid reservoir for computer cooling |
| US8559175B2 (en) | 2008-07-25 | 2013-10-15 | Koninlijke Philips N.V. | Cooling device for cooling a semiconductor die |
| JP2010114121A (ja) * | 2008-11-04 | 2010-05-20 | Daikin Ind Ltd | 電装部品の放熱器 |
-
1973
- 1973-04-03 FR FR7311980A patent/FR2224875B1/fr not_active Expired
-
1974
- 1974-04-02 DE DE2415893A patent/DE2415893A1/de not_active Ceased
- 1974-04-02 BE BE142753A patent/BE813190A/xx unknown
- 1974-04-02 IT IT4998674A patent/IT1011209B/it active
- 1974-04-03 GB GB1485174A patent/GB1454836A/en not_active Expired
- 1974-04-03 JP JP3705174A patent/JPS49131385A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE2415893A1 (de) | 1974-10-17 |
| JPS49131385A (enrdf_load_stackoverflow) | 1974-12-17 |
| BE813190A (fr) | 1974-07-31 |
| FR2224875B1 (enrdf_load_stackoverflow) | 1978-10-27 |
| FR2224875A1 (enrdf_load_stackoverflow) | 1974-10-31 |
| GB1454836A (en) | 1976-11-03 |
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