IN2014MN02200A - - Google Patents

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Publication number
IN2014MN02200A
IN2014MN02200A IN2200MUN2014A IN2014MN02200A IN 2014MN02200 A IN2014MN02200 A IN 2014MN02200A IN 2200MUN2014 A IN2200MUN2014 A IN 2200MUN2014A IN 2014MN02200 A IN2014MN02200 A IN 2014MN02200A
Authority
IN
India
Prior art keywords
connectors
bay
connector
conversion unit
power conversion
Prior art date
Application number
Other languages
English (en)
Inventor
Franklin B Jones
Stuart A Jones
Andrew I Nehring
Daniel Jones
Original Assignee
Moog Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Moog Inc filed Critical Moog Inc
Publication of IN2014MN02200A publication Critical patent/IN2014MN02200A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters
    • H05K7/14325—Housings specially adapted for power drive units or power converters for cabinets or racks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters
    • H05K7/14339—Housings specially adapted for power drive units or power converters specially adapted for high voltage operation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
    • H05K7/1452—Mounting of connectors; Switching; Reinforcing of back panels
    • H05K7/1454—Alignment mechanisms; Drawout cases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Inverter Devices (AREA)
  • Dc-Dc Converters (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
IN2200MUN2014 2012-05-30 2013-05-29 IN2014MN02200A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261653141P 2012-05-30 2012-05-30
PCT/US2013/043049 WO2013181214A1 (en) 2012-05-30 2013-05-29 Power management systems

Publications (1)

Publication Number Publication Date
IN2014MN02200A true IN2014MN02200A (ko) 2015-09-11

Family

ID=49669998

Family Applications (1)

Application Number Title Priority Date Filing Date
IN2200MUN2014 IN2014MN02200A (ko) 2012-05-30 2013-05-29

Country Status (6)

Country Link
US (1) US9357668B2 (ko)
EP (1) EP2856569A4 (ko)
JP (1) JP2015525553A (ko)
CA (1) CA2874245C (ko)
IN (1) IN2014MN02200A (ko)
WO (1) WO2013181214A1 (ko)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8760872B2 (en) * 2011-09-28 2014-06-24 Texas Instruments Incorporated DC-DC converter vertically integrated with load inductor structured as heat sink
JPWO2014073524A1 (ja) * 2012-11-06 2016-09-08 Ｎｅｃエンジニアリング株式会社 電池シェルフアセンブリ、蓄電システム、および電池シェルフアセンブリの組立方法
WO2014073544A1 (ja) * 2012-11-06 2014-05-15 Ｎｅｃエンジニアリング株式会社 ラック構造、蓄電システム、およびラック構造の組立方法
CA2920300C (en) * 2013-08-27 2021-05-04 Labinal, Llc Power module
US9795048B2 (en) * 2013-09-19 2017-10-17 Gridco Inc. Modular, scalable, multi-function, power quality system for utility networks
KR101572560B1 (ko) 2013-12-26 2015-12-11 주식회사 효성 초고압 직류 송전시스템의 모듈장치
WO2015187500A1 (en) * 2014-06-02 2015-12-10 Enphase Energy, Inc. Ungrounded inverter enclosure and cabling
DE102014215537A1 (de) * 2014-08-06 2016-02-11 Siemens Aktiengesellschaft Getakteter Energiewandler
US9351428B2 (en) 2014-08-29 2016-05-24 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Blind docking apparatus to enable liquid cooling in compute nodes
WO2016069010A1 (en) * 2014-10-31 2016-05-06 Hewlett Packard Enterprise Development Lp Adaptive cooling assembly
TWI645656B (zh) * 2014-12-08 2018-12-21 美商強生控制科技公司 可變速驅動器系統及冷卻系統
US9454189B1 (en) * 2015-04-16 2016-09-27 Quanta Computer Inc. Systems and methods for distributing power in a server system
DE102015115140B4 (de) * 2015-09-09 2023-12-21 Infineon Technologies Ag Stromrichteranordnung mit verbesserter Befestigung
US9781867B2 (en) * 2016-02-19 2017-10-03 Ford Global Technologies, Llc Power module assembly for a vehicle power inverter
JP6511412B2 (ja) * 2016-03-30 2019-05-15 株式会社日立製作所 電力変換装置
WO2018001477A1 (de) * 2016-06-29 2018-01-04 Siemens Aktiengesellschaft Stromrichter
US10334756B1 (en) 2018-02-28 2019-06-25 Toyota Motor Engineering & Manufacturing North America, Inc. Manifold structures having an integrated fluid channel system and assemblies comprising the same
DE102018105173B3 (de) * 2018-03-07 2019-06-19 Framatome Gmbh Modular aufgebaute Einschubwandlereinheit sowie Leittechnikstromversorgungssystem für ein Kernkraftwerk
CN109659722B (zh) 2018-07-27 2021-02-05 中航光电科技股份有限公司 一种连接器组件
US10447170B1 (en) * 2018-11-09 2019-10-15 Sf Motors, Inc. Inverter module for drivetrain of an electric vehicle
US11706896B2 (en) * 2019-04-22 2023-07-18 Transportation Ip Holdings, Llc Modular rack system and method
AT523006B1 (de) * 2019-10-02 2022-05-15 Dynell Gmbh Bodenstromaggregat für das Bereitstellen von elektrischer Energie für Fluggeräte
JP6965461B1 (ja) * 2020-04-23 2021-11-10 東芝三菱電機産業システム株式会社 電力変換装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6307742B1 (en) 2000-04-19 2001-10-23 Hewlett-Packard Company Computer with readily accessible motherboard
JP4105121B2 (ja) 2004-05-14 2008-06-25 富士通株式会社 電子機器の筐体構造、及びディスクアレイ装置
JP4887739B2 (ja) * 2005-11-07 2012-02-29 株式会社明電舎 高圧インバータ装置
US7365973B2 (en) * 2006-01-19 2008-04-29 American Power Conversion Corporation Cooling system and method
EP1853098A3 (en) * 2006-05-03 2013-07-10 Parker-Hannifin Corporation Modular high-power drive stack system and method
US7499286B2 (en) 2006-08-31 2009-03-03 Hewlett-Packard Development Company, L.P. Mounting adapter for electronic modules
CN101246382B (zh) * 2007-02-14 2011-09-28 普安科技股份有限公司 可以容置不同尺寸硬盘的数据储存系统
EP2277365B1 (en) 2008-05-16 2011-11-02 Parker-Hannifin Corporation Modular high-power drive stack cooled with vaporizable dielectric fluid
JP2010051071A (ja) * 2008-08-20 2010-03-04 Tdk-Lambda Corp 無停電電源装置
DE112010002784B4 (de) * 2009-06-30 2024-02-08 Teco-Westinghouse Motor Company Steckbare energiezelle für einen inverter und bereitstellen einermodularen leistungswandlung
JP5475522B2 (ja) * 2010-03-30 2014-04-16 アイシン・エィ・ダブリュ株式会社 インバータ装置
US8760872B2 (en) * 2011-09-28 2014-06-24 Texas Instruments Incorporated DC-DC converter vertically integrated with load inductor structured as heat sink

Also Published As

Publication number Publication date
CA2874245A1 (en) 2013-12-05
EP2856569A1 (en) 2015-04-08
US20130322016A1 (en) 2013-12-05
EP2856569A4 (en) 2016-01-06
CA2874245C (en) 2017-01-03
US9357668B2 (en) 2016-05-31
JP2015525553A (ja) 2015-09-03
WO2013181214A1 (en) 2013-12-05

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