IL97183A0 - Method and arrangement for automatic monitoring of space shape data in the production of semi conductor parts - Google Patents

Method and arrangement for automatic monitoring of space shape data in the production of semi conductor parts

Info

Publication number
IL97183A0
IL97183A0 IL97183A IL9718391A IL97183A0 IL 97183 A0 IL97183 A0 IL 97183A0 IL 97183 A IL97183 A IL 97183A IL 9718391 A IL9718391 A IL 9718391A IL 97183 A0 IL97183 A0 IL 97183A0
Authority
IL
Israel
Prior art keywords
arrangement
production
shape data
automatic monitoring
conductor parts
Prior art date
Application number
IL97183A
Original Assignee
Abos Automation Bildverarbeitu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Abos Automation Bildverarbeitu filed Critical Abos Automation Bildverarbeitu
Publication of IL97183A0 publication Critical patent/IL97183A0/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
IL97183A 1990-02-09 1991-02-07 Method and arrangement for automatic monitoring of space shape data in the production of semi conductor parts IL97183A0 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4003983A DE4003983C1 (en) 1990-02-09 1990-02-09 Automated monitoring of space=shape data for mfg. semiconductors - compares image signals for defined illumination angle range with master signals, to determine defects

Publications (1)

Publication Number Publication Date
IL97183A0 true IL97183A0 (en) 1992-05-25

Family

ID=6399803

Family Applications (1)

Application Number Title Priority Date Filing Date
IL97183A IL97183A0 (en) 1990-02-09 1991-02-07 Method and arrangement for automatic monitoring of space shape data in the production of semi conductor parts

Country Status (5)

Country Link
EP (1) EP0514393A1 (en)
JP (1) JPH05508702A (en)
DE (1) DE4003983C1 (en)
IL (1) IL97183A0 (en)
WO (1) WO1991012489A1 (en)

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JP2845601B2 (en) * 1990-10-09 1999-01-13 株式会社東芝 Wire bonding inspection system
US5825945A (en) * 1992-05-15 1998-10-20 Unisys Corp Document imaging with illumination from lambertian surfaces
DE4239039C2 (en) * 1992-11-20 2001-08-16 Hesse Gmbh Method for acquiring data from bond pads for controlling a bonder
US5446549A (en) * 1993-01-14 1995-08-29 The United States Of America As Represented By The Secretary Of The Navy Method and apparatus for noncontact surface contour measurement
DE4413831C2 (en) * 1994-04-20 2000-05-31 Siemens Ag Method for checking semiconductor wafers
DE4413832C2 (en) * 1994-04-20 2000-05-31 Siemens Ag Devices for checking semiconductor wafers
IE80676B1 (en) * 1996-08-02 1998-11-18 M V Research Limited A measurement system
GB2316168B (en) * 1996-08-06 2000-04-12 M V Research Limited A measurement system
DE19652124C2 (en) * 1996-12-14 2002-10-17 Micronas Gmbh Method and device for automatically checking position data of J-shaped electrical contact connections
US6055054A (en) * 1997-05-05 2000-04-25 Beaty; Elwin M. Three dimensional inspection system
US5909285A (en) * 1997-05-05 1999-06-01 Beaty; Elwin M. Three dimensional inspection system
US6915007B2 (en) 1998-01-16 2005-07-05 Elwin M. Beaty Method and apparatus for three dimensional inspection of electronic components
US6915006B2 (en) 1998-01-16 2005-07-05 Elwin M. Beaty Method and apparatus for three dimensional inspection of electronic components
US6072898A (en) 1998-01-16 2000-06-06 Beaty; Elwin M. Method and apparatus for three dimensional inspection of electronic components
DE10026301A1 (en) * 2000-05-26 2001-11-29 Sick Ag Image processing method and apparatus
DE10128476C2 (en) * 2001-06-12 2003-06-12 Siemens Dematic Ag Optical sensor device for the visual detection of substrates
DE10208978B4 (en) * 2002-02-28 2005-06-23 Robert Bosch Gmbh Method and device for determining a height profile of a wire connection
DE10250705A1 (en) * 2002-10-31 2004-05-13 Bayerische Motoren Werke Ag Method and device for shadow compensation in digital images
US7604174B2 (en) 2003-10-24 2009-10-20 Cognex Technology And Investment Corporation Method and apparatus for providing omnidirectional lighting in a scanning device
US9070031B2 (en) 2003-10-24 2015-06-30 Cognex Technology And Investment Llc Integrated illumination assembly for symbology reader
US7874487B2 (en) 2005-10-24 2011-01-25 Cognex Technology And Investment Corporation Integrated illumination assembly for symbology reader
US9536124B1 (en) 2003-10-24 2017-01-03 Cognex Corporation Integrated illumination assembly for symbology reader
US7823789B2 (en) 2004-12-21 2010-11-02 Cognex Technology And Investment Corporation Low profile illumination for direct part mark readers
US7823783B2 (en) 2003-10-24 2010-11-02 Cognex Technology And Investment Corporation Light pipe illumination system and method
US7617984B2 (en) 2004-12-16 2009-11-17 Cognex Technology And Investment Corporation Hand held symbology reader illumination diffuser
US9292724B1 (en) 2004-12-16 2016-03-22 Cognex Corporation Hand held symbology reader illumination diffuser with aimer optics
EP1675453A3 (en) * 2004-12-22 2007-07-11 Siemens Aktiengesellschaft Device for illuminating objects and sensor device
US9234852B2 (en) 2005-07-29 2016-01-12 Mitutoyo Corporation Systems and methods for controlling strobe illumination
US8045002B2 (en) 2005-07-29 2011-10-25 Mitutoyo Corporation Systems and methods for controlling strobe illumination
JP4740826B2 (en) * 2006-02-23 2011-08-03 株式会社神戸製鋼所 Shape measuring device and shape measuring method
DE102006015714B4 (en) * 2006-04-04 2019-09-05 Applied Materials Gmbh Light-assisted testing of an opto-electronic module
JP6050928B2 (en) * 2011-05-02 2016-12-21 ローム株式会社 Manufacturing method of wire bonding structure
DE102014205701A1 (en) * 2014-03-27 2015-10-01 Robert Bosch Gmbh Method and device for determining the position and / or orientation of at least one plug-in contact
DE102021211601A1 (en) * 2020-10-14 2022-04-14 Emage Equipment PTE, Ltd. MEASURING THE LOOP HEIGHT OF OVERLAPPING BONDS

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US3834819A (en) * 1973-07-05 1974-09-10 Western Electric Co Thickness measuring
DE2929846A1 (en) * 1979-07-23 1981-03-12 Siemens AG, 1000 Berlin und 8000 München OPTO-ELECTRONIC TESTING SYSTEM FOR AUTOMATIC CHECKING OF CHARACTERISTICS, THEIR INTERMEDIATE PRODUCTS AND PRINTING TOOLS
JPS58219441A (en) * 1982-06-15 1983-12-20 Hajime Sangyo Kk Apparatus for detecting defect on surface of convex object
DE3337251A1 (en) * 1983-10-13 1985-04-25 Gerd Dipl.-Phys. Dr. 8520 Erlangen Häusler OPTICAL SCANING METHOD FOR THE THREE-DIMENSIONAL MEASUREMENT OF OBJECTS
US4648053A (en) * 1984-10-30 1987-03-03 Kollmorgen Technologies, Corp. High speed optical inspection system
JPS6282314A (en) * 1985-10-08 1987-04-15 Hitachi Ltd Stereo measurement system for difference in light intensity
US4728195A (en) * 1986-03-19 1988-03-01 Cognex Corporation Method for imaging printed circuit board component leads
US4875778A (en) * 1987-02-08 1989-10-24 Luebbe Richard J Lead inspection system for surface-mounted circuit packages
JPH0682102B2 (en) * 1987-02-27 1994-10-19 三菱電機株式会社 Pattern defect inspection device and pattern defect inspection method

Also Published As

Publication number Publication date
DE4003983C1 (en) 1991-08-29
JPH05508702A (en) 1993-12-02
WO1991012489A1 (en) 1991-08-22
EP0514393A1 (en) 1992-11-25

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