IN168328B - - Google Patents
Info
- Publication number
- IN168328B IN168328B IN446/CAL/87A IN446CA1987A IN168328B IN 168328 B IN168328 B IN 168328B IN 446CA1987 A IN446CA1987 A IN 446CA1987A IN 168328 B IN168328 B IN 168328B
- Authority
- IN
- India
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US87721186A | 1986-06-20 | 1986-06-20 | |
| US4160687A | 1987-04-23 | 1987-04-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IN168328B true IN168328B (US07645872-20100112-C00018.png) | 1991-03-16 |
Family
ID=26718334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IN446/CAL/87A IN168328B (US07645872-20100112-C00018.png) | 1986-06-20 | 1987-06-09 |
Country Status (7)
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5403465A (en) * | 1990-05-30 | 1995-04-04 | Gould Inc. | Electrodeposited copper foil and process for making same using electrolyte solutions having controlled additions of chloride ions and organic additives |
| KR100275899B1 (ko) * | 1990-05-30 | 2000-12-15 | 마이클 에이. 센타니 | 전착구리호일 및 클로라이드(chloride) 이온농도가 낮은 전해액을 사용하여 이를 제조하는 방법 |
| US5431803A (en) * | 1990-05-30 | 1995-07-11 | Gould Electronics Inc. | Electrodeposited copper foil and process for making same |
| US5779870A (en) * | 1993-03-05 | 1998-07-14 | Polyclad Laminates, Inc. | Method of manufacturing laminates and printed circuit boards |
| ATE193176T1 (de) * | 1993-03-05 | 2000-06-15 | Polyclad Laminates Inc | Trommelseite-behandelte metallfolie und laminat zur verwendung in leiterplatten und verfahren zur herstellung |
| JP2762386B2 (ja) * | 1993-03-19 | 1998-06-04 | 三井金属鉱業株式会社 | 銅張り積層板およびプリント配線板 |
| JPH08222857A (ja) * | 1995-02-16 | 1996-08-30 | Mitsui Mining & Smelting Co Ltd | 銅箔および該銅箔を内層回路用に用いた高密度多層プリント回路基板 |
| TW432124B (en) * | 1996-05-13 | 2001-05-01 | Mitsui Mining & Amp Smelting C | Electrolytic copper foil with high post heat tensile strength and its manufacturing method |
| JP3258308B2 (ja) * | 2000-02-03 | 2002-02-18 | 株式会社日鉱マテリアルズ | レーザー穴開け性に優れた銅箔及びその製造方法 |
| ES2203324B1 (es) | 2002-05-23 | 2005-02-16 | Antonio Rodriguez Siurana | Lamina de cobre, material laminar compuesto que comprende dicha lamina de cobre y procedimiento para su obtencion. |
| TWI396779B (zh) * | 2005-02-21 | 2013-05-21 | Copper foil and its manufacturing method, and flexible printed circuit board | |
| CN111485260B (zh) * | 2020-04-30 | 2020-12-08 | 广东嘉元科技股份有限公司 | 二次电池用低翘曲电解铜箔、制造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5016624A (US07645872-20100112-C00018.png) * | 1973-06-08 | 1975-02-21 | ||
| US3900383A (en) * | 1974-07-24 | 1975-08-19 | Nat Steel Corp | Apparatus for electroplating |
| GB8333752D0 (en) * | 1983-12-19 | 1984-01-25 | Thorpe J E | Matte surface on metal layer |
| US4549940A (en) * | 1984-04-23 | 1985-10-29 | Karwan Steven J | Method for surface treating copper foil |
| EP0181430A1 (en) * | 1984-11-13 | 1986-05-21 | Olin Corporation | Systems for producing electroplated and/or treated metal foil |
| US4572768A (en) * | 1985-06-28 | 1986-02-25 | Square D Company | Treatment for copper foil |
-
1987
- 1987-06-05 AU AU73865/87A patent/AU579517B2/en not_active Ceased
- 1987-06-09 IN IN446/CAL/87A patent/IN168328B/en unknown
- 1987-06-15 EP EP87305291A patent/EP0250195A3/en not_active Withdrawn
- 1987-06-18 DK DK311387A patent/DK311387A/da not_active Application Discontinuation
- 1987-06-19 CN CN198787104293A patent/CN87104293A/zh active Pending
- 1987-06-19 BR BR8703504A patent/BR8703504A/pt unknown
- 1987-06-20 KR KR1019870006272A patent/KR880000625A/ko not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| KR880000625A (ko) | 1988-03-28 |
| AU7386587A (en) | 1988-01-07 |
| CN87104293A (zh) | 1988-03-16 |
| AU579517B2 (en) | 1988-11-24 |
| EP0250195A2 (en) | 1987-12-23 |
| BR8703504A (pt) | 1988-03-22 |
| DK311387A (da) | 1987-12-21 |
| EP0250195A3 (en) | 1988-08-31 |
| DK311387D0 (da) | 1987-06-18 |
