DE2415893A1 - Kuehlvorrichtung - Google Patents
KuehlvorrichtungInfo
- Publication number
- DE2415893A1 DE2415893A1 DE2415893A DE2415893A DE2415893A1 DE 2415893 A1 DE2415893 A1 DE 2415893A1 DE 2415893 A DE2415893 A DE 2415893A DE 2415893 A DE2415893 A DE 2415893A DE 2415893 A1 DE2415893 A1 DE 2415893A1
- Authority
- DE
- Germany
- Prior art keywords
- component
- cooling device
- fluid
- recess
- screw
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000001816 cooling Methods 0.000 title claims description 20
- 239000012530 fluid Substances 0.000 claims description 16
- 239000007788 liquid Substances 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 230000003993 interaction Effects 0.000 claims description 4
- 229920006395 saturated elastomer Polymers 0.000 claims description 4
- 238000007599 discharging Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims description 2
- 239000000110 cooling liquid Substances 0.000 description 6
- 239000012809 cooling fluid Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 239000002826 coolant Substances 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000027939 micturition Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/08—Cooling, heating or ventilating arrangements
- H01C1/082—Cooling, heating or ventilating arrangements using forced fluid flow
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR7311980A FR2224875B1 (enrdf_load_stackoverflow) | 1973-04-03 | 1973-04-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2415893A1 true DE2415893A1 (de) | 1974-10-17 |
Family
ID=9117343
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE2415893A Ceased DE2415893A1 (de) | 1973-04-03 | 1974-04-02 | Kuehlvorrichtung |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPS49131385A (enrdf_load_stackoverflow) |
| BE (1) | BE813190A (enrdf_load_stackoverflow) |
| DE (1) | DE2415893A1 (enrdf_load_stackoverflow) |
| FR (1) | FR2224875B1 (enrdf_load_stackoverflow) |
| GB (1) | GB1454836A (enrdf_load_stackoverflow) |
| IT (1) | IT1011209B (enrdf_load_stackoverflow) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3221423A1 (de) * | 1982-05-13 | 1983-11-17 | BBC Aktiengesellschaft Brown, Boveri & Cie., 5401 Baden, Aargau | Kuehlkoerper zur fluessigkeitskuehlung von leistungshalbleiterelementen |
| US5099311A (en) * | 1991-01-17 | 1992-03-24 | The United States Of America As Represented By The United States Department Of Energy | Microchannel heat sink assembly |
| DE4217599A1 (de) * | 1992-05-27 | 1993-12-02 | Siemens Nixdorf Inf Syst | Einbausystem für auf Leiterplatten montierte, hochintegrierte, gehäuselose Bausteine |
| DE4217598A1 (de) * | 1992-05-27 | 1993-12-02 | Siemens Nixdorf Inf Syst | Einbausystem für auf Leiterplatten montierte hochintegrierte, gehäuselose Bausteine |
| DE4217289A1 (de) * | 1992-05-25 | 1993-12-16 | Mannesmann Ag | Fluidkühlung von Halbleiterelementen |
| DE4327895A1 (de) * | 1993-08-19 | 1995-02-23 | Abb Management Ag | Stromrichtermodul |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5722449Y2 (enrdf_load_stackoverflow) * | 1977-12-28 | 1982-05-15 | ||
| US4965658A (en) * | 1988-12-29 | 1990-10-23 | York International Corporation | System for mounting and cooling power semiconductor devices |
| US7228888B2 (en) * | 2005-10-13 | 2007-06-12 | International Business Machines Corporation | Rotatable liquid reservoir for computer cooling |
| KR101622267B1 (ko) * | 2008-07-25 | 2016-05-18 | 코닌클리케 필립스 엔.브이. | 반도체 다이를 냉각하는 냉각 장치 |
| JP2010114121A (ja) * | 2008-11-04 | 2010-05-20 | Daikin Ind Ltd | 電装部品の放熱器 |
-
1973
- 1973-04-03 FR FR7311980A patent/FR2224875B1/fr not_active Expired
-
1974
- 1974-04-02 IT IT4998674A patent/IT1011209B/it active
- 1974-04-02 BE BE142753A patent/BE813190A/xx unknown
- 1974-04-02 DE DE2415893A patent/DE2415893A1/de not_active Ceased
- 1974-04-03 JP JP3705174A patent/JPS49131385A/ja active Pending
- 1974-04-03 GB GB1485174A patent/GB1454836A/en not_active Expired
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3221423A1 (de) * | 1982-05-13 | 1983-11-17 | BBC Aktiengesellschaft Brown, Boveri & Cie., 5401 Baden, Aargau | Kuehlkoerper zur fluessigkeitskuehlung von leistungshalbleiterelementen |
| US5099311A (en) * | 1991-01-17 | 1992-03-24 | The United States Of America As Represented By The United States Department Of Energy | Microchannel heat sink assembly |
| DE4217289A1 (de) * | 1992-05-25 | 1993-12-16 | Mannesmann Ag | Fluidkühlung von Halbleiterelementen |
| DE4217599A1 (de) * | 1992-05-27 | 1993-12-02 | Siemens Nixdorf Inf Syst | Einbausystem für auf Leiterplatten montierte, hochintegrierte, gehäuselose Bausteine |
| DE4217598A1 (de) * | 1992-05-27 | 1993-12-02 | Siemens Nixdorf Inf Syst | Einbausystem für auf Leiterplatten montierte hochintegrierte, gehäuselose Bausteine |
| DE4327895A1 (de) * | 1993-08-19 | 1995-02-23 | Abb Management Ag | Stromrichtermodul |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2224875A1 (enrdf_load_stackoverflow) | 1974-10-31 |
| JPS49131385A (enrdf_load_stackoverflow) | 1974-12-17 |
| GB1454836A (en) | 1976-11-03 |
| BE813190A (fr) | 1974-07-31 |
| IT1011209B (it) | 1977-01-20 |
| FR2224875B1 (enrdf_load_stackoverflow) | 1978-10-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE2204589A1 (de) | Kuehlanordnung fuer flache halbleiterbauelemente | |
| DE69502264T2 (de) | Körper und Verbindung zur Kühlung eines elektronischen Bausteines durch eine von ihm elektrisch isolierte Flüssigkeit | |
| DE1914790A1 (de) | Fluessigkeitsgekuehlte Baugruppe mit Scheibenzellen | |
| DE1439126B2 (de) | Halter für mindestens ein Halbleiterbauelement | |
| DE2502472A1 (de) | Kuehlkoerper zur kuehlung von thyristoren | |
| EP0471707A1 (de) | Festkörperlaser mit pump-laserdioden. | |
| DE2415893A1 (de) | Kuehlvorrichtung | |
| DE9212752U1 (de) | Flüssigkeitskühlkörper | |
| EP0092720B1 (de) | Einspannvorrichtung für scheibenförmige Halbleiter-Bauelemente | |
| DE2012440C3 (de) | Halbleiteranordnung für gasdicht abgeschlossene scheibenförmige Halbleiterelemente | |
| DE1913546A1 (de) | Baugruppe mit mindestens zwei,durch einen Spannbolzen zusammengehaltenen Kuehlkoerpern | |
| DE2740630C2 (de) | Hochstrom-Gleichrichteranordnung | |
| DE1514679A1 (de) | Anordnung zur Fluessigkeitskuehlung einer Gleichrichterzelle | |
| EP0021269A2 (de) | Kühldose für scheibenförmige Halbleiterbauelemente | |
| DE2508600A1 (de) | Gleichrichterbruecke | |
| DE2928710A1 (de) | Strombegrenzungsapparat | |
| DE69031929T2 (de) | Halbleiter-kühlanordnung vom elektrisch-isolierten wärmerohr-typ | |
| DE3007168C2 (de) | Flüssigkeitsgekühlte Halbleitersäule | |
| DE3338165C2 (de) | Halbleiterbaueinheit mit Halbleiterbauelementen und Montage- und Kühlvorrichtung | |
| DE3132112A1 (de) | Kuehlvorrichtung fuer schaltungselemente, die waerme erzeugen | |
| DE3311712C2 (enrdf_load_stackoverflow) | ||
| DE1953678U (de) | Halbleiteranordnung. | |
| DE2208937A1 (de) | Waermerohr-kuehlanordnung fuer flache halbleiterbauelemente | |
| DE2049012C3 (de) | Vorrichtung zum Einspannen eines scheibenförmigen Halbleiterbauelementes | |
| DE3130896C2 (de) | Anordnung zur Kühlung von Halbleitern über Kühlkörper |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8110 | Request for examination paragraph 44 | ||
| 8131 | Rejection |