IN2014DN08844A - - Google Patents

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Publication number
IN2014DN08844A
IN2014DN08844A IN8844DEN2014A IN2014DN08844A IN 2014DN08844 A IN2014DN08844 A IN 2014DN08844A IN 8844DEN2014 A IN8844DEN2014 A IN 8844DEN2014A IN 2014DN08844 A IN2014DN08844 A IN 2014DN08844A
Authority
IN
India
Application number
Inventor
Frédéric Mayer
Original Assignee
E2V Semiconductors
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by E2V Semiconductors filed Critical E2V Semiconductors
Publication of IN2014DN08844A publication Critical patent/IN2014DN08844A/en

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/148Charge coupled imagers
    • H01L27/14831Area CCD imagers
    • H01L27/14856Time-delay and integration
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/148Charge coupled imagers
    • H01L27/14806Structural or functional details thereof
    • H01L27/14812Special geometry or disposition of pixel-elements, address lines or gate-electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
    • H01L27/10Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/105Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including field-effect components
    • H01L27/1057Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including field-effect components comprising charge coupled devices [CCD] or charge injection devices [CID]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/14625Optical elements or arrangements associated with the device
    • H01L27/14627Microlenses
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/148Charge coupled imagers
    • H01L27/14825Linear CCD imagers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/762Charge transfer devices
    • H01L29/765Charge-coupled devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/148Charge coupled imagers
    • H01L27/14868CCD or CID colour imagers
IN8844DEN2014 2012-05-03 2014-10-21 IN2014DN08844A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1254070A FR2990299B1 (en) 2012-05-03 2012-05-03 MATRIX IMAGE SENSOR WITH TWO-WAY CHARGING TRANSFER WITH DISSYMETRIC GRIDS
PCT/EP2013/057546 WO2013164169A1 (en) 2012-05-03 2013-04-11 Matrix image sensor providing bidirectional charge transfer with asymmetric gates

Publications (1)

Publication Number Publication Date
IN2014DN08844A true IN2014DN08844A (en) 2015-05-22

Family

ID=46754595

Family Applications (1)

Application Number Title Priority Date Filing Date
IN8844DEN2014 IN2014DN08844A (en) 2012-05-03 2014-10-21

Country Status (9)

Country Link
US (1) US9093353B2 (en)
EP (1) EP2845231B1 (en)
JP (1) JP6133973B2 (en)
KR (1) KR102105730B1 (en)
CN (1) CN104303306B (en)
FR (1) FR2990299B1 (en)
IL (1) IL235437B (en)
IN (1) IN2014DN08844A (en)
WO (1) WO2013164169A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11201807808WA (en) * 2016-03-23 2018-10-30 Psemi Corp Butted body contact for soi transistor

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3474638B2 (en) * 1994-06-30 2003-12-08 株式会社東芝 Solid-state imaging device
US6906749B1 (en) 1998-09-16 2005-06-14 Dalsa, Inc. CMOS TDI image sensor
US6465820B1 (en) * 1998-09-16 2002-10-15 Dalsa, Inc. CMOS compatible single phase CCD charge transfer device
US6633058B1 (en) * 1999-07-26 2003-10-14 Dalsa, Inc. Variable reticulation time delay and integrate sensor
WO2001026382A1 (en) 1999-10-05 2001-04-12 California Institute Of Technology Time-delayed-integration imaging with active pixel sensors
US20020097330A1 (en) * 2001-01-25 2002-07-25 Spears Kurt E. Photosensor array using segmented charge transfer gates to improve processing time for small images
US8446508B2 (en) * 2005-07-27 2013-05-21 Sony Corporation Solid state imaging device with optimized locations of internal electrical components
FR2906080B1 (en) 2006-09-19 2008-11-28 E2V Semiconductors Soc Par Act SCALING IMAGE SENSOR WITH SUCCESSIVE INTEGRATIONS AND SOMMATION, WITH ACTIVE CMOS PIXELS
US7923763B2 (en) 2007-03-08 2011-04-12 Teledyne Licensing, Llc Two-dimensional time delay integration visible CMOS image sensor
JP2009033286A (en) * 2007-07-25 2009-02-12 Advanced Mask Inspection Technology Kk Storage type sensor and driving method thereof
FR2924532B1 (en) * 2007-11-30 2009-12-18 E2V Semiconductors PIXEL FOUR OR FIVE TRANSISTOR IMAGE SENSOR WITH REDUCTION OF RESET NOISE
JP5300577B2 (en) * 2009-04-23 2013-09-25 三菱電機株式会社 TDI image sensor and method for driving the image sensor
KR101621278B1 (en) * 2009-07-27 2016-05-17 삼성전자주식회사 Photo detecting apparatus and unit pixel thereof
JP5568934B2 (en) * 2009-09-29 2014-08-13 ソニー株式会社 Solid-state imaging device, method for manufacturing solid-state imaging device, electronic device, lens array
FR2953642B1 (en) * 2009-12-09 2012-07-13 E2V Semiconductors MULTILINEAIRE IMAGE SENSOR WITH CHARGE INTEGRATION.
JP5509846B2 (en) * 2009-12-28 2014-06-04 ソニー株式会社 SOLID-STATE IMAGING DEVICE, ITS MANUFACTURING METHOD, AND ELECTRONIC DEVICE
FR2959902B1 (en) * 2010-05-04 2013-08-23 E2V Semiconductors LINEAR IMAGE SENSOR WITH SCROLL AND ANALOG AND DIGITAL SUMMIT AND METHOD THEREOF
FR2960341B1 (en) * 2010-05-18 2012-05-11 E2V Semiconductors MATRIX IMAGE SENSOR WITH TRANSFER OF DISSYMETRIC GRID LOADS.
FR2961347B1 (en) * 2010-06-15 2012-08-24 E2V Semiconductors ELECTRON MULTIPLICATION IMAGE SENSOR
FR2973162B1 (en) * 2011-03-23 2013-11-22 E2V Semiconductors VERY HIGH DYNAMIC IMAGE SENSOR

Also Published As

Publication number Publication date
IL235437A0 (en) 2014-12-31
CN104303306B (en) 2017-04-12
FR2990299A1 (en) 2013-11-08
JP2015524159A (en) 2015-08-20
KR20150017698A (en) 2015-02-17
WO2013164169A1 (en) 2013-11-07
CN104303306A (en) 2015-01-21
KR102105730B1 (en) 2020-04-28
IL235437B (en) 2019-05-30
EP2845231A1 (en) 2015-03-11
US20150123174A1 (en) 2015-05-07
EP2845231B1 (en) 2016-04-06
US9093353B2 (en) 2015-07-28
JP6133973B2 (en) 2017-05-24
FR2990299B1 (en) 2014-05-09

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