IN2015DN03284A - - Google Patents

Info

Publication number
IN2015DN03284A
IN2015DN03284A IN3284DEN2015A IN2015DN03284A IN 2015DN03284 A IN2015DN03284 A IN 2015DN03284A IN 3284DEN2015 A IN3284DEN2015 A IN 3284DEN2015A IN 2015DN03284 A IN2015DN03284 A IN 2015DN03284A
Authority
IN
India
Prior art keywords
substrate
pattern
layer
providing
forming
Prior art date
Application number
Other languages
English (en)
Inventor
Dror Kella
Eyal Negreanu
Gidi Amir
Mark Sandler
Yaron Grinwald
Original Assignee
Hewlett Packard Indigo Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Indigo Bv filed Critical Hewlett Packard Indigo Bv
Publication of IN2015DN03284A publication Critical patent/IN2015DN03284A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1266—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by electrographic or magnetographic printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern
    • G03G15/22—Apparatus for electrographic processes using a charge pattern involving the combination of more than one step according to groups G03G13/02 - G03G13/20
    • G03G15/24—Apparatus for electrographic processes using a charge pattern involving the combination of more than one step according to groups G03G13/02 - G03G13/20 whereby at least two steps are performed simultaneously
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern
    • G03G15/65—Apparatus which relate to the handling of copy material
    • G03G15/6582—Special processing for irreversibly adding or changing the sheet copy material characteristics or its appearance, e.g. stamping, annotation printing, punching
    • G03G15/6585—Special processing for irreversibly adding or changing the sheet copy material characteristics or its appearance, e.g. stamping, annotation printing, punching by using non-standard toners, e.g. transparent toner, gloss adding devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern
    • G03G15/65—Apparatus which relate to the handling of copy material
    • G03G15/6588—Apparatus which relate to the handling of copy material characterised by the copy material, e.g. postcards, large copies, multi-layered materials, coloured sheet material
    • G03G15/6591—Apparatus which relate to the handling of copy material characterised by the copy material, e.g. postcards, large copies, multi-layered materials, coloured sheet material characterised by the recording material, e.g. plastic material, OHP, ceramics, tiles, textiles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0517—Electrographic patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0522—Using an adhesive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Textile Engineering (AREA)
  • Printing Methods (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Ink Jet (AREA)
  • Decoration By Transfer Pictures (AREA)
  • Ink Jet Recording Methods And Recording Media Thereof (AREA)
  • Laminated Bodies (AREA)
IN3284DEN2015 2012-10-31 2012-10-31 IN2015DN03284A (enrdf_load_html_response)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2012/071638 WO2014067578A1 (en) 2012-10-31 2012-10-31 Method and apparatus for forming on a substrate a pattern of a material

Publications (1)

Publication Number Publication Date
IN2015DN03284A true IN2015DN03284A (enrdf_load_html_response) 2015-10-09

Family

ID=47115974

Family Applications (1)

Application Number Title Priority Date Filing Date
IN3284DEN2015 IN2015DN03284A (enrdf_load_html_response) 2012-10-31 2012-10-31

Country Status (6)

Country Link
US (2) US10588221B2 (enrdf_load_html_response)
EP (1) EP2915414B1 (enrdf_load_html_response)
CN (1) CN104854967B (enrdf_load_html_response)
BR (1) BR112015009655B1 (enrdf_load_html_response)
IN (1) IN2015DN03284A (enrdf_load_html_response)
WO (1) WO2014067578A1 (enrdf_load_html_response)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106576427A (zh) * 2014-08-13 2017-04-19 R.R.当纳利父子公司 生产电子器件的方法和设备
CN106575392B (zh) 2014-08-19 2021-01-26 克里奥瓦克有限公司 用于在运输过程中监视包裹的设备及方法
CN108136795B (zh) * 2015-08-20 2019-12-20 惠普深蓝有限责任公司 打印小平面
US9691303B2 (en) 2015-09-14 2017-06-27 R.R. Donnelley & Sons Company Electronic label having a timer function
BR112018003561A2 (pt) 2015-10-23 2018-09-25 Hp Indigo Bv impressão por transferência de calor
US10562268B2 (en) 2015-10-23 2020-02-18 Hp Indigo B.V. Laminates
US10759145B2 (en) 2015-10-23 2020-09-01 Hp Indigo B.V. Laminates
US10274871B2 (en) * 2015-10-28 2019-04-30 Hp Indigo B.V. Electrophotographic printing
US10379072B2 (en) 2016-01-04 2019-08-13 Cryovac, Llc Multiple detector apparatus and method for monitoring an environment
US9785881B2 (en) 2016-02-15 2017-10-10 R.R. Donnelley & Sons Company System and method for producing an electronic device
AU2019200607B2 (en) * 2016-07-28 2019-10-10 Lumet Technologies Ltd. Apparatus for application of a conductive pattern to a substrate
GB201613051D0 (en) 2016-07-28 2016-09-14 Landa Labs (2012) Ltd Applying an electrical conductor to a substrate
US10342136B2 (en) 2016-09-23 2019-07-02 R.R. Donnelley & Sons Company Monitoring device
US10445692B2 (en) 2017-03-06 2019-10-15 Cryovac, Llc Monitoring device and method of operating a monitoring device to transmit data
EP3636052A4 (en) 2017-05-31 2021-02-24 Cryovac, LLC ELECTRONIC DEVICE, METHOD AND EQUIPMENT FOR MANUFACTURING AN ELECTRONIC DEVICE AND COMPOSITION THEREFORE
US10682837B2 (en) 2017-06-09 2020-06-16 The Proctor & Gamble Company Method and compositions for applying a material onto articles
US20220302339A1 (en) * 2021-03-16 2022-09-22 Applied Materials, Inc. Led transfer materials and processes
US20250037900A1 (en) 2023-07-26 2025-01-30 Eastman Kodak Company Article with electrically-conductive pattern
WO2025024144A1 (en) 2023-07-26 2025-01-30 Eastman Kodak Company Articles with electrically-conductive pattern and methods of making

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4775439A (en) * 1983-07-25 1988-10-04 Amoco Corporation Method of making high metal content circuit patterns on plastic boards
IL73386A0 (en) * 1984-01-09 1985-01-31 Stauffer Chemical Co Transfer laminate and method of forming an electrical circuit pattern therewith
US5045141A (en) * 1988-07-01 1991-09-03 Amoco Corporation Method of making solderable printed circuits formed without plating
US5591290A (en) 1995-01-23 1997-01-07 Wallace Computer Services, Inc. Method of making a laminate having variable adhesive properties
US5676787A (en) 1995-06-07 1997-10-14 Borden Decorative Products, Inc. Method for making repositionable wall covering and intermediate for same
US6207268B1 (en) * 1996-11-12 2001-03-27 Dai Nippon Printing Co., Ltd. Transfer sheet, and pattern-forming method
EP1051885A1 (en) * 1998-02-06 2000-11-15 FLEXcon Company, Inc. Thin film transferable electric components
US20060159838A1 (en) * 2005-01-14 2006-07-20 Cabot Corporation Controlling ink migration during the formation of printable electronic features
US7364769B2 (en) * 2003-05-13 2008-04-29 Ricoh Company, Ltd. Apparatus and method for formation of a wiring pattern on a substrate, and electronic devices and producing methods thereof
US7560215B2 (en) * 2004-10-04 2009-07-14 Hewlett-Packard Development Company, L.P. Printed circuit board printing system and method using liquid electrophotographic printing
JP4580830B2 (ja) 2005-07-08 2010-11-17 株式会社日立製作所 画像形成方法及びそれを用いた画像形成装置
JP4730232B2 (ja) * 2006-07-05 2011-07-20 株式会社日立製作所 基板への導電パターン形成装置および導電パターン形成方法
JP2009028943A (ja) 2007-07-25 2009-02-12 Hideo Hamada 転写印刷シート
US8417171B2 (en) * 2008-10-24 2013-04-09 Eastman Kodak Company Method and apparatus for printing embossed reflective images
CN101420064A (zh) * 2008-12-08 2009-04-29 宗小林 一种射频识别标签天线的制备方法
JP5546943B2 (ja) * 2010-05-12 2014-07-09 株式会社アフィット 回路基板の製造方法
CN102452239A (zh) 2010-10-22 2012-05-16 韩国科学技术院 图案转印方法和图案转印装置以及利用该方法制造的产品

Also Published As

Publication number Publication date
EP2915414A1 (en) 2015-09-09
CN104854967B (zh) 2018-05-22
WO2014067578A1 (en) 2014-05-08
US20200163222A1 (en) 2020-05-21
US20150351250A1 (en) 2015-12-03
US10588221B2 (en) 2020-03-10
BR112015009655B1 (pt) 2020-12-29
US11206738B2 (en) 2021-12-21
BR112015009655A2 (pt) 2017-07-04
EP2915414B1 (en) 2020-10-07
CN104854967A (zh) 2015-08-19

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