IL61797A - Process for producing strippable copper on an aluminum carrier and the article so obtained,particularly printed circuits - Google Patents

Process for producing strippable copper on an aluminum carrier and the article so obtained,particularly printed circuits

Info

Publication number
IL61797A
IL61797A IL61797A IL6179780A IL61797A IL 61797 A IL61797 A IL 61797A IL 61797 A IL61797 A IL 61797A IL 6179780 A IL6179780 A IL 6179780A IL 61797 A IL61797 A IL 61797A
Authority
IL
Israel
Prior art keywords
article
producing
printed circuits
aluminum carrier
particularly printed
Prior art date
Application number
IL61797A
Other languages
English (en)
Other versions
IL61797A0 (en
Original Assignee
Gould Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gould Inc filed Critical Gould Inc
Publication of IL61797A0 publication Critical patent/IL61797A0/xx
Publication of IL61797A publication Critical patent/IL61797A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C25D5/42—Pretreatment of metallic surfaces to be electroplated of light metals
    • C25D5/44—Aluminium
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
IL61797A 1979-12-26 1980-12-24 Process for producing strippable copper on an aluminum carrier and the article so obtained,particularly printed circuits IL61797A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/106,477 US4293617A (en) 1979-12-26 1979-12-26 Process for producing strippable copper on an aluminum carrier and the article so obtained

Publications (2)

Publication Number Publication Date
IL61797A0 IL61797A0 (en) 1981-01-30
IL61797A true IL61797A (en) 1984-12-31

Family

ID=22311619

Family Applications (1)

Application Number Title Priority Date Filing Date
IL61797A IL61797A (en) 1979-12-26 1980-12-24 Process for producing strippable copper on an aluminum carrier and the article so obtained,particularly printed circuits

Country Status (20)

Country Link
US (1) US4293617A (xx)
JP (1) JPS6031915B2 (xx)
KR (1) KR830006477A (xx)
AU (1) AU535003B2 (xx)
BR (1) BR8008512A (xx)
CA (1) CA1150849A (xx)
DE (1) DE3046213A1 (xx)
FR (1) FR2472468A1 (xx)
GB (1) GB2066295B (xx)
HK (1) HK45284A (xx)
IL (1) IL61797A (xx)
IN (1) IN153612B (xx)
IT (1) IT1128725B (xx)
LU (1) LU83033A1 (xx)
MX (1) MX155237A (xx)
NL (1) NL185627C (xx)
NZ (1) NZ195918A (xx)
PH (1) PH15879A (xx)
SE (1) SE8008965L (xx)
SG (1) SG7284G (xx)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4386139A (en) * 1980-10-31 1983-05-31 Furukawa Circuit Foil Co., Ltd. Copper foil for a printed circuit and a method for the production thereof
US4463084A (en) * 1982-02-09 1984-07-31 Alps Electric Co., Ltd. Method of fabricating a circuit board and circuit board provided thereby
US4534831A (en) * 1982-09-27 1985-08-13 Inoue-Japax Research Incorporated Method of and apparatus for forming a 3D article
JPS60170287A (ja) * 1984-02-14 1985-09-03 信越化学工業株式会社 銅張積層基板
JPS62181313U (xx) * 1986-05-12 1987-11-17
JP3296543B2 (ja) * 1996-10-30 2002-07-02 スズキ株式会社 めっき被覆アルミニウム合金、及びそのシリンダーブロック、めっき処理ライン、めっき方法
US6319620B1 (en) 1998-01-19 2001-11-20 Mitsui Mining & Smelting Co., Ltd. Making and using an ultra-thin copper foil
US6183880B1 (en) 1998-08-07 2001-02-06 Mitsui Mining & Smelting Co., Ltd. Composite foil of aluminum and copper
US6447929B1 (en) 2000-08-29 2002-09-10 Gould Electronics Inc. Thin copper on usable carrier and method of forming same
US6955740B2 (en) * 2002-01-10 2005-10-18 Polyclad Laminates, Inc. Production of laminates for printed wiring boards using protective carrier
US6770976B2 (en) 2002-02-13 2004-08-03 Nikko Materials Usa, Inc. Process for manufacturing copper foil on a metal carrier substrate
US7073496B2 (en) * 2003-03-26 2006-07-11 Saint-Gobain Abrasives, Inc. High precision multi-grit slicing blade
DE10347459B3 (de) * 2003-10-13 2005-05-25 Actinium Pharmaceuticals, Inc. Radium-Target sowie Verfahren zu seiner Herstellung
DE102004022200B4 (de) * 2004-05-05 2006-07-20 Actinium Pharmaceuticals, Inc. Radium-Target sowie Verfahren zu seiner Herstellung
DE102006008023B4 (de) * 2006-02-21 2008-05-29 Actinium Pharmaceuticals, Inc. Verfahren zum Reinigen von 225Ac aus bestrahlten 226Ra-Targets
WO2008028664A1 (en) 2006-09-08 2008-03-13 Actinium Pharmaceuticals, Inc. Method for the purification of radium from different sources
JP6274556B2 (ja) * 2013-12-03 2018-02-07 スズキ株式会社 電解めっき方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2708655A (en) * 1955-05-17 Electrolytic polishing of aluminum
US1727331A (en) * 1927-01-17 1929-09-10 Eastman Kodak Co Process of coating aluminum electrolytically
BE407434A (xx) * 1934-02-10
US2703781A (en) * 1950-05-25 1955-03-08 Kaiser Aluminium Chem Corp Anodic treatment of aluminum surfaces
BE559886A (xx) * 1956-08-08
US2888387A (en) * 1957-05-14 1959-05-26 Tiarco Corp Electroplating
US3098804A (en) * 1960-03-28 1963-07-23 Kaiser Aluminium Chem Corp Metal treatment
US3468765A (en) * 1966-08-04 1969-09-23 Nasa Method of plating copper on aluminum
DE1621115C3 (de) * 1967-10-17 1981-06-25 Metalloxyd GmbH, 5000 Köln Verfahren zur Herstellung eines Trägers aus Aluminium für lithographische Druckplatten
DE2413932C2 (de) * 1973-04-25 1984-08-30 Yates Industries, Inc., Bordentown, N.J. Verfahren zum Herstellen einer Verbundfolie für die Ausbildung gedruckter Schaltkreise
US3935080A (en) * 1974-10-02 1976-01-27 Polychrome Corporation Method of producing an aluminum base sheet for a printing plate
US3915811A (en) * 1974-10-16 1975-10-28 Oxy Metal Industries Corp Method and composition for electroplating aluminum alloys
US4097342A (en) * 1975-05-16 1978-06-27 Alcan Research And Development Limited Electroplating aluminum stock

Also Published As

Publication number Publication date
AU6548680A (en) 1981-07-02
LU83033A1 (fr) 1981-03-27
US4293617A (en) 1981-10-06
DE3046213C2 (xx) 1989-04-20
GB2066295B (en) 1983-02-16
MX155237A (es) 1988-02-09
PH15879A (en) 1983-04-13
NL185627C (nl) 1990-06-01
IL61797A0 (en) 1981-01-30
BR8008512A (pt) 1981-07-21
JPS6031915B2 (ja) 1985-07-25
KR830006477A (ko) 1983-09-24
SE8008965L (sv) 1981-06-27
JPS56127787A (en) 1981-10-06
DE3046213A1 (de) 1981-08-27
NL185627B (nl) 1990-01-02
FR2472468A1 (fr) 1981-07-03
NZ195918A (en) 1983-11-30
IN153612B (xx) 1984-07-28
HK45284A (en) 1984-06-01
CA1150849A (en) 1983-07-26
IT1128725B (it) 1986-06-04
GB2066295A (en) 1981-07-08
SG7284G (en) 1985-02-15
IT8050449A0 (it) 1980-12-23
FR2472468B1 (xx) 1985-03-22
AU535003B2 (en) 1984-02-23
NL8007024A (nl) 1981-07-16

Similar Documents

Publication Publication Date Title
IL61797A (en) Process for producing strippable copper on an aluminum carrier and the article so obtained,particularly printed circuits
AU513778B2 (en) Heat treated fine grained a1 base alloys
DE3374645D1 (en) Printed circuit and process for making the circuit
DE3072012D1 (en) Process for producing semiconductor devices, devices produced by the process, and circuits and articles including such devices
IL56000A0 (en) Process for the production of solder masks on printed circuits
ZA776040B (en) Apparatus for manufacturing an article
GB2126834B (en) System and method for producing artwork and printed circuit boards
CA1026469A (en) Integrated circuit chip carrier and method for forming the same
ZA776418B (en) Apparatus for de-flashing workpieces
JPS52134828A (en) Aluminum electroplating solution and process for producing the same
EP0026233A4 (en) SEMICONDUCTOR INTEGRATED CIRCUIT AND METHOD FOR ITS WIRING.
JPS52115785A (en) Process for coating substrate
GB2051489B (en) Process for the manufacture of printed circuits
PT68026A (en) Process for producing metallic articles.
JPS5357142A (en) Process for forming black coating on aluminum or aluminum alloy
PH13461A (en) Blank for an article carrier
JPS52111942A (en) Equipment for applying paint
GB1557400A (en) Die coating apparatus
JPS5349271A (en) Method of coating antioxidant on printed substrate
JPS536612A (en) Processing method for silk
DE3469261D1 (en) Components board comprising connection points, and process for marking these points
JPS52133392A (en) Activating carrier and process for preparing the same
JPS5317536A (en) Process for forming pattern on aluminum or aluminum alloy
SU631305A1 (ru) Устройство дл ориентации деталей типа колпачков
JPS534853A (en) Bothhside printed circuit substrate