IL97183A0 - Method and arrangement for automatic monitoring of space shape data in the production of semi conductor parts - Google Patents

Method and arrangement for automatic monitoring of space shape data in the production of semi conductor parts

Info

Publication number
IL97183A0
IL97183A0 IL97183A IL9718391A IL97183A0 IL 97183 A0 IL97183 A0 IL 97183A0 IL 97183 A IL97183 A IL 97183A IL 9718391 A IL9718391 A IL 9718391A IL 97183 A0 IL97183 A0 IL 97183A0
Authority
IL
Israel
Prior art keywords
arrangement
production
shape data
automatic monitoring
conductor parts
Prior art date
Application number
IL97183A
Other languages
English (en)
Original Assignee
Abos Automation Bildverarbeitu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Abos Automation Bildverarbeitu filed Critical Abos Automation Bildverarbeitu
Publication of IL97183A0 publication Critical patent/IL97183A0/xx

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]

Landscapes

  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
IL97183A 1990-02-09 1991-02-07 Method and arrangement for automatic monitoring of space shape data in the production of semi conductor parts IL97183A0 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4003983A DE4003983C1 (en) 1990-02-09 1990-02-09 Automated monitoring of space=shape data for mfg. semiconductors - compares image signals for defined illumination angle range with master signals, to determine defects

Publications (1)

Publication Number Publication Date
IL97183A0 true IL97183A0 (en) 1992-05-25

Family

ID=6399803

Family Applications (1)

Application Number Title Priority Date Filing Date
IL97183A IL97183A0 (en) 1990-02-09 1991-02-07 Method and arrangement for automatic monitoring of space shape data in the production of semi conductor parts

Country Status (5)

Country Link
EP (1) EP0514393A1 (de)
JP (1) JPH05508702A (de)
DE (1) DE4003983C1 (de)
IL (1) IL97183A0 (de)
WO (1) WO1991012489A1 (de)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2845601B2 (ja) * 1990-10-09 1999-01-13 株式会社東芝 ワイヤボンディング外観検査装置
US5825945A (en) * 1992-05-15 1998-10-20 Unisys Corp Document imaging with illumination from lambertian surfaces
DE4239039C2 (de) * 1992-11-20 2001-08-16 Hesse Gmbh Verfahren zur Erfassung der Daten von Bondpads zur Steuerung eines Bonders
US5446549A (en) * 1993-01-14 1995-08-29 The United States Of America As Represented By The Secretary Of The Navy Method and apparatus for noncontact surface contour measurement
DE4413832C2 (de) * 1994-04-20 2000-05-31 Siemens Ag Vorrichtungen zur Kontrolle von Halbleiterscheiben
DE4413831C2 (de) * 1994-04-20 2000-05-31 Siemens Ag Verfahren zur Kontrolle von Halbleiterscheiben
IE80676B1 (en) * 1996-08-02 1998-11-18 M V Research Limited A measurement system
GB2316168B (en) * 1996-08-06 2000-04-12 M V Research Limited A measurement system
DE19652124C2 (de) * 1996-12-14 2002-10-17 Micronas Gmbh Verfahren und Vorrichtung zum automatischen Überprüfen von Positionsdaten j-förmiger elektrischer Kontaktanschlüsse
US6055054A (en) * 1997-05-05 2000-04-25 Beaty; Elwin M. Three dimensional inspection system
US5909285A (en) * 1997-05-05 1999-06-01 Beaty; Elwin M. Three dimensional inspection system
US6915007B2 (en) 1998-01-16 2005-07-05 Elwin M. Beaty Method and apparatus for three dimensional inspection of electronic components
US6072898A (en) 1998-01-16 2000-06-06 Beaty; Elwin M. Method and apparatus for three dimensional inspection of electronic components
US6915006B2 (en) 1998-01-16 2005-07-05 Elwin M. Beaty Method and apparatus for three dimensional inspection of electronic components
DE10026301A1 (de) * 2000-05-26 2001-11-29 Sick Ag Verfahren und Vorrichtung zur Bildverarbeitung
DE10128476C2 (de) * 2001-06-12 2003-06-12 Siemens Dematic Ag Optische Sensorvorrichtung zur visuellen Erfassung von Substraten
DE10208978B4 (de) * 2002-02-28 2005-06-23 Robert Bosch Gmbh Verfahren und Vorrichtung zur Bestimmung eines Höhenverlaufs einer Drahtverbindung
DE10250705A1 (de) 2002-10-31 2004-05-13 Bayerische Motoren Werke Ag Verfahren und Vorrichtung zur Schattenkompensation in digitalen Bildern
US7823789B2 (en) 2004-12-21 2010-11-02 Cognex Technology And Investment Corporation Low profile illumination for direct part mark readers
US7823783B2 (en) 2003-10-24 2010-11-02 Cognex Technology And Investment Corporation Light pipe illumination system and method
US7604174B2 (en) 2003-10-24 2009-10-20 Cognex Technology And Investment Corporation Method and apparatus for providing omnidirectional lighting in a scanning device
US9536124B1 (en) 2003-10-24 2017-01-03 Cognex Corporation Integrated illumination assembly for symbology reader
US7874487B2 (en) 2005-10-24 2011-01-25 Cognex Technology And Investment Corporation Integrated illumination assembly for symbology reader
US9070031B2 (en) 2003-10-24 2015-06-30 Cognex Technology And Investment Llc Integrated illumination assembly for symbology reader
US7617984B2 (en) 2004-12-16 2009-11-17 Cognex Technology And Investment Corporation Hand held symbology reader illumination diffuser
US9292724B1 (en) 2004-12-16 2016-03-22 Cognex Corporation Hand held symbology reader illumination diffuser with aimer optics
EP1675453A3 (de) * 2004-12-22 2007-07-11 Siemens Aktiengesellschaft Vorrichtung zum Beleuchten von Objekten, Sensorvorrichtung
US9234852B2 (en) 2005-07-29 2016-01-12 Mitutoyo Corporation Systems and methods for controlling strobe illumination
US8045002B2 (en) 2005-07-29 2011-10-25 Mitutoyo Corporation Systems and methods for controlling strobe illumination
JP4740826B2 (ja) * 2006-02-23 2011-08-03 株式会社神戸製鋼所 形状測定装置、形状測定方法
DE102006015714B4 (de) * 2006-04-04 2019-09-05 Applied Materials Gmbh Lichtunterstütztes Testen eines optoelektronischen Moduls
JP6050928B2 (ja) * 2011-05-02 2016-12-21 ローム株式会社 ワイヤボンディング構造の製造方法
DE102014205701A1 (de) * 2014-03-27 2015-10-01 Robert Bosch Gmbh Verfahren und Vorrichtung zur Bestimmung der Position und/oder Orientierung zumindest eines Steckkontakts
KR20220049482A (ko) * 2020-10-14 2022-04-21 이미지 이큅먼트 피티이. 엘티디. 오버랩된 본드 와이어의 루프 길이 측정

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3834819A (en) * 1973-07-05 1974-09-10 Western Electric Co Thickness measuring
DE2929846A1 (de) * 1979-07-23 1981-03-12 Siemens AG, 1000 Berlin und 8000 München Opto-elektronisches pruefsystem zur automatischen beschaffenheitspruefung von leiterplatten, deren zwischenprodukte und druckwerkzeuge
JPS58219441A (ja) * 1982-06-15 1983-12-20 Hajime Sangyo Kk 凸面体の表面欠陥検査装置
DE3337251A1 (de) * 1983-10-13 1985-04-25 Gerd Dipl.-Phys. Dr. 8520 Erlangen Häusler Optisches abtastverfahren zur dreidimensionalen vermessung von objekten
US4648053A (en) * 1984-10-30 1987-03-03 Kollmorgen Technologies, Corp. High speed optical inspection system
JPS6282314A (ja) * 1985-10-08 1987-04-15 Hitachi Ltd 光度差ステレオ計測方式
US4728195A (en) * 1986-03-19 1988-03-01 Cognex Corporation Method for imaging printed circuit board component leads
US4875778A (en) * 1987-02-08 1989-10-24 Luebbe Richard J Lead inspection system for surface-mounted circuit packages
JPH0682102B2 (ja) * 1987-02-27 1994-10-19 三菱電機株式会社 パターン欠陥検査装置及びパターン欠陥検査方法

Also Published As

Publication number Publication date
DE4003983C1 (en) 1991-08-29
WO1991012489A1 (de) 1991-08-22
JPH05508702A (ja) 1993-12-02
EP0514393A1 (de) 1992-11-25

Similar Documents

Publication Publication Date Title
IL97183A0 (en) Method and arrangement for automatic monitoring of space shape data in the production of semi conductor parts
US5031111C1 (en) Automated circuit design method
GB2150367B (en) Contact-spring sockets and process for making them
DE3573932D1 (en) Shape memory alloy and method for producing the same
GB2146607B (en) Micropcapsules and method for their production
IL84752A0 (en) Anatomical models and methods for manufacturing such models
EP0159593A3 (en) Electrical connector and method for making the same
EP0135942A3 (en) Semiconductor memory and method of producing the same
EP0482669A3 (en) Electrical connector and method therefor
DE3465834D1 (en) Method of making super-conductors
EP0187596A3 (en) Semiconductor memory device and method for producing the same
DE3479069D1 (en) Battery and process for its production
EP0144900A3 (en) An electrically programmable memory device and a method for making the same
GB2221062B (en) Production line equipment modification method and production line equipment
EP0469798A3 (en) Micropin array and production method thereof
YU152084A (en) Process for producing large and equalised granuled aluminiumtrihydroxide
DE3480197D1 (en) 5-alkylidene-2-halo-4-substituted-2-cyclopentenone and process for production thereof
PL278104A1 (en) N-sulfonylo-carbamides production method
EP0350855A3 (en) Commutator and process for manufacturing same
KR970000158B1 (en) Foil-roll electronic part and method for manufacturing that
HK70796A (en) Method for manufacturing connecting means for electrical information containin signals
DE3380179D1 (en) Flat insulating fabric and method for its production
EP0143460A3 (en) Semiconductor laser device and production method thereof
GB8411803D0 (en) Manufacturing method
EP0137575A3 (en) Grafted polyalphaolefins and method for producing same