IN191477B - - Google Patents

Info

Publication number
IN191477B
IN191477B IN1442CA1997A IN191477B IN 191477 B IN191477 B IN 191477B IN 1442CA1997 A IN1442CA1997 A IN 1442CA1997A IN 191477 B IN191477 B IN 191477B
Authority
IN
India
Application number
Other languages
English (en)
Inventor
Detlef Dr Houdeau
Robert Wilm
Original Assignee
Siemens Ag
Pav Cord Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag, Pav Cord Gmbh filed Critical Siemens Ag
Publication of IN191477B publication Critical patent/IN191477B/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5522—
    • H10W72/5525—
    • H10W72/884—
    • H10W74/00—

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
IN1442CA1997 1996-08-14 1997-08-04 IN191477B (index.php)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19632813A DE19632813C2 (de) 1996-08-14 1996-08-14 Verfahren zur Herstellung eines Chipkarten-Moduls, unter Verwendung dieses Verfahrens hergestellter Chipkarten-Modul und diesen Chipkarten-Modul enthaltende Kombi-Chipkarte

Publications (1)

Publication Number Publication Date
IN191477B true IN191477B (index.php) 2003-12-06

Family

ID=7802649

Family Applications (1)

Application Number Title Priority Date Filing Date
IN1442CA1997 IN191477B (index.php) 1996-08-14 1997-08-04

Country Status (13)

Country Link
US (1) US6095423A (index.php)
EP (1) EP0919041B1 (index.php)
JP (1) JP3262804B2 (index.php)
KR (1) KR100358578B1 (index.php)
CN (1) CN1143381C (index.php)
AT (1) ATE209800T1 (index.php)
BR (1) BR9711161A (index.php)
DE (2) DE19632813C2 (index.php)
ES (1) ES2171274T3 (index.php)
IN (1) IN191477B (index.php)
RU (1) RU2161331C2 (index.php)
UA (1) UA52673C2 (index.php)
WO (1) WO1998007115A1 (index.php)

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US20060174297A1 (en) * 1999-05-28 2006-08-03 Anderson Tazwell L Jr Electronic handheld audio/video receiver and listening/viewing device
US7210160B2 (en) * 1999-05-28 2007-04-24 Immersion Entertainment, L.L.C. Audio/video programming and charging system and method
US20020057364A1 (en) 1999-05-28 2002-05-16 Anderson Tazwell L. Electronic handheld audio/video receiver and listening/viewing device
JP3461308B2 (ja) * 1999-07-30 2003-10-27 Ｎｅｃマイクロシステム株式会社 データ処理装置、その動作制御方法
UA59498C2 (uk) * 1999-12-07 2003-09-15 Інфінеон Текнолоджіс Аг Етикетка для товарів, спосіб її виготовлення та спосіб безконтактної ідентифікації товарів
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US20030112354A1 (en) * 2001-12-13 2003-06-19 Ortiz Luis M. Wireless transmission of in-play camera views to hand held devices
US7812856B2 (en) 2000-10-26 2010-10-12 Front Row Technologies, Llc Providing multiple perspectives of a venue activity to electronic wireless hand held devices
US7782363B2 (en) 2000-06-27 2010-08-24 Front Row Technologies, Llc Providing multiple video perspectives of activities through a data network to a remote multimedia server for selective display by remote viewing audiences
US8583027B2 (en) 2000-10-26 2013-11-12 Front Row Technologies, Llc Methods and systems for authorizing computing devices for receipt of venue-based data based on the location of a user
US7796162B2 (en) * 2000-10-26 2010-09-14 Front Row Technologies, Llc Providing multiple synchronized camera views for broadcast from a live venue activity to remote viewers
JP4873776B2 (ja) * 2000-11-30 2012-02-08 ソニー株式会社 非接触ｉｃカード
DE10109993A1 (de) 2001-03-01 2002-09-05 Giesecke & Devrient Gmbh Verfahren zur Herstellung eines Moduls
US20030085288A1 (en) * 2001-11-06 2003-05-08 Luu Deniel V.H. Contactless SIM card carrier with detachable antenna and carrier therefore
US7344074B2 (en) * 2002-04-08 2008-03-18 Nokia Corporation Mobile terminal featuring smart card interrupt
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US7725073B2 (en) 2002-10-07 2010-05-25 Immersion Entertainment, Llc System and method for providing event spectators with audio/video signals pertaining to remote events
FR2853115B1 (fr) * 2003-03-28 2005-05-06 A S K Procede de fabrication d'antenne de carte a puce sur un support thermoplastique et carte a puce obtenue par ledit procede
US7593687B2 (en) 2003-10-07 2009-09-22 Immersion Entertainment, Llc System and method for providing event spectators with audio/video signals pertaining to remote events
KR100579019B1 (ko) * 2003-11-10 2006-05-12 (주)이.씨테크날리지 콤비카드 제조방법
AU2005304141B2 (en) * 2004-11-02 2010-08-26 Hid Global Gmbh Laying device, contacting device, advancing system, laying and contacting unit, production system, method for the production and a transponder unit
KR100723493B1 (ko) * 2005-07-18 2007-06-04 삼성전자주식회사 와이어 본딩 및 플립 칩 본딩이 가능한 스마트 카드 모듈기판 및 이를 포함하는 스마트 카드 모듈
US8286332B2 (en) * 2006-09-26 2012-10-16 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
US8240022B2 (en) * 2006-09-26 2012-08-14 Feinics Amatech Teorowita Methods of connecting an antenna to a transponder chip
US7546671B2 (en) 2006-09-26 2009-06-16 Micromechanic And Automation Technology Ltd. Method of forming an inlay substrate having an antenna wire
US7581308B2 (en) 2007-01-01 2009-09-01 Advanced Microelectronic And Automation Technology Ltd. Methods of connecting an antenna to a transponder chip
US8322624B2 (en) * 2007-04-10 2012-12-04 Feinics Amatech Teoranta Smart card with switchable matching antenna
US7979975B2 (en) * 2007-04-10 2011-07-19 Feinics Amatech Teavanta Methods of connecting an antenna to a transponder chip
US20080179404A1 (en) * 2006-09-26 2008-07-31 Advanced Microelectronic And Automation Technology Ltd. Methods and apparatuses to produce inlays with transponders
US8608080B2 (en) * 2006-09-26 2013-12-17 Feinics Amatech Teoranta Inlays for security documents
US7971339B2 (en) * 2006-09-26 2011-07-05 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
HK1109708A2 (zh) * 2007-04-24 2008-06-13 On Track Innovations Ltd. 介面卡及仪器以及其形成工艺
US7980477B2 (en) * 2007-05-17 2011-07-19 Féinics Amatech Teoranta Dual interface inlays
DE602007010634D1 (de) * 2007-09-18 2010-12-30 Baile Na Habhann Co Galway Verfahren zur Kontaktierung eines Drahtleiters gelegt auf ein Substrat
CN101673789B (zh) * 2008-09-12 2011-08-17 光海科技股份有限公司 发光二极管封装基板结构、制法及其封装结构
TWM362572U (en) * 2009-04-13 2009-08-01 Phytrex Technology Corp Signal convertor
US8474726B2 (en) 2010-08-12 2013-07-02 Feinics Amatech Teoranta RFID antenna modules and increasing coupling
US8366009B2 (en) 2010-08-12 2013-02-05 Féinics Amatech Teoranta Coupling in and to RFID smart cards
CN102299142B (zh) * 2010-06-23 2013-06-12 环旭电子股份有限公司 具有天线的封装结构及其制作方法
US8991712B2 (en) 2010-08-12 2015-03-31 Féinics Amatech Teoranta Coupling in and to RFID smart cards
US9195932B2 (en) 2010-08-12 2015-11-24 Féinics Amatech Teoranta Booster antenna configurations and methods
US8870080B2 (en) 2010-08-12 2014-10-28 Féinics Amatech Teoranta RFID antenna modules and methods
US8789762B2 (en) 2010-08-12 2014-07-29 Feinics Amatech Teoranta RFID antenna modules and methods of making
US9112272B2 (en) 2010-08-12 2015-08-18 Feinics Amatech Teoranta Antenna modules for dual interface smart cards, booster antenna configurations, and methods
US9033250B2 (en) 2010-08-12 2015-05-19 Féinics Amatech Teoranta Dual interface smart cards, and methods of manufacturing
EP2447886A1 (fr) * 2010-10-07 2012-05-02 Gemalto SA Module électronique sécurisé, dispositif à module électronique sécurisé et procédé de fabrication
KR20140071423A (ko) 2011-09-11 2014-06-11 페이닉스 아마테크 테오란타 Ｒｆｉｄ 안테나 모듈 및 그 제조 방법
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
BR112014019291A8 (pt) 2012-02-05 2017-07-11 Feinics Amatech Teoranta Módulos da antena de rfid e métodos
DE102012205768B4 (de) * 2012-04-10 2019-02-21 Smartrac Ip B.V. Transponderlage und Verfahren zu deren Herstellung
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD703208S1 (en) 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
USD701864S1 (en) * 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
DE102014107299B4 (de) 2014-05-23 2019-03-28 Infineon Technologies Ag Chipkartenmodul, Chipkarte, und Verfahren zum Herstellen eines Chipkartenmoduls
US10888940B1 (en) 2019-12-20 2021-01-12 Capital One Services, Llc Systems and methods for saw tooth milling to prevent chip fraud
US10817768B1 (en) 2019-12-20 2020-10-27 Capital One Services, Llc Systems and methods for preventing chip fraud by inserts in chip pocket
US10977539B1 (en) 2019-12-20 2021-04-13 Capital One Services, Llc Systems and methods for use of capacitive member to prevent chip fraud
US11049822B1 (en) 2019-12-20 2021-06-29 Capital One Services, Llc Systems and methods for the use of fraud prevention fluid to prevent chip fraud
US10810475B1 (en) 2019-12-20 2020-10-20 Capital One Services, Llc Systems and methods for overmolding a card to prevent chip fraud
US11715103B2 (en) 2020-08-12 2023-08-01 Capital One Services, Llc Systems and methods for chip-based identity verification and transaction authentication
EP4203018A1 (en) 2021-12-23 2023-06-28 Infineon Technologies AG Bus bar, power semiconductor module arrangement comprising a bus bar, and method for producing a bus bar

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Also Published As

Publication number Publication date
DE19632813A1 (de) 1998-02-19
DE19632813C2 (de) 2000-11-02
JP2000501535A (ja) 2000-02-08
WO1998007115A1 (de) 1998-02-19
UA52673C2 (uk) 2003-01-15
EP0919041A1 (de) 1999-06-02
KR100358578B1 (ko) 2002-10-25
EP0919041B1 (de) 2001-11-28
RU2161331C2 (ru) 2000-12-27
US6095423A (en) 2000-08-01
BR9711161A (pt) 2000-01-11
ES2171274T3 (es) 2002-09-01
CN1233334A (zh) 1999-10-27
KR20000029989A (ko) 2000-05-25
ATE209800T1 (de) 2001-12-15
DE59705575D1 (de) 2002-01-10
CN1143381C (zh) 2004-03-24
JP3262804B2 (ja) 2002-03-04

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