IL92770A - Low temperature cofired ceramic packages for microwave and millimeter wave gallium arsenide integrated circuits - Google Patents
Low temperature cofired ceramic packages for microwave and millimeter wave gallium arsenide integrated circuitsInfo
- Publication number
- IL92770A IL92770A IL92770A IL9277089A IL92770A IL 92770 A IL92770 A IL 92770A IL 92770 A IL92770 A IL 92770A IL 9277089 A IL9277089 A IL 9277089A IL 92770 A IL92770 A IL 92770A
- Authority
- IL
- Israel
- Prior art keywords
- microwave
- low temperature
- integrated circuits
- millimeter wave
- gallium arsenide
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/289,862 US4899118A (en) | 1988-12-27 | 1988-12-27 | Low temperature cofired ceramic packages for microwave and millimeter wave gallium arsenide integrated circuits |
Publications (2)
Publication Number | Publication Date |
---|---|
IL92770A0 IL92770A0 (en) | 1990-09-17 |
IL92770A true IL92770A (en) | 1992-11-15 |
Family
ID=23113435
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL92770A IL92770A (en) | 1988-12-27 | 1989-12-18 | Low temperature cofired ceramic packages for microwave and millimeter wave gallium arsenide integrated circuits |
Country Status (6)
Country | Link |
---|---|
US (1) | US4899118A (xx) |
EP (1) | EP0401341B1 (xx) |
JP (1) | JPH0828441B2 (xx) |
DE (1) | DE68910512T2 (xx) |
IL (1) | IL92770A (xx) |
WO (1) | WO1990007793A1 (xx) |
Families Citing this family (53)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2507476B2 (ja) * | 1987-09-28 | 1996-06-12 | 株式会社東芝 | 半導体集積回路装置 |
US5094969A (en) * | 1989-09-14 | 1992-03-10 | Litton Systems, Inc. | Method for making a stackable multilayer substrate for mounting integrated circuits |
MY105486A (en) * | 1989-12-15 | 1994-10-31 | Tdk Corp | A multilayer hybrid circuit. |
US5214498A (en) * | 1990-02-26 | 1993-05-25 | Raytheon Company | MMIC package and connector |
EP0444820A3 (en) * | 1990-02-26 | 1992-07-08 | Raytheon Company | Mmic package and connection |
DE4115043A1 (de) * | 1991-05-08 | 1997-07-17 | Gen Electric | Dichtgepackte Verbindungsstruktur, die eine Kammer enthält |
US5206712A (en) * | 1990-04-05 | 1993-04-27 | General Electric Company | Building block approach to microwave modules |
US5132648A (en) * | 1990-06-08 | 1992-07-21 | Rockwell International Corporation | Large array MMIC feedthrough |
US6545563B1 (en) | 1990-07-16 | 2003-04-08 | Raytheon Company | Digitally controlled monolithic microwave integrated circuits |
JP2763664B2 (ja) * | 1990-07-25 | 1998-06-11 | 日本碍子株式会社 | 分布定数回路用配線基板 |
WO1992008606A1 (en) * | 1990-11-19 | 1992-05-29 | The Carborundum Company | Microelectronics package |
JP2539367Y2 (ja) * | 1991-01-30 | 1997-06-25 | 株式会社村田製作所 | 積層型電子部品 |
US5150088A (en) * | 1991-03-27 | 1992-09-22 | Hughes Aircraft Company | Stripline shielding techniques in low temperature co-fired ceramic |
US5157364A (en) * | 1991-05-22 | 1992-10-20 | Hughes Aircraft Company | Airline transmission structures in low temperature co-fired ceramic |
US5184095A (en) * | 1991-07-31 | 1993-02-02 | Hughes Aircraft Company | Constant impedance transition between transmission structures of different dimensions |
US5315239A (en) * | 1991-12-16 | 1994-05-24 | Hughes Aircraft Company | Circuit module connections |
US5219377A (en) * | 1992-01-17 | 1993-06-15 | Texas Instruments Incorporated | High temperature co-fired ceramic integrated phased array package |
US5198824A (en) * | 1992-01-17 | 1993-03-30 | Texas Instruments Incorporated | High temperature co-fired ceramic integrated phased array packaging |
JP2731659B2 (ja) * | 1992-01-29 | 1998-03-25 | 日本電気株式会社 | 無線選択呼出し受信機 |
US5276963A (en) * | 1992-02-21 | 1994-01-11 | Coors Electronic Package Company | Process for obtaining side metallization and articles produced thereby |
CA2072380C (en) * | 1992-06-25 | 2000-08-01 | Michel Bohbot | Circuit assemblies of printed circuit boards and telecommunications connectors |
US5389904A (en) * | 1992-09-11 | 1995-02-14 | Industrial Technology Research Institute, Taiwan, R.O.C. | Surface-mountable, frequency selective microwave IC package |
US5461196A (en) * | 1992-12-02 | 1995-10-24 | Hughes Aircraft Company | Low temperature co-fired ceramic (LTCC) high density interconnect package with circuitry within the cavity walls |
US5359488A (en) * | 1993-06-21 | 1994-10-25 | Westinghouse Electric Corporation | Packaging system for a standard electronic module |
US5455385A (en) * | 1993-06-28 | 1995-10-03 | Harris Corporation | Multilayer LTCC tub architecture for hermetically sealing semiconductor die, external electrical access for which is provided by way of sidewall recesses |
US5386339A (en) * | 1993-07-29 | 1995-01-31 | Hughes Aircraft Company | Monolithic microelectronic circuit package including low-temperature-cofired-ceramic (LTCC) tape dielectric structure and in-situ heat sink |
EP0658937A1 (en) * | 1993-12-08 | 1995-06-21 | Hughes Aircraft Company | Vertical IC chip stack with discrete chip carriers formed from dielectric tape |
US5382931A (en) * | 1993-12-22 | 1995-01-17 | Westinghouse Electric Corporation | Waveguide filters having a layered dielectric structure |
JP3031178B2 (ja) * | 1994-09-28 | 2000-04-10 | 株式会社村田製作所 | 複合高周波部品 |
US5557502A (en) * | 1995-03-02 | 1996-09-17 | Intel Corporation | Structure of a thermally and electrically enhanced plastic ball grid array package |
JPH09134981A (ja) * | 1995-11-08 | 1997-05-20 | Fujitsu Ltd | マイクロ波・ミリ波帯の機能モジュールパッケージ |
US5731751A (en) * | 1996-02-28 | 1998-03-24 | Motorola Inc. | Ceramic waveguide filter with stacked resonators having capacitive metallized receptacles |
FR2747239B1 (fr) * | 1996-04-04 | 1998-05-15 | Alcatel Espace | Module hyperfrequence compact |
US5757611A (en) * | 1996-04-12 | 1998-05-26 | Norhtrop Grumman Corporation | Electronic package having buried passive components |
US6043559A (en) | 1996-09-09 | 2000-03-28 | Intel Corporation | Integrated circuit package which contains two in plane voltage busses and a wrap around conductive strip that connects a bond finger to one of the busses |
JPH10126307A (ja) * | 1996-10-21 | 1998-05-15 | Murata Mfg Co Ltd | 高周波複合部品 |
US6261872B1 (en) | 1997-09-18 | 2001-07-17 | Trw Inc. | Method of producing an advanced RF electronic package |
US5982250A (en) * | 1997-11-26 | 1999-11-09 | Twr Inc. | Millimeter-wave LTCC package |
JP3322199B2 (ja) * | 1998-01-06 | 2002-09-09 | 株式会社村田製作所 | 多層セラミック基板およびその製造方法 |
SE515856C2 (sv) | 1999-05-19 | 2001-10-22 | Ericsson Telefon Ab L M | Bärare för elektronikkomponenter |
JP2001189605A (ja) * | 1999-10-21 | 2001-07-10 | Matsushita Electric Ind Co Ltd | セラミック積層rfデバイス |
US6456172B1 (en) | 1999-10-21 | 2002-09-24 | Matsushita Electric Industrial Co., Ltd. | Multilayered ceramic RF device |
KR100604376B1 (ko) * | 1999-12-10 | 2006-07-25 | 고등기술연구원연구조합 | 동시 소성 세라믹 모듈(ltcc-m) 패키지 및 그 제조방법 |
US6384473B1 (en) | 2000-05-16 | 2002-05-07 | Sandia Corporation | Microelectronic device package with an integral window |
US6531341B1 (en) | 2000-05-16 | 2003-03-11 | Sandia Corporation | Method of fabricating a microelectronic device package with an integral window |
GB2373373A (en) * | 2001-03-12 | 2002-09-18 | Marconi Caswell Ltd | Millimetre wave switch |
US6627992B2 (en) * | 2001-05-21 | 2003-09-30 | Xytrans, Inc. | Millimeter wave (MMW) transceiver module with transmitter, receiver and local oscillator frequency multiplier surface mounted chip set |
US6483404B1 (en) * | 2001-08-20 | 2002-11-19 | Xytrans, Inc. | Millimeter wave filter for surface mount applications |
EP1298728A1 (en) * | 2001-09-27 | 2003-04-02 | Agilent Technologies, Inc. (a Delaware corporation) | IC package with an electromagnetic interference screening device |
US20040080917A1 (en) * | 2002-10-23 | 2004-04-29 | Steddom Clark Morrison | Integrated microwave package and the process for making the same |
US6873228B1 (en) * | 2003-09-30 | 2005-03-29 | National Semiconductor Corporation | Buried self-resonant bypass capacitors within multilayered low temperature co-fired ceramic (LTCC) substrate |
US20050088258A1 (en) * | 2003-10-27 | 2005-04-28 | Xytrans, Inc. | Millimeter wave surface mount filter |
US9672319B1 (en) * | 2015-06-29 | 2017-06-06 | Cadence Design Systems, Inc. | Methods, systems, and articles of manufacture for implementing electronic designs with a pseudo-3D analysis mechanism |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5386576A (en) * | 1977-01-10 | 1978-07-31 | Nec Corp | Package for semiconductor element |
DE3067917D1 (en) * | 1979-03-10 | 1984-06-28 | Fujitsu Ltd | Constructional arrangement for semiconductor devices |
EP0111890B1 (en) * | 1982-12-15 | 1991-03-13 | Nec Corporation | Monolithic multicomponents ceramic substrate with at least one dielectric layer of a composition having a perovskite structure |
CA1246755A (en) * | 1985-03-30 | 1988-12-13 | Akira Miyauchi | Semiconductor device |
EP0209642A3 (en) * | 1985-07-25 | 1987-04-15 | Hewlett-Packard Company | Ceramic microcircuit package |
JPH0634452B2 (ja) * | 1985-08-05 | 1994-05-02 | 株式会社日立製作所 | セラミツクス回路基板 |
JPS6273799A (ja) * | 1985-09-27 | 1987-04-04 | 日本電気株式会社 | 多層セラミツク配線基板 |
KR900008995B1 (ko) * | 1986-12-19 | 1990-12-17 | 페어차일드 세미콘덕터 코포레이션 | 고주파 반도체 소자용 세라믹 패키지 |
-
1988
- 1988-12-27 US US07/289,862 patent/US4899118A/en not_active Expired - Fee Related
-
1989
- 1989-11-13 DE DE68910512T patent/DE68910512T2/de not_active Expired - Fee Related
- 1989-11-13 EP EP90900581A patent/EP0401341B1/en not_active Expired - Lifetime
- 1989-11-13 JP JP2500871A patent/JPH0828441B2/ja not_active Expired - Fee Related
- 1989-11-13 WO PCT/US1989/005026 patent/WO1990007793A1/en active IP Right Grant
- 1989-12-18 IL IL92770A patent/IL92770A/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JPH0828441B2 (ja) | 1996-03-21 |
EP0401341A1 (en) | 1990-12-12 |
US4899118A (en) | 1990-02-06 |
JPH03502986A (ja) | 1991-07-04 |
EP0401341B1 (en) | 1993-11-03 |
DE68910512T2 (de) | 1994-05-26 |
WO1990007793A1 (en) | 1990-07-12 |
DE68910512D1 (de) | 1993-12-09 |
IL92770A0 (en) | 1990-09-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RH | Patent void |