IN168603B - - Google Patents
Info
- Publication number
- IN168603B IN168603B IN246/BOM/88A IN246BO1988A IN168603B IN 168603 B IN168603 B IN 168603B IN 246BO1988 A IN246BO1988 A IN 246BO1988A IN 168603 B IN168603 B IN 168603B
- Authority
- IN
- India
- Prior art keywords
- bath
- cathode
- anode
- metal
- plated
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/16—Regeneration of process solutions
- C25D21/18—Regeneration of process solutions of electrolytes
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrolytic Production Of Metals (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/093,664 US4778572A (en) | 1987-09-08 | 1987-09-08 | Process for electroplating metals |
Publications (1)
Publication Number | Publication Date |
---|---|
IN168603B true IN168603B (de) | 1991-05-04 |
Family
ID=22240108
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IN246/BOM/88A IN168603B (de) | 1987-09-08 | 1988-08-29 |
Country Status (12)
Country | Link |
---|---|
US (1) | US4778572A (de) |
EP (1) | EP0307161B1 (de) |
JP (1) | JPH01159395A (de) |
KR (1) | KR890005305A (de) |
CN (1) | CN1033079A (de) |
AT (1) | ATE97453T1 (de) |
AU (1) | AU600878B2 (de) |
BR (1) | BR8804681A (de) |
CA (1) | CA1330963C (de) |
DE (1) | DE3885682T2 (de) |
ES (1) | ES2049750T3 (de) |
IN (1) | IN168603B (de) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4906340A (en) * | 1989-05-31 | 1990-03-06 | Eco-Tec Limited | Process for electroplating metals |
USRE34191E (en) * | 1989-05-31 | 1993-03-09 | Eco-Tec Limited | Process for electroplating metals |
US5108615A (en) * | 1989-11-28 | 1992-04-28 | Bio-Recovery Systems, Inc. | Method for recovery of a metal ion from electroless plating solutions |
DE4032856A1 (de) * | 1990-10-13 | 1992-04-16 | Schering Ag | Membranelektrolysemodul |
CA2053342A1 (en) * | 1990-10-22 | 1992-04-23 | Robert A. Tremmel | Nickel electroplating process with reduced nickel ion build up |
US5162079A (en) * | 1991-01-28 | 1992-11-10 | Eco-Tec Limited | Process and apparatus for control of electroplating bath composition |
DE4238956A1 (de) * | 1992-06-30 | 1994-05-19 | Schering Ag | Verwendung von wasserlöslichen organischen Verbindungen als Zusätze im Anolyten in galvanischen Metallabscheidungsbädern |
DE4221970C2 (de) * | 1992-06-30 | 1996-01-18 | Atotech Deutschland Gmbh | Verfahren zur Vermeidung der Halogengasentwicklung in Metallabscheidungsbädern mit mindestens zwei Elektrolyträumen |
US5401379A (en) * | 1993-03-19 | 1995-03-28 | Mazzochi; James L. | Chrome plating process |
US6024856A (en) * | 1997-10-10 | 2000-02-15 | Enthone-Omi, Inc. | Copper metallization of silicon wafers using insoluble anodes |
US8236159B2 (en) * | 1999-04-13 | 2012-08-07 | Applied Materials Inc. | Electrolytic process using cation permeable barrier |
US8852417B2 (en) | 1999-04-13 | 2014-10-07 | Applied Materials, Inc. | Electrolytic process using anion permeable barrier |
US7264698B2 (en) | 1999-04-13 | 2007-09-04 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
US20060157355A1 (en) * | 2000-03-21 | 2006-07-20 | Semitool, Inc. | Electrolytic process using anion permeable barrier |
US7438788B2 (en) | 1999-04-13 | 2008-10-21 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
US6581984B1 (en) | 1999-09-27 | 2003-06-24 | Seongho Csp, Ltd. | Corrugated spiral pipe with a coupling device and method for installing the same |
US20060189129A1 (en) * | 2000-03-21 | 2006-08-24 | Semitool, Inc. | Method for applying metal features onto barrier layers using ion permeable barriers |
US7273535B2 (en) * | 2003-09-17 | 2007-09-25 | Applied Materials, Inc. | Insoluble anode with an auxiliary electrode |
US6755960B1 (en) | 2000-06-15 | 2004-06-29 | Taskem Inc. | Zinc-nickel electroplating |
ES2250166T5 (es) | 2000-06-15 | 2016-05-20 | Coventya Inc | Electrochapado de zinc-níquel |
US6576110B2 (en) * | 2000-07-07 | 2003-06-10 | Applied Materials, Inc. | Coated anode apparatus and associated method |
ES2300670T3 (es) * | 2000-08-18 | 2008-06-16 | Ti Group Automotive Systems Limited | Metodo de metalizado de una tira metalica para su uso en la fabricacion de un tubo de paredes multiples. |
US8377283B2 (en) * | 2002-11-25 | 2013-02-19 | Coventya, Inc. | Zinc and zinc-alloy electroplating |
EP1884278A1 (de) * | 2006-07-24 | 2008-02-06 | ATOTECH Deutschland GmbH | Spülvorrichtung und -verfahren für das Spülen von Flüssigkeiten von Werkstücken |
US8262894B2 (en) * | 2009-04-30 | 2012-09-11 | Moses Lake Industries, Inc. | High speed copper plating bath |
TW201137186A (en) * | 2010-04-28 | 2011-11-01 | Thingwell Entpr Co Ltd | Pull-plating apparatus |
DE102010055143B4 (de) * | 2010-12-18 | 2022-12-01 | Umicore Galvanotechnik Gmbh | Direktkontakt-Membrananode für die Verwendung in Elektrolysezellen |
US9005409B2 (en) | 2011-04-14 | 2015-04-14 | Tel Nexx, Inc. | Electro chemical deposition and replenishment apparatus |
US9017528B2 (en) | 2011-04-14 | 2015-04-28 | Tel Nexx, Inc. | Electro chemical deposition and replenishment apparatus |
US20140106179A1 (en) * | 2012-10-17 | 2014-04-17 | Raytheon Company | Plating design and process for improved hermeticity and thermal conductivity of gold-germanium solder joints |
US9359688B1 (en) * | 2012-12-05 | 2016-06-07 | Novellus Systems, Inc. | Apparatuses and methods for controlling PH in electroplating baths |
US10190232B2 (en) | 2013-08-06 | 2019-01-29 | Lam Research Corporation | Apparatuses and methods for maintaining pH in nickel electroplating baths |
US9303329B2 (en) | 2013-11-11 | 2016-04-05 | Tel Nexx, Inc. | Electrochemical deposition apparatus with remote catholyte fluid management |
US9732434B2 (en) | 2014-04-18 | 2017-08-15 | Lam Research Corporation | Methods and apparatuses for electroplating nickel using sulfur-free nickel anodes |
CN106460224A (zh) * | 2014-06-25 | 2017-02-22 | 新日铁住金株式会社 | 篮筐型正极 |
US10167561B2 (en) * | 2016-12-15 | 2019-01-01 | John Christopher Burtch | Method and apparatus for producing hydrogen having reversible electrodes |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4328076A (en) * | 1980-09-02 | 1982-05-04 | The International Nickel Co., Inc. | Electrode and sludge collector support device and electroplating therewith |
US4514266A (en) * | 1981-09-11 | 1985-04-30 | Republic Steel Corporation | Method and apparatus for electroplating |
ES8801394A1 (es) * | 1984-07-02 | 1987-05-16 | Diaz Nogueira Eduardo | Procedimiento para la electrodeposicion catodica de metales con la generacion del acido correspondiente, a partir de disoluciones de sus sales |
-
1987
- 1987-09-08 US US07/093,664 patent/US4778572A/en not_active Expired - Lifetime
-
1988
- 1988-07-07 CA CA000571461A patent/CA1330963C/en not_active Expired - Fee Related
- 1988-08-29 IN IN246/BOM/88A patent/IN168603B/en unknown
- 1988-09-06 ES ES88308221T patent/ES2049750T3/es not_active Expired - Lifetime
- 1988-09-06 DE DE88308221T patent/DE3885682T2/de not_active Expired - Fee Related
- 1988-09-06 EP EP88308221A patent/EP0307161B1/de not_active Expired - Lifetime
- 1988-09-06 BR BR8804681A patent/BR8804681A/pt not_active Application Discontinuation
- 1988-09-06 AT AT88308221T patent/ATE97453T1/de not_active IP Right Cessation
- 1988-09-07 KR KR1019880011547A patent/KR890005305A/ko not_active Application Discontinuation
- 1988-09-07 CN CN88106501A patent/CN1033079A/zh active Pending
- 1988-09-08 AU AU21999/88A patent/AU600878B2/en not_active Ceased
- 1988-09-08 JP JP63225499A patent/JPH01159395A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
EP0307161B1 (de) | 1993-11-18 |
EP0307161A3 (en) | 1989-04-26 |
US4778572A (en) | 1988-10-18 |
ES2049750T3 (es) | 1994-05-01 |
AU2199988A (en) | 1989-03-23 |
CA1330963C (en) | 1994-07-26 |
DE3885682T2 (de) | 1994-04-28 |
EP0307161A2 (de) | 1989-03-15 |
BR8804681A (pt) | 1989-04-18 |
KR890005305A (ko) | 1989-05-13 |
JPH0514799B2 (de) | 1993-02-25 |
DE3885682D1 (de) | 1993-12-23 |
JPH01159395A (ja) | 1989-06-22 |
CN1033079A (zh) | 1989-05-24 |
ATE97453T1 (de) | 1993-12-15 |
AU600878B2 (en) | 1990-08-23 |
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