IL76728A0 - Apparatus and method for laser drilling - Google Patents
Apparatus and method for laser drillingInfo
- Publication number
- IL76728A0 IL76728A0 IL76728A IL7672885A IL76728A0 IL 76728 A0 IL76728 A0 IL 76728A0 IL 76728 A IL76728 A IL 76728A IL 7672885 A IL7672885 A IL 7672885A IL 76728 A0 IL76728 A0 IL 76728A0
- Authority
- IL
- Israel
- Prior art keywords
- laser drilling
- drilling
- laser
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/025—Constructional details of solid state lasers, e.g. housings or mountings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/12—Copper or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
- B23K2103/166—Multilayered materials
- B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Electromagnetism (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US66134984A | 1984-10-16 | 1984-10-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
IL76728A0 true IL76728A0 (en) | 1986-02-28 |
Family
ID=24653220
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL76728A IL76728A0 (en) | 1984-10-16 | 1985-10-16 | Apparatus and method for laser drilling |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0198076A1 (en) |
AU (1) | AU5195686A (en) |
IL (1) | IL76728A0 (en) |
WO (1) | WO1986002301A1 (en) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4839497A (en) * | 1987-09-03 | 1989-06-13 | Digital Equipment Corporation | Drilling apparatus and method |
DE3835981A1 (en) * | 1988-10-21 | 1990-04-26 | Mtu Muenchen Gmbh | METHOD FOR TESTING THE TOLERANCES OF HOLES |
US6744010B1 (en) * | 1991-08-22 | 2004-06-01 | United Technologies Corporation | Laser drilled holes for film cooling |
JPH05111783A (en) * | 1991-10-19 | 1993-05-07 | Fanuc Ltd | Drilling method for laser beam machining |
GB9202434D0 (en) * | 1992-02-05 | 1992-03-18 | Xaar Ltd | Method of and apparatus for forming nozzles |
GB9601049D0 (en) | 1996-01-18 | 1996-03-20 | Xaar Ltd | Methods of and apparatus for forming nozzles |
JP2710608B2 (en) * | 1996-03-01 | 1998-02-10 | 日本電気株式会社 | Organic film processing method |
GB2313079A (en) * | 1996-05-16 | 1997-11-19 | British Aerospace | Two stage drilling by laser irradiation |
GB9617093D0 (en) * | 1996-08-14 | 1996-09-25 | Rolls Royce Plc | A method of drilling a hole in a workpiece |
US5841102A (en) * | 1996-11-08 | 1998-11-24 | W. L. Gore & Associates, Inc. | Multiple pulse space processing to enhance via entrance formation at 355 nm |
US6151338A (en) | 1997-02-19 | 2000-11-21 | Sdl, Inc. | High power laser optical amplifier system |
US5973290A (en) * | 1997-02-26 | 1999-10-26 | W. L. Gore & Associates, Inc. | Laser apparatus having improved via processing rate |
DE19920813A1 (en) * | 1999-05-06 | 2001-06-28 | Bosch Gmbh Robert | Device for removing material from workpieces using a laser beam |
US6229113B1 (en) * | 1999-07-19 | 2001-05-08 | United Technologies Corporation | Method and apparatus for producing a laser drilled hole in a structure |
JP4320926B2 (en) * | 2000-06-16 | 2009-08-26 | パナソニック株式会社 | Laser drilling method and apparatus |
DE10351874A1 (en) * | 2003-11-06 | 2005-06-09 | Mtu Aero Engines Gmbh | Method for testing a bore |
US7057133B2 (en) * | 2004-04-14 | 2006-06-06 | Electro Scientific Industries, Inc. | Methods of drilling through-holes in homogenous and non-homogenous substrates |
TWI382795B (en) * | 2005-03-04 | 2013-01-11 | Hitachi Via Mechanics Ltd | A method of opening a printed circuit board and an opening device for a printed circuit board |
US7244906B2 (en) * | 2005-08-30 | 2007-07-17 | Electro Scientific Industries, Inc. | Energy monitoring or control of individual vias formed during laser micromachining |
CN103921004A (en) * | 2014-04-18 | 2014-07-16 | 安捷利(番禺)电子实业有限公司 | Method for manufacturing multilayer-structure through hole through UV laser drilling |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3388461A (en) * | 1965-01-26 | 1968-06-18 | Sperry Rand Corp | Precision electrical component adjustment method |
US3806829A (en) * | 1971-04-13 | 1974-04-23 | Sys Inc | Pulsed laser system having improved energy control with improved power supply laser emission energy sensor and adjustable repetition rate control features |
US4114018A (en) * | 1976-09-30 | 1978-09-12 | Lasag Ag | Method for ablating metal workpieces with laser radiation |
BE849646A (en) * | 1976-12-20 | 1977-06-20 | EARTH DRILLING PROCESS AND APPARATUS USING LASERS | |
FR2547519B1 (en) * | 1983-06-15 | 1987-07-03 | Snecma | LASER DRILLING METHOD AND DEVICE |
-
1985
- 1985-10-04 EP EP85905950A patent/EP0198076A1/en not_active Withdrawn
- 1985-10-04 WO PCT/US1985/001928 patent/WO1986002301A1/en unknown
- 1985-10-04 AU AU51956/86A patent/AU5195686A/en not_active Abandoned
- 1985-10-16 IL IL76728A patent/IL76728A0/en unknown
Also Published As
Publication number | Publication date |
---|---|
WO1986002301A1 (en) | 1986-04-24 |
EP0198076A1 (en) | 1986-10-22 |
AU5195686A (en) | 1986-05-02 |
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