IL97655A0 - Protected conductive foil assemblage and procedure for preparing same using static electricity - Google Patents
Protected conductive foil assemblage and procedure for preparing same using static electricityInfo
- Publication number
- IL97655A0 IL97655A0 IL97655A IL9765591A IL97655A0 IL 97655 A0 IL97655 A0 IL 97655A0 IL 97655 A IL97655 A IL 97655A IL 9765591 A IL9765591 A IL 9765591A IL 97655 A0 IL97655 A0 IL 97655A0
- Authority
- IL
- Israel
- Prior art keywords
- procedure
- static electricity
- conductive foil
- preparing same
- protected conductive
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2310/00—Treatment by energy or chemical effects
- B32B2310/021—Treatment by energy or chemical effects using electrical effects
- B32B2310/025—Electrostatic charges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/12—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2367/00—Polyesters, e.g. PET, i.e. polyethylene terephthalate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/23—Sheet including cover or casing
- Y10T428/239—Complete cover or casing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31—Surface property or characteristic of web, sheet or block
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31692—Next to addition polymer from unsaturated monomers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31786—Of polyester [e.g., alkyd, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Quality & Reliability (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/501,093 US5167997A (en) | 1989-05-05 | 1990-03-29 | Protected conductive foil assemblage and procedure for preparing same using static electrical forces |
Publications (1)
Publication Number | Publication Date |
---|---|
IL97655A0 true IL97655A0 (en) | 1992-06-21 |
Family
ID=23992121
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL97655A IL97655A0 (en) | 1990-03-29 | 1991-03-22 | Protected conductive foil assemblage and procedure for preparing same using static electricity |
Country Status (10)
Country | Link |
---|---|
US (1) | US5167997A (fr) |
EP (1) | EP0449647A1 (fr) |
JP (1) | JPH04221629A (fr) |
KR (1) | KR910017918A (fr) |
CN (1) | CN1055322A (fr) |
AU (1) | AU645299B2 (fr) |
BR (1) | BR9101249A (fr) |
CA (1) | CA2039557A1 (fr) |
IE (1) | IE910855A1 (fr) |
IL (1) | IL97655A0 (fr) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU2527292A (en) * | 1991-10-01 | 1993-04-08 | Gould Electronics Inc | Improved protected conductive foil assemblage and procedure for preparing same using static electrical forces |
JP3319650B2 (ja) * | 1994-03-30 | 2002-09-03 | 三井金属鉱業株式会社 | 銅張積層板用銅箔 |
US5989377A (en) * | 1994-07-08 | 1999-11-23 | Metallized Products, Inc. | Method of protecting the surface of foil and other thin sheet materials before and during high-temperature and high pressure laminating |
US5635000A (en) * | 1995-12-22 | 1997-06-03 | International Business Machines Corporation | Method for screening using electrostatic adhesion |
US6770380B2 (en) | 1998-08-11 | 2004-08-03 | Nikko Materials Usa, Inc. | Resin/copper/metal laminate and method of producing same |
SE513341C2 (sv) | 1998-10-06 | 2000-08-28 | Ericsson Telefon Ab L M | Arrangemang med tryckta kretskort samt metod för tillverkning därav |
US6447929B1 (en) | 2000-08-29 | 2002-09-10 | Gould Electronics Inc. | Thin copper on usable carrier and method of forming same |
US6591560B2 (en) * | 2001-03-09 | 2003-07-15 | Milliken & Company | Electrostatic dissipating flooring article |
US6770976B2 (en) | 2002-02-13 | 2004-08-03 | Nikko Materials Usa, Inc. | Process for manufacturing copper foil on a metal carrier substrate |
US6921451B2 (en) * | 2002-06-28 | 2005-07-26 | Metallized Products, Inc. | Method of and apparatus for protecting thin copper foil and other shiny substrates during handling and rigorous processing, as pcb manufacture and the like, by electric-charge adherence thereto of thin release-layered plastic films and the like, and improved products produced thereby |
US20040112516A1 (en) * | 2002-12-13 | 2004-06-17 | Metallized Products, Inc. | Method and apparatus for electric-charge adhering of thin release-layered plastic firlms to thin copper foil substrates and the like and improved products thereby produced |
US8569621B1 (en) * | 2005-11-08 | 2013-10-29 | Hubbell Incorporated | Electrical device cover |
CN101340775B (zh) * | 2007-07-06 | 2010-06-09 | 鸿富锦精密工业(深圳)有限公司 | 软性电路板及其制造方法 |
CN101878678A (zh) | 2007-09-28 | 2010-11-03 | 三星层板有限公司 | 用于在印刷电路板中钻孔的改进系统和方法 |
JP5504064B2 (ja) * | 2010-06-16 | 2014-05-28 | 日本発條株式会社 | 回路基板用積層板及び金属ベース回路基板の製造方法 |
TW201302551A (zh) * | 2011-07-12 | 2013-01-16 | Hon Hai Prec Ind Co Ltd | 導光板保護膜貼附及撕除裝置及方法 |
NL2007783C2 (en) * | 2011-11-14 | 2013-05-16 | Fuji Seal Europe Bv | Sleeving device and method for arranging tubular sleeves around containers. |
CN104528452B (zh) * | 2014-12-31 | 2016-11-30 | 重庆瑞美服装有限公司 | 静电折布机 |
CN109130162B (zh) * | 2018-08-31 | 2024-05-10 | 合肥泰沃达智能装备有限公司 | 一种导光板加工用手动覆膜机 |
US12035466B2 (en) * | 2020-09-25 | 2024-07-09 | Apple Inc. | Systems and methods for manufacturing thin substrate |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US446188A (en) * | 1891-02-10 | mcdonough | ||
US2668348A (en) * | 1950-09-09 | 1954-02-09 | Robertson Co H H | Protected metal article |
US2706165A (en) * | 1953-05-14 | 1955-04-12 | Tee Pak Inc | Sealing method |
NL108819C (fr) * | 1956-01-30 | |||
US3354015A (en) * | 1964-08-14 | 1967-11-21 | Dow Chemical Co | Method of protecting polished metal surfaces |
US3589975A (en) * | 1967-03-23 | 1971-06-29 | Reynolds Metals Co | Composite sheet of plastic and metallic material and method of making the same |
US3647592A (en) * | 1968-07-24 | 1972-03-07 | Mallory & Co Inc P R | Polyester bonding process |
GB1302590A (fr) * | 1969-09-10 | 1973-01-10 | ||
US4022648A (en) * | 1972-08-07 | 1977-05-10 | P. R. Mallory & Co., Inc. | Bonding of organic thermoplastic materials |
US4179324A (en) * | 1977-11-28 | 1979-12-18 | Spire Corporation | Process for fabricating thin film and glass sheet laminate |
US4228481A (en) * | 1978-10-19 | 1980-10-14 | General Electric Company | Capacitor with embossed foil electrode |
US4348712A (en) * | 1978-10-18 | 1982-09-07 | General Electric Company | Capacitor with embossed electrodes |
US4669468A (en) * | 1979-06-15 | 1987-06-02 | American Hospital Supply Corporation | Capacitively coupled indifferent electrode |
US4446188A (en) * | 1979-12-20 | 1984-05-01 | The Mica Corporation | Multi-layered circuit board |
DE3145721A1 (de) * | 1981-11-19 | 1983-05-26 | Helmuth 2058 Lauenburg Schmoock | Verfahren zum herstellen von gedruckten schaltungen |
JPS606232A (ja) * | 1983-06-24 | 1985-01-12 | Fujitsu Ten Ltd | 線状体の曲げ工具 |
IL73403A0 (en) * | 1984-01-09 | 1985-02-28 | Stauffer Chemical Co | Transfer laminates and their use for forming a metal layer on a support |
JPH0641627B2 (ja) * | 1984-02-03 | 1994-06-01 | 株式会社ニコン | 反射構造体 |
DE3413434A1 (de) * | 1984-04-10 | 1985-10-17 | Dielektra GmbH, 5000 Köln | Verfahren zum kontinuierlichen herstellen von kupferkaschiertem basismaterial fuer leiterplatten |
IL80277A0 (en) * | 1985-10-15 | 1987-01-30 | President Eng Corp | Process for the production of prepregs and metal-laminated base material for circuit boards,and apparatus for carrying out this process |
US4659425A (en) * | 1986-02-03 | 1987-04-21 | Ibm Corporation | Continuous process for the manufacture of printed circuit boards |
EP0395871A3 (fr) * | 1989-05-05 | 1991-09-18 | Gould Electronics Inc. | Feuille conductrice protégée et procédé de protection d'une feuille métallique électrodéposée pendant des opérations ultérieures |
-
1990
- 1990-03-29 US US07/501,093 patent/US5167997A/en not_active Expired - Lifetime
-
1991
- 1991-03-14 IE IE085591A patent/IE910855A1/en unknown
- 1991-03-22 IL IL97655A patent/IL97655A0/xx unknown
- 1991-03-27 AU AU73844/91A patent/AU645299B2/en not_active Expired - Fee Related
- 1991-03-28 BR BR919101249A patent/BR9101249A/pt not_active Application Discontinuation
- 1991-03-28 EP EP91302797A patent/EP0449647A1/fr not_active Withdrawn
- 1991-03-29 KR KR1019910005187A patent/KR910017918A/ko not_active Application Discontinuation
- 1991-03-29 CN CN91101946A patent/CN1055322A/zh active Pending
- 1991-03-29 JP JP3067160A patent/JPH04221629A/ja not_active Withdrawn
- 1991-04-02 CA CA002039557A patent/CA2039557A1/fr not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
KR910017918A (ko) | 1991-11-05 |
EP0449647A1 (fr) | 1991-10-02 |
AU645299B2 (en) | 1994-01-13 |
CA2039557A1 (fr) | 1991-09-30 |
JPH04221629A (ja) | 1992-08-12 |
AU7384491A (en) | 1991-10-03 |
CN1055322A (zh) | 1991-10-16 |
IE910855A1 (en) | 1991-10-09 |
BR9101249A (pt) | 1991-11-05 |
US5167997A (en) | 1992-12-01 |
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