IN2012DN03051A - - Google Patents
Download PDFInfo
- Publication number
- IN2012DN03051A IN2012DN03051A IN3051DEN2012A IN2012DN03051A IN 2012DN03051 A IN2012DN03051 A IN 2012DN03051A IN 3051DEN2012 A IN3051DEN2012 A IN 3051DEN2012A IN 2012DN03051 A IN2012DN03051 A IN 2012DN03051A
- Authority
- IN
- India
- Prior art keywords
- devices
- growth substrate
- methods
- flexible
- reuse
- Prior art date
Links
- 238000000034 method Methods 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 238000005530 etching Methods 0.000 abstract 1
- 239000011241 protective layer Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/139—Manufacture or treatment of devices covered by this subclass using temporary substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/7806—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate
- H01L21/7813—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate leaving a reusable substrate, e.g. epitaxial lift off
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F10/00—Individual photovoltaic cells, e.g. solar cells
- H10F10/10—Individual photovoltaic cells, e.g. solar cells having potential barriers
- H10F10/16—Photovoltaic cells having only PN heterojunction potential barriers
- H10F10/163—Photovoltaic cells having only PN heterojunction potential barriers comprising only Group III-V materials, e.g. GaAs/AlGaAs or InP/GaInAs photovoltaic cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/127—The active layers comprising only Group III-V materials, e.g. GaAs or InP
- H10F71/1276—The active layers comprising only Group III-V materials, e.g. GaAs or InP comprising growth substrates not made of Group III-V materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/139—Manufacture or treatment of devices covered by this subclass using temporary substrates
- H10F71/1395—Manufacture or treatment of devices covered by this subclass using temporary substrates for thin-film devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/16—Material structures, e.g. crystalline structures, film structures or crystal plane orientations
- H10F77/169—Thin semiconductor films on metallic or insulating substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/544—Solar cells from Group III-V materials
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photovoltaic Devices (AREA)
- Weting (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Energy (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US24137309P | 2009-09-10 | 2009-09-10 | |
| US24137409P | 2009-09-10 | 2009-09-10 | |
| US35829810P | 2010-06-24 | 2010-06-24 | |
| PCT/US2010/048213 WO2011066029A2 (en) | 2009-09-10 | 2010-09-09 | Methods of preparing flexible photovoltaic devices using epitaxial liftoff, and preserving the integrity of growth substrates used in epitaxial growth |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IN2012DN03051A true IN2012DN03051A (enExample) | 2015-07-31 |
Family
ID=44067165
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IN3051DEN2012 IN2012DN03051A (enExample) | 2009-09-10 | 2010-09-09 |
Country Status (10)
| Country | Link |
|---|---|
| US (2) | US8378385B2 (enExample) |
| EP (1) | EP2462631B1 (enExample) |
| JP (1) | JP5619901B2 (enExample) |
| KR (1) | KR101714812B1 (enExample) |
| CN (1) | CN102804408B (enExample) |
| AU (1) | AU2010325106B2 (enExample) |
| CA (1) | CA2789391A1 (enExample) |
| IN (1) | IN2012DN03051A (enExample) |
| TW (1) | TWI550895B (enExample) |
| WO (1) | WO2011066029A2 (enExample) |
Families Citing this family (58)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9040392B2 (en) | 2011-06-15 | 2015-05-26 | International Business Machines Corporation | Method for controlled removal of a semiconductor device layer from a base substrate |
| JP2014523848A (ja) * | 2011-06-29 | 2014-09-18 | ザ リージェンツ オブ ザ ユニヴァシティ オブ ミシガン | エピタキシャルリフトオフ後のウエハーの再利用のための犠牲エッチング保護層 |
| WO2013006803A2 (en) * | 2011-07-06 | 2013-01-10 | Forrest Stephen R | Integrated solar collectors using epitaxial lift off and cold weld bonded semiconductor solar cells |
| CN102244134B (zh) * | 2011-08-02 | 2013-05-15 | 厦门市三安光电科技有限公司 | 一种高效四结太阳能电池及其制作方法 |
| US8541315B2 (en) * | 2011-09-19 | 2013-09-24 | International Business Machines Corporation | High throughput epitaxial lift off for flexible electronics |
| US8916954B2 (en) * | 2012-02-05 | 2014-12-23 | Gtat Corporation | Multi-layer metal support |
| US8841161B2 (en) | 2012-02-05 | 2014-09-23 | GTAT.Corporation | Method for forming flexible solar cells |
| TW201344796A (zh) | 2012-02-07 | 2013-11-01 | Univ Michigan | 磊晶移起後用於晶圓再生之熱表面處理 |
| KR20130104974A (ko) | 2012-03-16 | 2013-09-25 | 삼성전자주식회사 | 반도체 발광소자 제조방법 |
| US8785294B2 (en) | 2012-07-26 | 2014-07-22 | Gtat Corporation | Silicon carbide lamina |
| US20140137930A1 (en) * | 2012-11-16 | 2014-05-22 | Solar Junction Corporation | Multijunction solar cells |
| US9450115B2 (en) * | 2013-03-15 | 2016-09-20 | First Solar, Inc. | Method of manufacturing a photovoltaic device |
| CN103346079A (zh) * | 2013-06-07 | 2013-10-09 | 刘凤全 | 一种重复使用的半导体基底及其纯化重复使用方法 |
| US10658998B2 (en) | 2013-07-31 | 2020-05-19 | Oepic Semiconductors, Inc. | Piezoelectric film transfer for acoustic resonators and filters |
| TW201517158A (zh) * | 2013-08-26 | 2015-05-01 | Univ Michigan | 藉由磊晶掀離及剝離之組合之薄膜掀離 |
| CN103489958B (zh) * | 2013-08-27 | 2015-09-02 | 湖南红太阳光电科技有限公司 | 一种柔性硅基砷化镓电池的制备方法 |
| JP2017504181A (ja) * | 2013-11-11 | 2017-02-02 | ザ リージェンツ オブ ザ ユニヴァシティ オブ ミシガン | エピタキシャルリフトオフ方法のための熱アシストコールドウェルド接合 |
| US10637391B2 (en) | 2013-11-29 | 2020-04-28 | The Regents Of The University Of Michigan | Autonomous solar tracking in flat-plate photovoltaic panels using kirigami-inspired microstructures |
| WO2015084868A1 (en) * | 2013-12-02 | 2015-06-11 | The Regents Of The University Of Michigan | Fabrication of thin-film electronic devices with non-destructive wafer reuse |
| TWI660520B (zh) | 2014-01-15 | 2019-05-21 | 美國密西根州立大學 | 經由印刷方法整合磊晶剝離太陽能電池與小型拋物線集光器陣列 |
| US10680132B2 (en) * | 2014-01-15 | 2020-06-09 | The Regents Of The University Of Michigan | Non-destructive wafer recycling for epitaxial lift-off thin-film device using a superlattice epitaxial layer |
| US10141465B2 (en) | 2014-04-04 | 2018-11-27 | The Regents Of The University Of Michigan | Epitaxial lift-off processed GaAs thin-film solar cells integrated with non-tracking mini-compound parabolic concentrators |
| EP3127165B1 (en) | 2014-04-04 | 2020-08-12 | The Regents Of The University Of Michigan | Method to manufacture epitaxial lift-off processed thin-film solar cells integrated with non-tracking mini-compound parabolic concentrators |
| US20170033247A1 (en) | 2014-04-29 | 2017-02-02 | The Regents Of The University Of Michigan | Flexible antenna integrated with an array of solar cells |
| US9786643B2 (en) | 2014-07-08 | 2017-10-10 | Micron Technology, Inc. | Semiconductor devices comprising protected side surfaces and related methods |
| CN104241205B (zh) * | 2014-09-18 | 2017-04-26 | 厦门乾照光电股份有限公司 | 一种衬底可剥离的外延结构及其应用 |
| US9263626B1 (en) | 2015-01-29 | 2016-02-16 | International Business Machines Corporation | Crystalline thin film photovoltaic cell |
| EP3271950B1 (en) | 2015-03-18 | 2019-03-06 | The Regents Of The University Of Michigan | Strain relief epitaxial lift-off via pre-patterned mesas |
| KR101743017B1 (ko) | 2015-05-19 | 2017-06-05 | 한국과학기술연구원 | 고속 에피택셜 리프트오프와 iii-v족 직접 성장용 템플릿을 이용한 반도체 소자의 제조 방법 및 이에 의해 제조된 반도체 소자 |
| CN105140318B (zh) * | 2015-06-30 | 2017-05-17 | 苏州强明光电有限公司 | 太阳能电池外延片及其制作方法 |
| CN104993003B (zh) * | 2015-07-16 | 2017-03-08 | 苏州强明光电有限公司 | 一种太阳能电池外延片及其制作方法 |
| US20180337082A1 (en) * | 2015-08-31 | 2018-11-22 | Stc.Unm | Mixed group-v sacrificial layers for release and transfer of membranes |
| CN105428215A (zh) * | 2015-11-19 | 2016-03-23 | 中山德华芯片技术有限公司 | 一种基于金属应力层及亲水剂处理的外延片整面剥离方法 |
| CN105428427B (zh) * | 2015-12-11 | 2017-06-27 | 中国电子科技集团公司第十八研究所 | 薄膜砷化镓太阳电池衬底复用的衬底保护结构及加工工艺 |
| WO2017196431A2 (en) | 2016-02-24 | 2017-11-16 | The Regents Of The University Of Michigan | Effective compound substrate for non-destructive epitaxial lift-off |
| US9941168B1 (en) | 2016-09-21 | 2018-04-10 | Korea Institute Of Science And Technology | Method for manufacturing semiconductor device by epitaxial lift-off using plane dependency of III-V compound |
| KR101824523B1 (ko) * | 2017-01-11 | 2018-02-01 | 엘지전자 주식회사 | 태양 전지 모듈 및 이를 구비하는 휴대용 충전기 |
| CN107634121A (zh) * | 2017-08-15 | 2018-01-26 | 苏州苏纳光电有限公司 | 基于InP衬底剥离的红外光电探测器及其预制件的制备方法 |
| EP3714491A4 (en) | 2017-11-20 | 2021-06-30 | The Government Of The United States Of America As The Secretary of The Navy | Flexible crystalline ultra-thin si solar cells |
| CN108040435B (zh) * | 2017-12-12 | 2020-06-19 | 北京科技大学 | 一种氮化铝陶瓷基板线路刻蚀方法 |
| EP3743948A4 (en) * | 2018-01-25 | 2021-11-03 | Saint-Gobain ADFORS Canada, Ltd. | PHOTOVOLTAIC TEXTILE |
| EP3747052A4 (en) | 2018-02-02 | 2021-09-29 | The Government of the United States of America, as represented by the Secretary of the Navy | FLEXIBLE AND ULTRA-THIN REAR CONTACT SI SOLAR CELLS, AND THEIR MANUFACTURING PROCESSES |
| CN108520901A (zh) * | 2018-04-16 | 2018-09-11 | 江苏宜兴德融科技有限公司 | 薄膜太阳能电池及其制造方法 |
| US12046471B1 (en) | 2018-06-06 | 2024-07-23 | United States Of America As Represented By The Secretary Of The Air Force | Optimized thick heteroepitaxial growth of semiconductors with in-situ substrate pretreatment |
| KR102131619B1 (ko) * | 2018-06-12 | 2020-07-08 | 한국과학기술연구원 | 인화계 기판의 결정결함을 방지하기 위해 박막층을 형성하는 방법 |
| KR20200021775A (ko) * | 2018-08-21 | 2020-03-02 | 엘지전자 주식회사 | 지지 핸들 및 이를 이용한 화합물 반도체 태양전지의 제조 방법 |
| US11087974B2 (en) * | 2018-10-08 | 2021-08-10 | The Regents Of The University Of Michigan | Preparation of compound semiconductor substrate for epitaxial growth via non-destructive epitaxial lift-off |
| CN109321253A (zh) * | 2018-11-28 | 2019-02-12 | 湖北兴福电子材料有限公司 | 一种硅晶圆的蚀刻液 |
| CN110224045B (zh) * | 2019-07-16 | 2021-06-15 | 中国科学院上海技术物理研究所 | 一种柔性InGaAs探测器的制备方法 |
| FI129855B (en) | 2019-10-08 | 2022-09-30 | Jani Oksanen | METHOD AND STRUCTURE FOR MANUFACTURING THIN FILMS |
| RU196935U1 (ru) * | 2019-10-09 | 2020-03-23 | федеральное государственное автономное образовательное учреждение высшего образования "Национальный исследовательский ядерный университет "МИФИ" (НИЯУ МИФИ) | КАЛИБРОВОЧНАЯ ДВУХПЕРИОДНАЯ СВЕРХРЕШЕТКА InAlAs/InGaAs НА ПОДЛОЖКЕ InP |
| JP2022013255A (ja) * | 2020-07-03 | 2022-01-18 | 信越半導体株式会社 | 接合型半導体ウェーハの製造方法及び接合型半導体素子の製造方法 |
| CN111785794B (zh) * | 2020-07-20 | 2023-09-08 | 西安电子科技大学 | 基于ScAlN与InAlN极化插入层增强电场的N极性InGaN基太阳能电池 |
| EP4218060A4 (en) * | 2020-09-23 | 2024-09-25 | Antora Energy, Inc. | Structures and methods for producing an optoelectronic device |
| CN112701176B (zh) * | 2021-03-23 | 2021-06-08 | 南昌凯迅光电有限公司 | 一种砷化镓薄膜太阳电池及制作方法 |
| KR102625586B1 (ko) | 2021-07-14 | 2024-01-16 | 한국광기술원 | 기판의 재활용이 가능한 ⅲ-ⅴ족 나노로드 태양전지 제조방법 |
| US12424965B2 (en) | 2022-06-02 | 2025-09-23 | Antora Energy, Inc. | Layered window in thermophotovoltaic devices |
| WO2024189753A1 (ja) * | 2023-03-13 | 2024-09-19 | 三菱電機株式会社 | 半導体装置の製造方法 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08288297A (ja) * | 1995-04-13 | 1996-11-01 | Nippon Telegr & Teleph Corp <Ntt> | ヘテロ接合バイポーラトランジスタおよびその製造方法 |
| JP2002284600A (ja) * | 2001-03-26 | 2002-10-03 | Hitachi Cable Ltd | 窒化ガリウム結晶基板の製造方法及び窒化ガリウム結晶基板 |
| US6895667B2 (en) * | 2001-04-13 | 2005-05-24 | The Trustees Of Princeton University | Transfer of patterned metal by cold-welding |
| KR100438895B1 (ko) * | 2001-12-28 | 2004-07-02 | 한국전자통신연구원 | 고전자 이동도 트랜지스터 전력 소자 및 그 제조 방법 |
| US8173891B2 (en) * | 2002-05-21 | 2012-05-08 | Alliance For Sustainable Energy, Llc | Monolithic, multi-bandgap, tandem, ultra-thin, strain-counterbalanced, photovoltaic energy converters with optimal subcell bandgaps |
| KR100931421B1 (ko) * | 2002-08-26 | 2009-12-11 | 에스. 오. 이. 떼끄 씰리꽁 오 냉쉴라또흐 떼끄놀로지 | 버퍼층을 포함하는 웨이퍼를 그것으로부터 박막층을 분리한 후에 재활용하는 방법 |
| JP4315744B2 (ja) * | 2003-06-25 | 2009-08-19 | 株式会社沖データ | 積層体及び半導体装置の製造方法 |
| WO2005089098A2 (en) * | 2004-01-14 | 2005-09-29 | The Regents Of The University Of California | Ultra broadband mirror using subwavelength grating |
| JP4518886B2 (ja) * | 2004-09-09 | 2010-08-04 | シャープ株式会社 | 半導体素子の製造方法 |
| JP2007036010A (ja) * | 2005-07-28 | 2007-02-08 | Toshiba Corp | ショットキーバリアダイオード装置及びその製造方法 |
| DE102005047152A1 (de) * | 2005-09-30 | 2007-04-12 | Osram Opto Semiconductors Gmbh | Epitaxiesubstrat, Verfahren zu seiner Herstellung und Verfahren zur Herstellung eines Halbleiterchips |
| US7709269B2 (en) * | 2006-01-17 | 2010-05-04 | Cree, Inc. | Methods of fabricating transistors including dielectrically-supported gate electrodes |
| US20100047959A1 (en) | 2006-08-07 | 2010-02-25 | Emcore Solar Power, Inc. | Epitaxial Lift Off on Film Mounted Inverted Metamorphic Multijunction Solar Cells |
| JP2008053250A (ja) * | 2006-08-22 | 2008-03-06 | Sony Corp | 半導体装置の製造方法 |
| KR101090900B1 (ko) * | 2006-10-18 | 2011-12-08 | 니텍 인코포레이티드 | 수직구조의 심자외선 발광다이오드 |
| CA2692126A1 (en) * | 2007-07-03 | 2009-01-08 | Microlink Devices, Inc. | Methods for fabricating thin film iii-v compound solar cell |
| TW200905922A (en) * | 2007-07-30 | 2009-02-01 | Juh-Yuh Su | Reusable substrate structure and method of handling the same |
-
2010
- 2010-09-09 AU AU2010325106A patent/AU2010325106B2/en not_active Ceased
- 2010-09-09 CA CA2789391A patent/CA2789391A1/en not_active Abandoned
- 2010-09-09 JP JP2012528887A patent/JP5619901B2/ja active Active
- 2010-09-09 CN CN201080049905.8A patent/CN102804408B/zh not_active Expired - Fee Related
- 2010-09-09 IN IN3051DEN2012 patent/IN2012DN03051A/en unknown
- 2010-09-09 US US12/878,261 patent/US8378385B2/en active Active
- 2010-09-09 KR KR1020127009157A patent/KR101714812B1/ko active Active
- 2010-09-09 EP EP10818111.6A patent/EP2462631B1/en active Active
- 2010-09-09 WO PCT/US2010/048213 patent/WO2011066029A2/en not_active Ceased
- 2010-09-10 TW TW099130822A patent/TWI550895B/zh active
-
2013
- 2013-01-25 US US13/750,660 patent/US8927319B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2011066029A2 (en) | 2011-06-03 |
| TW201125152A (en) | 2011-07-16 |
| AU2010325106B2 (en) | 2015-04-09 |
| US8378385B2 (en) | 2013-02-19 |
| KR20120103762A (ko) | 2012-09-19 |
| JP5619901B2 (ja) | 2014-11-05 |
| CA2789391A1 (en) | 2011-06-03 |
| US20130237001A1 (en) | 2013-09-12 |
| AU2010325106A1 (en) | 2012-04-12 |
| TWI550895B (zh) | 2016-09-21 |
| US8927319B2 (en) | 2015-01-06 |
| CN102804408B (zh) | 2016-01-20 |
| EP2462631B1 (en) | 2021-06-30 |
| CN102804408A (zh) | 2012-11-28 |
| EP2462631A2 (en) | 2012-06-13 |
| KR101714812B1 (ko) | 2017-03-22 |
| US20110186910A1 (en) | 2011-08-04 |
| JP2013504878A (ja) | 2013-02-07 |
| WO2011066029A3 (en) | 2012-05-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| IN2012DN03051A (enExample) | ||
| WO2013061047A3 (en) | Silicon carbide epitaxy | |
| USD699346S1 (en) | Backsheet of a diaper | |
| WO2012037532A3 (en) | Concentrated solar power generation using solar receivers | |
| WO2011155858A3 (en) | Method of graphene manufacturing | |
| PL2395830T3 (pl) | Sposób hodowli roślin oraz pływający nośnik | |
| WO2012166974A3 (en) | Tunneling-junction solar cell with copper grid for concentrated photovoltaic application | |
| WO2009116830A3 (ko) | 반도체 소자 및 그 제조방법 | |
| WO2011092327A3 (de) | Iii-v-halbleiter-solarzelle | |
| WO2010124059A3 (en) | Crystalline thin-film photovoltaic structures and methods for forming the same | |
| WO2014144698A3 (en) | Large-area, laterally-grown epitaxial semiconductor layers | |
| WO2010086621A3 (en) | Method for attachment of silicon-containing compounds to a surface and for synthesis of hypervalent silicon-compounds | |
| GEP201606569B (en) | Urea finishing method | |
| MX2012000382A (es) | Proceso para la fabricacion de alquenonas. | |
| WO2013084160A3 (en) | Graphene composite and a method of manufacturing a graphene composite | |
| WO2012106612A3 (en) | In-situ hydroxylation system | |
| MY170869A (en) | Chuck for chemical vapor deposition systems and related methods therefor | |
| WO2012020382A3 (en) | Modified mask for photolithography of a wafer with recess, method for producing such a mask and method for photolithography of a wafer with recess | |
| WO2011094158A3 (en) | Method for attaching contacts to a solar cell without cell efficiency loss | |
| EP2527500A4 (en) | PROCESS FOR PREPARING AN EPITACTIC CRYSTAL SUBSTRATE | |
| PL2122015T3 (pl) | Sposób wytwarzania monokryształu azotku przez wzrost epitaksjalny na podłożu zapobiegającym wzrostowi na krawędziach podłoża | |
| EP3994355A4 (en) | SYSTEM FOR OFFSHORE POWER GENERATION | |
| WO2013098798A3 (en) | Steam power plant with integrated solar receiver | |
| SG153033A1 (en) | Integrated circuit system employing selective epitaxial growth technology | |
| WO2012028355A3 (de) | Solarzelle und verfahren zur herstellung einer solchen |