IN2014CH02673A - - Google Patents

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Publication number
IN2014CH02673A
IN2014CH02673A IN2673CH2014A IN2014CH02673A IN 2014CH02673 A IN2014CH02673 A IN 2014CH02673A IN 2673CH2014 A IN2673CH2014 A IN 2673CH2014A IN 2014CH02673 A IN2014CH02673 A IN 2014CH02673A
Authority
IN
India
Prior art keywords
base plate
channels
tube
tubes
evaporator
Prior art date
Application number
Other languages
English (en)
Inventor
Bruno Agostini
Heikki Elomaa
Jari Sundelin
Risto Laurila
Original Assignee
Abb Research Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Abb Research Ltd filed Critical Abb Research Ltd
Publication of IN2014CH02673A publication Critical patent/IN2014CH02673A/en

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/02Header boxes; End plates
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
IN2673CH2014 2013-06-04 2014-05-30 IN2014CH02673A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP13170378.7A EP2811251A1 (de) 2013-06-04 2013-06-04 Kühlvorrichtung

Publications (1)

Publication Number Publication Date
IN2014CH02673A true IN2014CH02673A (de) 2015-07-10

Family

ID=48539026

Family Applications (1)

Application Number Title Priority Date Filing Date
IN2673CH2014 IN2014CH02673A (de) 2013-06-04 2014-05-30

Country Status (4)

Country Link
US (1) US20140352927A1 (de)
EP (1) EP2811251A1 (de)
CN (1) CN104219934A (de)
IN (1) IN2014CH02673A (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DK3115729T3 (en) 2015-07-09 2019-04-01 Abb Schweiz Ag HEAT EXCHANGE
EP3144625B1 (de) * 2015-09-21 2018-07-04 ABB Schweiz AG Kühlanordnung und verfahren zu deren herstellung
EP3153808A1 (de) * 2015-10-07 2017-04-12 ABB Technology Oy Kühlvorrichtung und herstellungsverfahren
EP3185664A1 (de) * 2015-12-22 2017-06-28 ABB Technology Oy Kühlvorrichtung
EP3196586B1 (de) * 2016-01-07 2018-09-12 ABB Schweiz AG Anordnung eines leistungselektronischen moduls
EP3190371B1 (de) 2016-01-07 2018-08-01 ABB Schweiz AG Wärmetauscher für Leistungselektronische Komponenten
CN106643244A (zh) * 2017-01-23 2017-05-10 中车大连机车研究所有限公司 一种风冷板翅式复合毛细沟槽相变散热器
FR3080170B1 (fr) * 2018-04-11 2020-11-27 Commissariat Energie Atomique Caloduc a artere a fonctionnement ameliore
US11051428B2 (en) * 2019-10-31 2021-06-29 Hamilton Sunstrand Corporation Oscillating heat pipe integrated thermal management system for power electronics

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60106633A (ja) * 1983-11-11 1985-06-12 Toshiba Corp 平板形ヒ−トパイプ容器の製造方法
US5704415A (en) * 1994-11-25 1998-01-06 Nippon Light Metal Co. Ltd. Winding small tube apparatus and manufacturing method thereof
JP2000356480A (ja) * 1999-06-16 2000-12-26 Ts Heatronics Co Ltd プレート型ヒートパイプ及びその製造方法
JP2001168254A (ja) * 1999-12-09 2001-06-22 Mitsubishi Alum Co Ltd 熱交換器
JP3953741B2 (ja) * 2001-03-02 2007-08-08 株式会社エムエーファブテック 沸騰冷却器及びその製造方法
JP2004020093A (ja) * 2002-06-18 2004-01-22 Fujine Sangyo:Kk 熱サイフォン型熱移動体
JP4892403B2 (ja) * 2007-05-15 2012-03-07 昭和電工株式会社 ヒートパイプ式放熱装置
AT505413B1 (de) * 2007-08-21 2009-01-15 Pustelnik Philipp Dipl Ing Plattenkühler für flüssigkeiten
DE602008002507D1 (de) * 2007-08-27 2010-10-28 Abb Research Ltd Wärmetauscher für Komponenten der Leistungselektronik
EP2328172B1 (de) * 2009-10-02 2019-06-26 Abb Research Ltd. Leistungselektronikanordnung
EP2383779B1 (de) * 2010-04-29 2012-09-12 ABB Oy Montagebasis
EP2444770B1 (de) * 2010-10-20 2020-02-12 ABB Schweiz AG Wärmetauscher nach dem Prinzip des pulsierenden Wärmerohrs
EP2568789B1 (de) * 2011-09-06 2014-04-16 ABB Research Ltd. Wärmetauscher

Also Published As

Publication number Publication date
CN104219934A (zh) 2014-12-17
EP2811251A1 (de) 2014-12-10
US20140352927A1 (en) 2014-12-04

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