IN2012DE00820A - - Google Patents
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- Publication number
- IN2012DE00820A IN2012DE00820A IN820DE2012A IN2012DE00820A IN 2012DE00820 A IN2012DE00820 A IN 2012DE00820A IN 820DE2012 A IN820DE2012 A IN 820DE2012A IN 2012DE00820 A IN2012DE00820 A IN 2012DE00820A
- Authority
- IN
- India
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/80—Camera processing pipelines; Components thereof
- H04N23/81—Camera processing pipelines; Components thereof for suppressing or minimising disturbance in the image signal generation
- H04N23/811—Camera processing pipelines; Components thereof for suppressing or minimising disturbance in the image signal generation by dust removal, e.g. from surfaces of the image sensor or processing of the image signal output by the electronic image sensor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011064533 | 2011-03-23 | ||
| JP2012057084A JP5234201B2 (en) | 2011-03-23 | 2012-03-14 | Imaging unit and imaging apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IN2012DE00820A true IN2012DE00820A (en) | 2015-08-21 |
Family
ID=46876522
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IN820DE2012 IN2012DE00820A (en) | 2011-03-23 | 2012-03-21 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US8866061B2 (en) |
| JP (1) | JP5234201B2 (en) |
| CN (1) | CN103152516B (en) |
| IN (1) | IN2012DE00820A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5968052B2 (en) * | 2012-04-26 | 2016-08-10 | キヤノン株式会社 | Dust removing device and imaging device |
| JP5984736B2 (en) | 2013-04-25 | 2016-09-06 | キヤノン株式会社 | Dust removing device, manufacturing method thereof and imaging device |
| CN103579278B (en) * | 2013-11-14 | 2016-08-17 | 华进半导体封装先导技术研发中心有限公司 | Image sensor package structure based on glass substrate and method for packing |
| CN104709711B (en) * | 2015-02-06 | 2017-02-01 | 厦门弘信电子科技股份有限公司 | Auto-feeder of integrated matching electrical testing machine equipment |
| JP2017143092A (en) * | 2016-02-08 | 2017-08-17 | ソニー株式会社 | Glass interposer module, imaging device, and electronic equipment |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07231074A (en) * | 1994-02-18 | 1995-08-29 | Toshiba Corp | Solid-state image sensing module |
| JP3519922B2 (en) * | 1997-10-29 | 2004-04-19 | シャープ株式会社 | Two-dimensional input module element |
| JP4421209B2 (en) * | 2003-04-11 | 2010-02-24 | 浜松ホトニクス株式会社 | Radiation detector |
| JP2005109903A (en) * | 2003-09-30 | 2005-04-21 | Casio Comput Co Ltd | Portable electronic apparatus |
| JP2006099608A (en) * | 2004-09-30 | 2006-04-13 | Touch Panel Systems Kk | Display device with touch detection function |
| JP2008098516A (en) * | 2006-10-13 | 2008-04-24 | Sanyo Electric Co Ltd | Photoelectric conversion device |
| JP2008141037A (en) * | 2006-12-04 | 2008-06-19 | Fujifilm Corp | Solid-state imaging apparatus |
| JP2008271487A (en) * | 2007-03-29 | 2008-11-06 | Olympus Imaging Corp | Imaging element module, lens unit using the imaging element module and portable electronic device |
| JP5304112B2 (en) | 2008-09-01 | 2013-10-02 | 日本電気硝子株式会社 | Manufacturing method of glass substrate with thin film |
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2012
- 2012-03-14 JP JP2012057084A patent/JP5234201B2/en active Active
- 2012-03-20 US US13/424,878 patent/US8866061B2/en active Active
- 2012-03-21 IN IN820DE2012 patent/IN2012DE00820A/en unknown
- 2012-03-23 CN CN201210080948.3A patent/CN103152516B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2012213149A (en) | 2012-11-01 |
| CN103152516B (en) | 2017-03-01 |
| CN103152516A (en) | 2013-06-12 |
| JP5234201B2 (en) | 2013-07-10 |
| US8866061B2 (en) | 2014-10-21 |
| US20120241593A1 (en) | 2012-09-27 |