IN2014KN01462A - - Google Patents

Info

Publication number
IN2014KN01462A
IN2014KN01462A IN1462KON2014A IN2014KN01462A IN 2014KN01462 A IN2014KN01462 A IN 2014KN01462A IN 1462KON2014 A IN1462KON2014 A IN 1462KON2014A IN 2014KN01462 A IN2014KN01462 A IN 2014KN01462A
Authority
IN
India
Prior art keywords
module
recycling
apparatuses
solder removal
metals
Prior art date
Application number
Inventor
Tianniu Chen
Michael B Korzenski
Ping Jiang
Original Assignee
Advanced Tech Materials
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Tech Materials filed Critical Advanced Tech Materials
Publication of IN2014KN01462A publication Critical patent/IN2014KN01462A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/018—Unsoldering; Removal of melted solder or other residues
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C1/00—Electrolytic production, recovery or refining of metals by electrolysis of solutions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B17/00—Recovery of plastics or other constituents of waste material containing plastics
    • B29B17/02—Separating plastics from other materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
    • B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
    • B09B3/00—Destroying solid waste or transforming solid waste into something useful or harmless
    • B09B3/30—Destroying solid waste or transforming solid waste into something useful or harmless involving mechanical treatment
    • B09B3/35—Shredding, crushing or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
    • B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
    • B09B3/00—Destroying solid waste or transforming solid waste into something useful or harmless
    • B09B3/70—Chemical treatment, e.g. pH adjustment or oxidation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B1/00—Preliminary treatment of ores or scrap
    • C22B1/005—Preliminary treatment of scrap
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B11/00—Obtaining noble metals
    • C22B11/04—Obtaining noble metals by wet processes
    • C22B11/042—Recovery of noble metals from waste materials
    • C22B11/046—Recovery of noble metals from waste materials from manufactured products, e.g. from printed circuit boards, from photographic films, paper or baths
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B3/00—Extraction of metal compounds from ores or concentrates by wet processes
    • C22B3/02—Apparatus therefor
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B3/00—Extraction of metal compounds from ores or concentrates by wet processes
    • C22B3/04—Extraction of metal compounds from ores or concentrates by wet processes by leaching
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B4/00—Electrothermal treatment of ores or metallurgical products for obtaining metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B7/00—Working up raw materials other than ores, e.g. scrap, to produce non-ferrous metals and compounds thereof; Methods of a general interest or applied to the winning of more than two metals
    • C22B7/006—Wet processes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/178—Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/20—Recycling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00—Technologies for solid waste management
    • Y02W30/50—Reuse, recycling or recovery technologies
    • Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Geology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Electrochemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Processing Of Solid Wastes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Apparatuses and processes for recycling printed wire boards, wherein electronic components, precious metals and base metals may be collected for reuse and recycling. The apparatuses generally include a mechanical solder removal module and/or a thermal module, a chemical solder removal module, and a precious metal leaching module, wherein the modules are attached for continuous passage of the e-waste from module to module.
IN1462KON2014 2011-12-15 2012-12-13 IN2014KN01462A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161576035P 2011-12-15 2011-12-15
US201261589583P 2012-01-23 2012-01-23
PCT/US2012/069404 WO2013090517A1 (en) 2011-12-15 2012-12-13 Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment

Publications (1)

Publication Number Publication Date
IN2014KN01462A true IN2014KN01462A (en) 2015-10-23

Family

ID=48613157

Family Applications (1)

Application Number Title Priority Date Filing Date
IN1462KON2014 IN2014KN01462A (en) 2011-12-15 2012-12-13

Country Status (12)

Country Link
US (4) US9221114B2 (en)
EP (1) EP2790845B1 (en)
JP (2) JP2014529500A (en)
KR (2) KR101699136B1 (en)
CN (2) CN106944452A (en)
AP (1) AP2014007781A0 (en)
BR (1) BR112014014495A8 (en)
ES (1) ES2619568T3 (en)
IN (1) IN2014KN01462A (en)
SG (2) SG11201403228RA (en)
TW (4) TW201544166A (en)
WO (1) WO2013090517A1 (en)

Families Citing this family (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2856196C (en) 2011-12-06 2020-09-01 Masco Corporation Of Indiana Ozone distribution in a faucet
ES2619568T3 (en) 2011-12-15 2017-06-26 Entegris Inc. Apparatus and method of extraction of welding metals during the recycling of electrical and electronic waste equipment
US9765288B2 (en) 2012-12-05 2017-09-19 Entegris, Inc. Compositions for cleaning III-V semiconductor materials and methods of using same
US20140217157A1 (en) * 2013-02-07 2014-08-07 Greene Lyon Group, Inc. Removal of electronic chips and other components from printed wire boards using liquid heat media
TWI471457B (en) * 2013-02-22 2015-02-01 Uwin Nanotech Co Ltd Metal stripping additive, composition containing the same, and method for stripping metal by using the composition
DE102013009586A1 (en) 2013-02-26 2014-08-28 Ulrich Loser Hydrometallurgical process for the recovery of lll-V, ll-Vl or l-lll-Vl2 compound semiconductor materials from high-tech or green-tech waste or electrical and electronic waste
WO2014138064A1 (en) 2013-03-04 2014-09-12 Advanced Technology Materials, Inc. Compositions and methods for selectively etching titanium nitride
KR20150142040A (en) * 2013-04-12 2015-12-21 로저, 울리히 Method for concentrating metals from scrap containing metal
KR102338550B1 (en) 2013-06-06 2021-12-14 엔테그리스, 아이엔씨. Compositions and methods for selectively etching titanium nitride
WO2015017659A1 (en) 2013-07-31 2015-02-05 Advanced Technology Materials, Inc. AQUEOUS FORMULATIONS FOR REMOVING METAL HARD MASK AND POST-ETCH RESIDUE WITH Cu/W COMPATIBILITY
US10057992B2 (en) * 2013-08-15 2018-08-21 Hitachi Metals, Ltd. Ceramic circuit substrate and its production method
SG11201601158VA (en) 2013-08-30 2016-03-30 Advanced Tech Materials Compositions and methods for selectively etching titanium nitride
US10340150B2 (en) 2013-12-16 2019-07-02 Entegris, Inc. Ni:NiGe:Ge selective etch formulations and method of using same
WO2015095726A1 (en) 2013-12-20 2015-06-25 Entegris, Inc. Use of non-oxidizing strong acids for the removal of ion-implanted resist
EP3083016B1 (en) 2013-12-20 2020-07-29 Greene Lyon Group Inc. Method and apparatus for recovery of noble metals, including recovery of noble metals from plated and/or filled scrap
US10475658B2 (en) 2013-12-31 2019-11-12 Entegris, Inc. Formulations to selectively etch silicon and germanium
WO2015116818A1 (en) 2014-01-29 2015-08-06 Advanced Technology Materials, Inc. Post chemical mechanical polishing formulations and method of use
WO2015119925A1 (en) 2014-02-05 2015-08-13 Advanced Technology Materials, Inc. Non-amine post-cmp compositions and method of use
CN103801554B (en) * 2014-03-07 2016-07-06 袁志刚 The method producing powder body material with waste electron wiring board
MX2016014770A (en) * 2014-05-12 2017-05-25 Summit Mining Int Inc SALMUERA LEADING PROCESS FOR THE RECOVERY OF VALUABLE METALS OF OXIDE MATERIALS.
TWI521097B (en) * 2014-06-25 2016-02-11 優勝奈米科技有限公司 Tin stripping additive and application thereof
WO2016022755A2 (en) 2014-08-06 2016-02-11 Greene Lyon Group, Inc. Rotational removal of electronic chips and other components from printed wire boards using liquid heat media
RU2610180C2 (en) * 2014-12-18 2017-02-08 Бочкарёва Ксения Ивановна Method of used electronic board processing and system to this end
FI20155187L (en) * 2015-03-18 2016-09-19 Outotec Finland Oy Gold recovery from solution
US11427886B2 (en) 2015-04-21 2022-08-30 Excir Works Corp. Methods for simultaneous leaching and extraction of precious metals
US11136681B2 (en) 2015-06-24 2021-10-05 Greene Lyon Group, Inc. Selective removal of noble metals using acidic fluids, including fluids containing nitrate ions
WO2017037625A1 (en) * 2015-09-02 2017-03-09 Attero Recycling Pvt. Ltd. A method and process of recovering metal values from waste monolithic ceramic capacitors
US11458214B2 (en) 2015-12-21 2022-10-04 Delta Faucet Company Fluid delivery system including a disinfectant device
US10563283B2 (en) * 2016-06-24 2020-02-18 Enviroleach Technologies Inc. Methods, materials and techniques for precious metal recovery
US10526682B2 (en) 2017-07-17 2020-01-07 Enviroleach Technologies Inc. Methods, materials and techniques for precious metal recovery
KR102045824B1 (en) * 2017-11-02 2019-11-18 주식회사 라온솔루션 Method of display driver chip rework and display driver chip auto rework device
KR20190058758A (en) * 2017-11-21 2019-05-30 삼성디스플레이 주식회사 Etchant and manufacturing method of display device using the same
WO2019107429A1 (en) * 2017-11-28 2019-06-06 京セラ株式会社 Metal recovery agent, metal recovery liquid, metal compound recovery method, and metal recovery method
CN108160672A (en) * 2017-12-25 2018-06-15 武汉大学 A kind of method of the dismounting of MEMS for recycling of classifying
US11330746B2 (en) * 2018-02-28 2022-05-10 Raytheon Company Device and method for reworking flip chip components
CN109609783B (en) * 2018-12-22 2020-11-10 励福(江门)环保科技股份有限公司 Method for efficiently separating and purifying palladium and rhodium from alloy sheet containing palladium and rhodium alloy
JP7268382B2 (en) * 2019-02-09 2023-05-08 三菱マテリアル株式会社 How to dispose of used lithium-ion batteries
FI129381B (en) * 2019-02-12 2022-01-14 Tero Rinne Method and device for metal recovery by dissolution
FI132159B1 (en) 2019-08-12 2026-08-03 Neoalloys Oy Method and device for disassembling electronics
US12012642B2 (en) 2019-08-15 2024-06-18 Battelle Energy Alliance, Llc Methods of selectively recovering palladium from a palladium-containing material
JP7430871B2 (en) * 2019-08-16 2024-02-14 国立大学法人京都大学 How to separate tin from tin-containing materials
US11666955B2 (en) 2019-09-04 2023-06-06 Jabil Inc. System and method for obtaining mineral rich powder from electronic waste
CN110883396A (en) * 2019-11-15 2020-03-17 西安居正知识产权运营管理有限公司 Printed circuit board desoldering separation method
CN111074078A (en) * 2019-12-23 2020-04-28 贵州正业工程技术投资有限公司 A kind of method of alkaline thiourea leaching Carlin type gold ore
JP6742049B1 (en) * 2020-06-10 2020-08-19 エー・アンド・エイチ・ジャパン株式会社 How to collect valuables
CN111826691B (en) * 2020-08-21 2021-09-21 东北大学 Method for preparing zinc-tantalum alloy by using solvated ionic liquid
AU2021390415A1 (en) * 2020-12-01 2023-07-13 Singapore Polytechnic Method for high and selective extraction of silver
JP2024507883A (en) * 2021-02-18 2024-02-21 インテグレーテッド リサイクリング テクノロジーズ コーポレーション Chemical separation of waste printed circuit boards
CN119013768A (en) * 2022-03-10 2024-11-22 富士胶片电子材料美国有限公司 Etching composition
WO2023212815A1 (en) * 2022-05-04 2023-11-09 Seneca Experts-Conseils Inc. Process for extraction of common and precious metals from wasted circuit boards
US20230374380A1 (en) * 2022-05-17 2023-11-23 Lexmark International, Inc. Environmentally friendly process to optimize copper dissolution and recover copper and gold from electronic waste
KR102789889B1 (en) * 2022-07-29 2025-04-01 오민규 Pyrolysis device for film removal of aluminum pouch
WO2024148229A2 (en) * 2023-01-05 2024-07-11 Harcros Chemicals, Inc. Mist reducing agents for electrowinning electrolyte solutions
JP2025028546A (en) * 2023-08-18 2025-03-03 Eeja株式会社 Non-cyanide gold electrolytic stripper and gold electrolytic stripping method
WO2026126687A1 (en) * 2024-12-09 2026-06-18 株式会社合同資源 Etching solution for metal, method for producing etching solution for metal, and raw material set of etching solution for metal

Family Cites Families (220)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US873583A (en) 1906-12-08 1907-12-10 Charlie M Nichols Polishing-machine.
US1362381A (en) * 1919-08-16 1920-12-14 Steel Works Appliances Company Detinning
US1527076A (en) * 1922-03-02 1925-02-17 Wilbur H Peck Means and apparatus for centrifugal concentration and separation of mixed minerals, metals, etc.
GB299454A (en) * 1927-10-28 1929-01-17 Krupp Ag Improvements in and relating to centrifugal separator drums
US1826755A (en) * 1928-11-16 1931-10-13 Us Metals Refining Company Apparatus for recovering easily-fusible metals
US1861878A (en) * 1928-12-06 1932-06-07 Francisco A Quiroz Separating apparatus
US1858669A (en) * 1930-01-14 1932-05-17 African Tin Recovery Company L Recovery of tin from scrap tinned plate and like tin-carrying material
US2233213A (en) * 1938-11-18 1941-02-25 Laucks I F Inc Fiber-free proteinous adhesive from seed materials
US2704707A (en) * 1954-02-18 1955-03-22 Rca Corp Method of salvaging brazed assemblies
NL106024C (en) 1958-03-26
US3399090A (en) 1965-04-28 1968-08-27 Fmc Corp Process of etching metal with ammonium persulfate with recovery and recycling
US3498303A (en) * 1966-03-17 1970-03-03 Hewlett Packard Co Apparatus for washing and drying printed circuit boards
NL6814635A (en) 1968-10-12 1970-04-14
US3625763A (en) * 1968-12-04 1971-12-07 Bunker Ramo Conformal coating stripping method and composition
US3644155A (en) * 1969-05-01 1972-02-22 Fmc Corp Cleaning and brightening of lead-tin alloy-resisted circuit boards
US3947351A (en) 1971-12-22 1976-03-30 Asahi Glass Company, Ltd. Acid diffusion-dialysis process utilizing anion exchange membrane of 4-55 micron thickness
US3866893A (en) * 1974-02-05 1975-02-18 Richard Hoberman Apparatus for desoldering scrap radiator cores and recovering separated metals
US3984090A (en) * 1974-04-02 1976-10-05 Leopold I. Cohen, Jr. Metal recovery method
US3935125A (en) 1974-06-25 1976-01-27 Chemed Corporation Method and composition for inhibiting corrosion in aqueous systems
US3957505A (en) 1974-08-05 1976-05-18 Bayside Refining And Chemical Company Gold reclamation process
US3953265A (en) * 1975-04-28 1976-04-27 International Business Machines Corporation Meniscus-contained method of handling fluids in the manufacture of semiconductor wafers
US4021278A (en) 1975-12-12 1977-05-03 International Business Machines Corporation Reduced meniscus-contained method of handling fluids in the manufacture of semiconductor wafers
CA1073681A (en) 1976-02-20 1980-03-18 Roman M. Genik-Sas-Berezowsky Recovery of precious metals from metal sulphides
GB1602376A (en) * 1977-06-09 1981-11-11 Encomech Eng Services Ltd Material separation
US4315042A (en) * 1978-07-14 1982-02-09 Hybrid Technology Corporation Solder removal technique
US4270260A (en) * 1978-10-10 1981-06-02 Krueger Ellison F Method for the salvage and restoration of integrated circuits from a substrate
US4344923A (en) * 1978-10-21 1982-08-17 Interox Chemicals Limited In-situ leaching
US4261738A (en) 1979-10-01 1981-04-14 Arthur D. Little, Inc. Process for recovering precious metals from bimetallic material
US4269622A (en) 1979-12-28 1981-05-26 Kerley Jr Bernard J Recovery of precious metals from difficult ores
US4369061A (en) 1979-12-28 1983-01-18 Kerley Jr Bernard J Recovery of precious metals from difficult ores
US4401522A (en) * 1980-09-29 1983-08-30 Micro-Plate, Inc. Plating method and apparatus
US4462879A (en) * 1981-02-24 1984-07-31 Mar Industries, Inc. Gold recovery process
JPS57164984A (en) 1981-04-06 1982-10-09 Metsuku Kk Exfoliating solution for tin or tin alloy
EP0062692B1 (en) * 1981-04-15 1986-12-30 Siemens-Albis Aktiengesellschaft Method and apparatus for the removal of solder from drilled holes of non furnished printed-circuit boards clad with solder
US4426251A (en) 1982-09-29 1984-01-17 Storage Technology Corporation Portable gold recovery apparatus and method for using same
US4426225A (en) 1982-09-29 1984-01-17 Storage Technology Corporation Gold recovery method
CA1217060A (en) * 1982-11-11 1987-01-27 John R.H. Shaw Metals recovery
EP0124213A1 (en) 1983-02-25 1984-11-07 Hydromet Mineral (Uk) Limited Extraction process
US4437928A (en) 1983-08-22 1984-03-20 Dart Industries Inc. Dissolution of metals utilizing a glycol ether
US4541358A (en) * 1983-11-28 1985-09-17 The Htc Corporation Method and apparatus for solder removal
GB8418481D0 (en) * 1984-07-19 1984-08-22 Nl Petroleum Prod Rotary drill bits
US4662938A (en) * 1984-10-11 1987-05-05 Whitney John W Recovery of silver and gold
US4661180A (en) * 1985-03-25 1987-04-28 Gte Valeron Corporation Method of making diamond tool
US4654078A (en) 1985-07-12 1987-03-31 Perez Ariel E Method for recovery of precious metals from difficult ores with copper-ammonium thiosulfate
US4637865A (en) 1985-08-16 1987-01-20 Great Lakes Chemical Corporation Process for metal recovery and compositions useful therein
US4668289A (en) 1985-11-22 1987-05-26 Wisconsin Alumni Research Foundation Method for reclaiming gold
GB8609340D0 (en) 1986-04-16 1986-05-21 Imperial College Metal recovery
US4678552A (en) 1986-04-22 1987-07-07 Pennwalt Corporation Selective electrolytic stripping of metal coatings from base metal substrates
US4799616A (en) * 1986-06-11 1989-01-24 International Business Machines Corporation Solder leveling method and apparatus
US4713144A (en) 1986-08-01 1987-12-15 Ardrox Inc. Composition and method for stripping films from printed circuit boards
US4938257A (en) * 1986-11-21 1990-07-03 Teledyne Industries, Inc. Printed circuit cleaning apparatus
US5279803A (en) 1987-01-20 1994-01-18 Ensci, Inc. Precious metal recovery process from carbonaceous ores
US4855572A (en) * 1987-01-23 1989-08-08 Pace Incorporated Heater for use as either primary or auxiliary heat source and improved circuitry for controlling the heater
JPS63215372A (en) * 1987-03-04 1988-09-07 Toshiba Corp Method for refining solder
CA1306613C (en) 1987-05-15 1992-08-25 Guy Deschenes Recovery of gold from aqueous solutions
US5137700A (en) 1987-07-02 1992-08-11 Nelson H. Shapiro Processes employing iodine-iodide etching solutions
PL158889B1 (en) 1989-03-15 1992-10-30 Method for recovering gold and nickel from electronic scrap and waste
US4957653A (en) 1989-04-07 1990-09-18 Macdermid, Incorporated Composition containing alkane sulfonic acid and ferric nitrate for stripping tin or tin-lead alloy from copper surfaces, and method for stripping tin or tin-lead alloy
JP2739495B2 (en) * 1989-05-12 1998-04-15 日鉱金属株式会社 Purification method of gold-containing iodine leached precious liquid
US4944851A (en) * 1989-06-05 1990-07-31 Macdermid, Incorporated Electrolytic method for regenerating tin or tin-lead alloy stripping compositions
JPH0331494A (en) 1989-06-29 1991-02-12 Tokuriki Honten Co Ltd Method and device for recovering metal
US4921571A (en) 1989-07-28 1990-05-01 Macdermid, Incorporated Inhibited composition and method for stripping tin, lead or tin-lead alloy from copper surfaces
JPH0375386A (en) 1989-08-18 1991-03-29 Metsuku Kk Method for peeling tin or tin-lead alloy
CA2013537A1 (en) * 1990-03-30 1991-09-30 Farouk T. Awadalla Recovery of gold from solution by reduction-precipitation with stabilized alkali metal borohydride
US5017267A (en) 1990-07-17 1991-05-21 Macdermid, Incorporated Composition and method for stripping tin or tin-lead alloy from copper surfaces
JPH0575222A (en) 1991-09-12 1993-03-26 Matsushita Electric Ind Co Ltd Electric circuit printed wiring board and its discrimination control method and formation of mark on printed wiring board
US5366522A (en) * 1991-11-07 1994-11-22 Sumitomo Electric Industries, Ltd. Polycrystalline diamond cutting tool and method of manufacturing the same
JPH05140769A (en) 1991-11-15 1993-06-08 Sumitomo Electric Ind Ltd Polycrystalline diamond tool material and method of joining it to the tool base material
US5217171A (en) 1991-12-06 1993-06-08 F&T Technology Corporation Method for processing scrap of electronic instruments
US5190578A (en) 1991-12-09 1993-03-02 F & T Technology Corporation Method for hydrometallurgical processing of friable concentration products
US5244539A (en) 1992-01-27 1993-09-14 Ardrox, Inc. Composition and method for stripping films from printed circuit boards
US5234542A (en) * 1992-03-04 1993-08-10 Macdermid, Incorporated Composition and process for stripping tin from copper surfaces
US5221421A (en) * 1992-03-25 1993-06-22 Hewlett-Packard Company Controlled etching process for forming fine-geometry circuit lines on a substrate
JP2714520B2 (en) 1992-08-28 1998-02-16 株式会社日立製作所 Mounting component mounting / dismounting device
DE4241412C2 (en) * 1992-12-09 1994-10-06 F E S Used Electronics Elektro System for the simultaneous removal of surface-mounted components
FR2705102B1 (en) 1993-05-12 1995-08-11 Rhone Poulenc Chimie PROCESS FOR TREATING COMPOSITIONS CONTAINING PRECIOUS METALS AND OTHER VALUABLE ELEMENTS FOR THEIR RECOVERY.
JP2666876B2 (en) 1993-06-18 1997-10-22 工業技術院長 Gold refining method
US5348588A (en) * 1993-06-29 1994-09-20 Church & Dwight Co., Inc. Evaporative treatment of inorganic saponifier wash water
GB9405418D0 (en) * 1994-03-18 1994-05-04 Apple House Electronics Ltd Solder recovery
US5405430A (en) 1994-04-12 1995-04-11 Groves; William D. Recovery of precious metals from evaporite sediments
KR0145346B1 (en) 1994-06-10 1998-08-17 케네스 앤. 한 How to extract precious metals from minerals or other precious metal-containing substances using halogen salts
JP3444557B2 (en) * 1994-06-15 2003-09-08 千住金属工業株式会社 Method and apparatus for collecting solder
US5458281A (en) * 1994-06-30 1995-10-17 International Business Machines Corporation Method for removing meltable material from a substrate
US5520205A (en) * 1994-07-01 1996-05-28 Texas Instruments Incorporated Apparatus for wafer cleaning with rotation
US5672212A (en) * 1994-07-01 1997-09-30 Texas Instruments Incorporated Rotational megasonic cleaner/etcher for wafers
US5552579A (en) 1994-07-11 1996-09-03 Krueger; Ellison System for salvage and restoration on electrical components from a substrate
US5715592A (en) 1994-11-08 1998-02-10 Nec Corporation Parts disassembling apparatus
JP2755225B2 (en) * 1995-02-10 1998-05-20 日本電気株式会社 Separation and disassembly of printed wiring boards with components
US5542957A (en) * 1995-01-27 1996-08-06 South Dakota School Of Mines And Technology Recovery of platinum group metals and rhenium from materials using halogen reagents
US5512201A (en) 1995-02-13 1996-04-30 Applied Chemical Technologies, Inc. Solder and tin stripper composition
US5630554A (en) 1995-02-21 1997-05-20 Dowa Mining Co., Ltd. Method of separating and recovering valuable metals and non-metals from composite materials
US5520794A (en) 1995-05-15 1996-05-28 Elf Atochem North America, Inc. Electrowinning of lead
DE19518277C1 (en) 1995-05-18 1996-05-23 Daimler Benz Ag Process for processing scrap from assembled printed circuit boards from electrical or electronic devices
US5505872A (en) * 1995-05-23 1996-04-09 Applied Electroless Concepts, Inc. Solder stripper recycle and reuse
US5755950A (en) 1995-06-07 1998-05-26 Dulin Metals Company Process for removing plating materials from copper-based substrates
US5911907A (en) 1995-08-30 1999-06-15 Surface Tek Specialty Products, Inc. Composition and method for stripping tin and tin-lead from copper surfaces
US6276589B1 (en) * 1995-09-25 2001-08-21 Speedline Technologies, Inc. Jet soldering system and method
US5707585A (en) * 1996-02-05 1998-01-13 Aea Technology Plc Liquid metal pump and apparatus for use in cleaning and recycling solder
JPH09217133A (en) 1996-02-13 1997-08-19 Santoku Kinzoku Kogyo Kk Method for recovering useful elements from rare earth-nickel alloys
JP3243412B2 (en) * 1996-05-29 2002-01-07 千住金属工業株式会社 Printed circuit board desoldering method, desoldering apparatus and carrier
US5735450A (en) 1996-06-21 1998-04-07 International Business Machines Corporation Apparatus and method for heating a board-mounted electrical module for rework
JPH1017948A (en) * 1996-06-27 1998-01-20 Senju Metal Ind Co Ltd Method and device for removing solder from printed circuit board
US5938956A (en) 1996-09-10 1999-08-17 Micron Technology, Inc. Circuit and method for heating an adhesive to package or rework a semiconductor die
JPH10183264A (en) 1996-12-19 1998-07-14 Matsushita Electric Ind Co Ltd Method for recovering copper from glass epoxy substrate
JP3544834B2 (en) 1997-03-17 2004-07-21 株式会社東芝 Mixed waste treatment equipment
DE19715319C2 (en) 1997-04-04 2001-03-01 Werner Fabian Three-stage hydrometallurgical process for the metal separation of electronic waste, in particular from printed circuit boards and metal-containing plastic residues
US5901898A (en) * 1997-05-14 1999-05-11 Easy-Braid Company System for removing solder
JPH1126918A (en) * 1997-07-01 1999-01-29 Matsushita Electric Ind Co Ltd Circuit board processing method and recycling method
JPH1176980A (en) 1997-09-10 1999-03-23 Hitachi Ltd Printed circuit board processing method
US6258294B1 (en) 1997-10-01 2001-07-10 Morton International, Inc. Composition for stripping solder and tin from printed circuit boards
DE19803692C2 (en) 1998-01-30 2001-02-08 Tobias Marschner Process for recycling old boards and composite board produced with them
DE69922069T2 (en) * 1998-02-27 2006-03-02 Matsushita Electric Industrial Co., Ltd., Kadoma Soldering apparatus and method of debranching the solder material from oxide soldering
US6083848A (en) * 1998-03-31 2000-07-04 Lsi Logic Corporation Removing solder from integrated circuits for failure analysis
GB2336122A (en) * 1998-04-08 1999-10-13 Ibm Reworking of a ball grid array module
US5979033A (en) * 1998-05-05 1999-11-09 Cleanevi' Engineering Consultant Co., Ltd. Method of recycling waste printed circuit boards
JP3003684B1 (en) * 1998-09-07 2000-01-31 日本電気株式会社 Substrate cleaning method and substrate cleaning liquid
EP1008395A3 (en) 1998-12-11 2003-05-02 Matsushita Electric Industrial Co., Ltd. Method for separating metallic material from waste printed circuit boards, and dry distilation apparatus used for waste treatment
GB9901586D0 (en) 1999-01-25 1999-03-17 Alpha Fry Ltd Process for the recovery of lead and/or tin or alloys thereof from substrate surfaces
JP4344053B2 (en) * 1999-11-19 2009-10-14 千住金属工業株式会社 Printed circuit board solder removal equipment
AU2001295097A1 (en) 2000-08-29 2002-03-13 Sasol Technology (Pty) Ltd. Selective recovery of aluminium, cobalt and platinum values from a spent catalyst composition
KR100382848B1 (en) 2000-09-21 2003-05-09 씨티 리싸이클링 주식회사 Effective recovery of valuable metals from wasted metal tailings, wasted printed circuit boards or low-graded metal stones
US6271048B1 (en) 2000-10-20 2001-08-07 Unisys Corporation Process for recycling a substrate from an integrated circuit package
US6638363B2 (en) * 2000-11-22 2003-10-28 Gunter Erdmann Method of cleaning solder paste
US6666370B2 (en) * 2002-01-18 2003-12-23 Speedline Technologies, Inc. Solder-dross mixture separation method and apparatus
US6948650B2 (en) * 2001-01-12 2005-09-27 Speedline Technologies, Inc. Dross removal and solder reclamation improvements
JP2002233856A (en) 2001-02-06 2002-08-20 Narifumi Uemura Method and apparatus for separating metals from printed circuit board
US6592680B2 (en) * 2001-03-22 2003-07-15 Agilent Technologies, Inc. Integrated circuit assembly cleaning apparatus and method
WO2002101102A1 (en) * 2001-04-24 2002-12-19 Corus Aluminium Voerde Gmbh Method of recycling metallic coated scrap pieces
US20020162579A1 (en) * 2001-05-02 2002-11-07 Taiwan Semiconductor Manufacturing Co., Ltd. Wet stripping apparatus and method of using
US6719892B2 (en) * 2001-05-04 2004-04-13 United Technologies Corporation Selective removal of brazing compound from joined assemblies
US6497357B2 (en) * 2001-05-07 2002-12-24 International Business Machines Corporation Apparatus and method for removing interconnections
AUPR552601A0 (en) * 2001-06-07 2001-07-12 Unisearch Limited Selective recovery of precious metal(s)
JP3662522B2 (en) 2001-06-26 2005-06-22 独立行政法人科学技術振興機構 Mixed solvent for Cu extraction
KR100421937B1 (en) 2001-07-16 2004-03-12 오치정 Method for recovering high-value metals from waste printed circuit boards
US6686202B2 (en) 2001-08-08 2004-02-03 Placer Dome, Inc. Methods for detecting and extracting gold
EP1302569A3 (en) 2001-10-11 2004-03-03 Shipley Co. L.L.C. Stripping solution
US7772043B2 (en) * 2001-12-12 2010-08-10 Sanyo Electric Co., Ltd. Plating apparatus, plating method and manufacturing method for semiconductor device
JP3979464B2 (en) * 2001-12-27 2007-09-19 株式会社荏原製作所 Electroless plating pretreatment apparatus and method
CN1385383A (en) * 2002-06-20 2002-12-18 上海交通大学 Biological harmless pretreating method for waste computer
US20040011850A1 (en) * 2002-07-22 2004-01-22 Bayot Arthur Allan Centrifugal apparatus for removing excess solder
US7067090B2 (en) 2002-10-25 2006-06-27 South Dakota School Of Mines And Technology Recovery of platinum group metals
US6986192B2 (en) 2002-12-02 2006-01-17 Fitch Michael K Method for reclamation of precious metals from circuit board scrap
US6716290B1 (en) * 2002-12-04 2004-04-06 The United States Of America As Represented By The Secretary Of The Navy Method for removing soldering flux residue from a substrate
TWI250180B (en) 2003-01-30 2006-03-01 Hsieh-Sen Wu Treatment method of waste containing brominated epoxy resin and glass fiber and it apparatus
US20040155096A1 (en) * 2003-02-07 2004-08-12 General Electric Company Diamond tool inserts pre-fixed with braze alloys and methods to manufacture thereof
ITMI20030468A1 (en) 2003-03-12 2004-09-13 Engitec S R L PROCESS FOR RECOVERING METALS IN PARTICULAR METALS
US20040181923A1 (en) 2003-03-17 2004-09-23 Dills James Carl Process for reusing and recycling circuit boards
US7000409B2 (en) * 2003-05-23 2006-02-21 Marit Jagtoyen Mazzetti Use of flow through capacitor in the recovery and purification of water from exhaust gases of internal combustion engines
US7473406B2 (en) 2003-05-30 2009-01-06 Council Of Scientific And Industrial Research Process for recovery of palladium from spent catalyst
TW200510570A (en) * 2003-08-22 2005-03-16 Arch Spec Chem Inc Novel aqueous based metal etchant
US7267187B2 (en) * 2003-10-24 2007-09-11 Smith International, Inc. Braze alloy and method of use for drilling applications
US20050089440A1 (en) * 2003-10-24 2005-04-28 Kembaiyan Kumar T. Braze alloy
US7285229B2 (en) 2003-11-07 2007-10-23 Mec Company, Ltd. Etchant and replenishment solution therefor, and etching method and method for producing wiring board using the same
US7166145B1 (en) 2004-01-09 2007-01-23 South Dakota School Of Mines And Technology Recovery of precious metals
US7316062B2 (en) * 2004-05-27 2008-01-08 Honeywell International Inc. Solder extraction tool and method
US20050262967A1 (en) * 2004-05-27 2005-12-01 Alcoa Company Of America Method of recycling brazing sheet
SG136952A1 (en) 2004-06-15 2007-11-29 Close The Loop Technologies Pt A method of recycling mixed streams of ewaste (weee)
WO2006013568A2 (en) 2004-08-04 2006-02-09 Berg Recycling Industries Ltd. Recovery of precious metals from electronic scrap by hydrometallurgical processing
US7544610B2 (en) 2004-09-07 2009-06-09 International Business Machines Corporation Method and process for forming a self-aligned silicide contact
DE102005007743A1 (en) 2005-01-11 2006-07-20 Merck Patent Gmbh Printable medium for the etching of silicon dioxide and silicon nitride layers
WO2006113284A2 (en) 2005-04-13 2006-10-26 Metals Recovery Technology Inc. Process for recovering platinum group metals, rhenium and gold
US7703197B2 (en) 2005-07-01 2010-04-27 Moltion James R Process for depopulating a circuit board
CN100554454C (en) * 2005-08-04 2009-10-28 株式会社神钢环境舒立净 Method and device for recovering indium from waste liquid crystal displays
JP5095094B2 (en) 2005-09-29 2012-12-12 パナソニック株式会社 Method for recovering metal from circuit boards for electrical and electronic equipment
CN100540163C (en) 2005-11-17 2009-09-16 深圳市格林美高新技术股份有限公司 Metal Recycling Process for Automotive and Electronic Scrap
JP4763725B2 (en) * 2005-12-28 2011-08-31 富士通株式会社 Desoldering device and desoldering method
CN100592939C (en) 2006-01-20 2010-03-03 巫协森 Method for recycling waste printed circuit board
TWI268184B (en) 2006-01-20 2006-12-11 Hsieh-Sen Wu Recycling method for waste printed circuit board brominated epoxy resin and glass fiber in the resin are recycled and converted into raw material for industry
US7972413B2 (en) 2006-04-07 2011-07-05 Metal Asia International Ltd. Precious metal recovery from solution
US20070253179A1 (en) 2006-04-27 2007-11-01 Briggs Randall D Method and apparatus for removing surface mount device from printed circuit board
US7618891B2 (en) 2006-05-01 2009-11-17 International Business Machines Corporation Method for forming self-aligned metal silicide contacts
CN1858277A (en) 2006-05-25 2006-11-08 东华大学 Method for extracting metal from printed circuit board
FR2907352B1 (en) 2006-10-20 2009-02-20 Terra Nova PROCESS FOR PROCESSING WASTE CONTAINING PRECIOUS METALS AND DEVICE FOR CARRYING OUT SAID METHOD
US20080206960A1 (en) 2007-02-27 2008-08-28 International Business Machines Corporation Reworkable chip stack
US8814980B2 (en) 2007-05-03 2014-08-26 Drinkard Metalox, Inc Method of recovering metal values from nickel-containing ores
US7964015B2 (en) 2007-05-23 2011-06-21 Contact Marketing Solutions, Llc Metal extraction without cyanide
CN100543159C (en) * 2007-09-19 2009-09-23 中国科学院过程工程研究所 A method for chemically swelling and strengthening mechanically crushing circuit boards
KR100889315B1 (en) 2007-11-16 2009-03-18 한국지질자원연구원 Method for recovering metal from waste printed circuit board using organic solution
US7681778B2 (en) * 2007-11-20 2010-03-23 Caterpillar Inc. Electronic assembly remanufacturing system and method
WO2009129271A1 (en) 2008-04-14 2009-10-22 Akridge James R System for the sustainable recovery of metals from electronic waste
CN101260469A (en) * 2008-04-21 2008-09-10 上海大学 The method for reclaiming and purifying platinum and rhodium from waste materials containing platinum and rhodium
CN101270411A (en) 2008-04-23 2008-09-24 北京正康创智科技发展有限公司 Method for recycling copper from waste circuit board
US7886422B1 (en) * 2008-06-07 2011-02-15 Magnecomp Corporation Ultrasonic reclaim method for disk drive suspensions
MX2010013578A (en) 2008-06-11 2011-03-21 a valerio Thomas Method and system for recovering metal from processed recycled materials.
DK2334833T3 (en) 2008-08-20 2016-01-11 Fuel Ltd P Disposal of electrical and electronic equipment
FR2938457B1 (en) 2008-11-14 2011-01-07 Terra Nova PROCESS FOR RECOVERING METALS CONTAINED IN ELECTRONIC WASTE
JP5396879B2 (en) 2009-01-23 2014-01-22 株式会社リコー Solder recovery device
JP2010236080A (en) * 2009-03-13 2010-10-21 Japan Atomic Energy Agency Gold ion adsorbent, gold ion adsorption method, gold recovery agent and gold recovery method
DK2411196T3 (en) 2009-03-14 2013-03-18 Alexander Koslow RECYCLING PROCEDURE FOR ELECTRONICS SCRAP FOR THE RECOVERY OF RECYCLABLE MATERIALS BY AVOIDING RELEASE OF HARMFUL SUBSTANCES
CN101537522B (en) * 2009-03-20 2011-07-20 湖南万容科技有限公司 Method and equipment for dismantling electronic components of waste printed circuit boards and recycling solder
WO2010121329A1 (en) 2009-04-24 2010-10-28 Precious Metals Recovery Pty Ltd Enhanced recovery of gold
TW201041668A (en) * 2009-05-27 2010-12-01 xie-sen Wu Pyrolysis method of recycled substrate of printed circuit board and device thereof
US8757523B2 (en) 2009-07-31 2014-06-24 Thomas Valerio Method and system for separating and recovering wire and other metal from processed recycled materials
US20110024201A1 (en) * 2009-07-31 2011-02-03 Danny Eugene Scott Polycrystalline diamond composite compact elements and tools incorporating same
CN101623698A (en) 2009-08-13 2010-01-13 中南大学 Method for synthetically recycling waste printed circuit board
US8486281B2 (en) 2009-10-05 2013-07-16 Kesheng Feng Nickel-chromium alloy stripper for flexible wiring boards
WO2011056576A2 (en) * 2009-10-27 2011-05-12 Akridge James R Oxygen torch reclamation of metals with nitric acid recovery
CN101708500B (en) * 2009-12-25 2011-08-10 陆刚萍 Method for recovering waste household appliances by harmlessness and reclamation
US8936770B2 (en) 2010-01-22 2015-01-20 Molycorp Minerals, Llc Hydrometallurgical process and method for recovering metals
WO2011123398A1 (en) * 2010-03-30 2011-10-06 Lockheed Martin Corporation Methods for rework of a solder
WO2011130622A1 (en) 2010-04-15 2011-10-20 Advanced Technology Materials, Inc. Method for recycling of obsolete printed circuit boards
CN103052461B (en) 2010-08-09 2016-03-30 英派尔科技开发有限公司 Removal and separation of components from printed circuit boards
KR20130099948A (en) * 2010-08-20 2013-09-06 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 Sustainable process for reclaiming precious metals and base metals from e-waste
CN102441553B (en) 2010-10-12 2014-07-02 深圳市格林美高新技术股份有限公司 Method and device for recovering precious metals from precious metal electronic scraps
CN201895152U (en) * 2010-11-15 2011-07-13 深圳市格林美高新技术股份有限公司 Desoldering equipment
EP2670871A1 (en) * 2011-02-03 2013-12-11 Western Platinum Ltd Refining of platinum group metals concentrates
CN102676822B (en) 2011-03-11 2014-01-01 深圳市格林美高新技术股份有限公司 Burning-free non-cyaniding method for treating waste printed circuit board
US8925170B2 (en) * 2011-04-22 2015-01-06 International Business Machines Corporation Method for removing an electronic component from a substrate
PE20141306A1 (en) * 2011-05-02 2014-09-26 Trimetals Mining Inc METHOD FOR THE RECOVERY OF INDIUM, SILVER, GOLD AND OTHER RARE, PRECIOUS AND BASIC METALS FROM OXIDE AND SULFUR COMPLEX MINERALS
TWI426157B (en) 2011-05-18 2014-02-11 優勝奈米科技有限公司 Gold stripping composition and method of use
US8739708B2 (en) * 2011-06-30 2014-06-03 Yuriy Rabiner Method and plant for processing contaminated waste
US9150942B2 (en) 2011-08-15 2015-10-06 Her Majesty The Queen In Righat Of Canada As Represented By The Minister Of Natural Resources Canada Process of leaching precious metals
WO2013029785A1 (en) 2011-09-01 2013-03-07 Dedek Petr Method for the removal and recovery of metals and precious metals from substrates
ES2619568T3 (en) 2011-12-15 2017-06-26 Entegris Inc. Apparatus and method of extraction of welding metals during the recycling of electrical and electronic waste equipment
US9482056B2 (en) 2011-12-30 2016-11-01 Smith International, Inc. Solid PCD cutter
EP2662464A1 (en) 2012-05-09 2013-11-13 Inter-Euro Technology Limited Gold recovery
TW201411690A (en) 2012-09-13 2014-03-16 聖高拜陶器塑膠公司 Recovered wafers and methods for recycling wafers
US20140217157A1 (en) * 2013-02-07 2014-08-07 Greene Lyon Group, Inc. Removal of electronic chips and other components from printed wire boards using liquid heat media
TWI471457B (en) 2013-02-22 2015-02-01 Uwin Nanotech Co Ltd Metal stripping additive, composition containing the same, and method for stripping metal by using the composition
US9228247B2 (en) * 2013-09-11 2016-01-05 Antaya Technologies Corporation Solder recovery unit

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