AU5195686A - Laser drilling apparatus and method - Google Patents

Laser drilling apparatus and method

Info

Publication number
AU5195686A
AU5195686A AU51956/86A AU5195686A AU5195686A AU 5195686 A AU5195686 A AU 5195686A AU 51956/86 A AU51956/86 A AU 51956/86A AU 5195686 A AU5195686 A AU 5195686A AU 5195686 A AU5195686 A AU 5195686A
Authority
AU
Australia
Prior art keywords
laser drilling
drilling apparatus
laser
drilling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU51956/86A
Inventor
Zahaykevich George Anthony
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Laser Systems Inc
Original Assignee
Advanced Laser Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Laser Systems Inc filed Critical Advanced Laser Systems Inc
Publication of AU5195686A publication Critical patent/AU5195686A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02—Constructional details
    • H01S3/025—Constructional details of solid state lasers, e.g. housings or mountings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Electromagnetism (AREA)
  • Laser Beam Processing (AREA)
AU51956/86A 1984-10-16 1985-10-04 Laser drilling apparatus and method Abandoned AU5195686A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US66134984A 1984-10-16 1984-10-16
US661349 1984-10-16

Publications (1)

Publication Number Publication Date
AU5195686A true AU5195686A (en) 1986-05-02

Family

ID=24653220

Family Applications (1)

Application Number Title Priority Date Filing Date
AU51956/86A Abandoned AU5195686A (en) 1984-10-16 1985-10-04 Laser drilling apparatus and method

Country Status (4)

Country Link
EP (1) EP0198076A1 (en)
AU (1) AU5195686A (en)
IL (1) IL76728A0 (en)
WO (1) WO1986002301A1 (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4839497A (en) * 1987-09-03 1989-06-13 Digital Equipment Corporation Drilling apparatus and method
DE3835981A1 (en) * 1988-10-21 1990-04-26 Mtu Muenchen Gmbh METHOD FOR TESTING THE TOLERANCES OF HOLES
US6744010B1 (en) * 1991-08-22 2004-06-01 United Technologies Corporation Laser drilled holes for film cooling
JPH05111783A (en) * 1991-10-19 1993-05-07 Fanuc Ltd Drilling method for laser beam machining
GB9202434D0 (en) * 1992-02-05 1992-03-18 Xaar Ltd Method of and apparatus for forming nozzles
GB9601049D0 (en) * 1996-01-18 1996-03-20 Xaar Ltd Methods of and apparatus for forming nozzles
JP2710608B2 (en) * 1996-03-01 1998-02-10 日本電気株式会社 Organic film processing method
GB2313079A (en) * 1996-05-16 1997-11-19 British Aerospace Two stage drilling by laser irradiation
GB9617093D0 (en) * 1996-08-14 1996-09-25 Rolls Royce Plc A method of drilling a hole in a workpiece
US5841102A (en) * 1996-11-08 1998-11-24 W. L. Gore & Associates, Inc. Multiple pulse space processing to enhance via entrance formation at 355 nm
US6151338A (en) * 1997-02-19 2000-11-21 Sdl, Inc. High power laser optical amplifier system
US5973290A (en) * 1997-02-26 1999-10-26 W. L. Gore & Associates, Inc. Laser apparatus having improved via processing rate
DE19920813A1 (en) * 1999-05-06 2001-06-28 Bosch Gmbh Robert Device for removing material from workpieces using a laser beam
US6229113B1 (en) * 1999-07-19 2001-05-08 United Technologies Corporation Method and apparatus for producing a laser drilled hole in a structure
JP4320926B2 (en) * 2000-06-16 2009-08-26 パナソニック株式会社 Laser drilling method and apparatus
DE10351874A1 (en) 2003-11-06 2005-06-09 Mtu Aero Engines Gmbh Method for testing a bore
US7057133B2 (en) * 2004-04-14 2006-06-06 Electro Scientific Industries, Inc. Methods of drilling through-holes in homogenous and non-homogenous substrates
TWI382795B (en) 2005-03-04 2013-01-11 Hitachi Via Mechanics Ltd A method of opening a printed circuit board and an opening device for a printed circuit board
US7244906B2 (en) * 2005-08-30 2007-07-17 Electro Scientific Industries, Inc. Energy monitoring or control of individual vias formed during laser micromachining
CN103921004A (en) * 2014-04-18 2014-07-16 安捷利（番禺）电子实业有限公司 Method for manufacturing multilayer-structure through hole through UV laser drilling

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3388461A (en) * 1965-01-26 1968-06-18 Sperry Rand Corp Precision electrical component adjustment method
US3806829A (en) * 1971-04-13 1974-04-23 Sys Inc Pulsed laser system having improved energy control with improved power supply laser emission energy sensor and adjustable repetition rate control features
US4114018A (en) * 1976-09-30 1978-09-12 Lasag Ag Method for ablating metal workpieces with laser radiation
BE849646A (en) * 1976-12-20 1977-06-20 EARTH DRILLING PROCESS AND APPARATUS USING LASERS
FR2547519B1 (en) * 1983-06-15 1987-07-03 Snecma LASER DRILLING METHOD AND DEVICE

Also Published As

Publication number Publication date
IL76728A0 (en) 1986-02-28
EP0198076A1 (en) 1986-10-22
WO1986002301A1 (en) 1986-04-24

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