IN2014CN03846A - - Google Patents

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Publication number
IN2014CN03846A
IN2014CN03846A IN3846CHN2014A IN2014CN03846A IN 2014CN03846 A IN2014CN03846 A IN 2014CN03846A IN 3846CHN2014 A IN3846CHN2014 A IN 3846CHN2014A IN 2014CN03846 A IN2014CN03846 A IN 2014CN03846A
Authority
IN
India
Prior art keywords
led
strip
embedded resistor
power source
arbitrarily
Prior art date
Application number
Inventor
Rongbao Li
Original Assignee
Rongbao Li
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rongbao Li filed Critical Rongbao Li
Publication of IN2014CN03846A publication Critical patent/IN2014CN03846A/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/28—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00—Point-like light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

The present invention relates to the technical field of LED encapsulation and particularly to a strip LED including an LED chip an embedded resistor a magnet a magnetic material a strip encapsulation bracket and a power source. It is characterized in that the strip LED is of an elongated strip shape. An installation bracket for the embedded resistor and the LED chip are provided between connection brackets. The connection bracket metal strips and and metal strips and are either a single narrow and thin metal strip or a plurality of thin metal wire structures. All of or a part of the connection brackets are of a magnetic metal material. The brackets the LED chip and the embedded resistor are connected in series. All the LED lamps formed by the series connection of LEDs and the embedded resistor are connected in parallel. The magnet is fixed at one end of a wire and another end of the wire is connected to the power source. The power source wiring is led out from a plurality of points. The voltage drop problem is solved and the phenomena of a large segment not lighting due to a broken line or the damage of any devices can be avoided. The flexibility of the strip LED in the present invention is very good it can be bent arbitrarily in a 3D space it is small and fine the length can be cut off arbitrarily it can be connected arbitrarily it can be applied in many new fields and it can also make more novel products.
IN3846CHN2014 2011-11-21 2012-11-20 IN2014CN03846A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201110370522.7A CN102509760B (en) 2011-11-21 2011-11-21 Linear LED and manufacturing method and application thereof
PCT/CN2012/084872 WO2013075609A1 (en) 2011-11-21 2012-11-20 Strip led

Publications (1)

Publication Number Publication Date
IN2014CN03846A true IN2014CN03846A (en) 2015-09-04

Family

ID=46221826

Family Applications (1)

Application Number Title Priority Date Filing Date
IN3846CHN2014 IN2014CN03846A (en) 2011-11-21 2012-11-20

Country Status (8)

Country Link
US (1) US9518707B2 (en)
EP (1) EP2775540B1 (en)
JP (1) JP5775642B2 (en)
CN (1) CN102509760B (en)
BR (1) BR112014011994B1 (en)
IN (1) IN2014CN03846A (en)
RU (1) RU2608073C2 (en)
WO (1) WO2013075609A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023141651A1 (en) * 2022-01-24 2023-07-27 Appear Inc. Systems and methods for providing buoyant electronic devices

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UA116335C2 (en) * 2011-10-06 2018-03-12 Хамлет Протеїн А/С Method for the simultaneous production of ethanol and a fermented, solid product
CN102509760B (en) * 2011-11-21 2014-04-02 上海大溥实业有限公司 Linear LED and manufacturing method and application thereof
US10145552B2 (en) * 2015-03-26 2018-12-04 Lux Lighting Systems, Llc Magnetic light emitting diode (LED) lighting system
US20180164224A1 (en) * 2016-12-13 2018-06-14 ASA Corporation Apparatus for Photographing Glass in Multiple Layers
CN110486631B (en) * 2019-08-26 2021-02-23 启迪设计集团股份有限公司 Luminous tree-shaped device
CN111076110A (en) * 2019-12-05 2020-04-28 深圳市威尔晟光电有限公司 Magical color flexible lamp strip with inverted structure

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023141651A1 (en) * 2022-01-24 2023-07-27 Appear Inc. Systems and methods for providing buoyant electronic devices

Also Published As

Publication number Publication date
US20140313725A1 (en) 2014-10-23
JP5775642B2 (en) 2015-09-09
EP2775540B1 (en) 2016-07-27
EP2775540A1 (en) 2014-09-10
JP2014533886A (en) 2014-12-15
US9518707B2 (en) 2016-12-13
WO2013075609A1 (en) 2013-05-30
CN102509760A (en) 2012-06-20
RU2608073C2 (en) 2017-01-13
EP2775540A4 (en) 2014-12-03
RU2014122852A (en) 2015-12-27
CN102509760B (en) 2014-04-02
BR112014011994B1 (en) 2021-04-06
BR112014011994A2 (en) 2017-05-30

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