IL325091A - A semiconductor device having conductive connections of one component connected to both sides of the chip, and a method for forming the semiconductor device, and a system comprising the same - Google Patents

A semiconductor device having conductive connections of one component connected to both sides of the chip, and a method for forming the semiconductor device, and a system comprising the same

Info

Publication number
IL325091A
IL325091A IL325091A IL32509125A IL325091A IL 325091 A IL325091 A IL 325091A IL 325091 A IL325091 A IL 325091A IL 32509125 A IL32509125 A IL 32509125A IL 325091 A IL325091 A IL 325091A
Authority
IL
Israel
Prior art keywords
lead
frame strip
housing
leads
member conductive
Prior art date
Application number
IL325091A
Other languages
English (en)
Hebrew (he)
Inventor
Barry Lin
Tony Chiu
Original Assignee
Siliconix Incorporated
Barry Lin
Tony Chiu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siliconix Incorporated, Barry Lin, Tony Chiu filed Critical Siliconix Incorporated
Publication of IL325091A publication Critical patent/IL325091A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/014—Manufacture or treatment using batch processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H10W70/466—Tape carriers or flat leads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/301—Marks applied to devices, e.g. for alignment or identification for alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/501—Marks applied to devices, e.g. for alignment or identification for use before dicing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
IL325091A 2023-06-06 2023-06-06 A semiconductor device having conductive connections of one component connected to both sides of the chip, and a method for forming the semiconductor device, and a system comprising the same IL325091A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2023/024511 WO2024253639A1 (fr) 2023-06-06 2023-06-06 Dispositif à semi-conducteur ayant des fils conducteurs à un seul élément couplés aux deux côtés d'une matrice, procédé de formation de celui-ci, et système le comprenant

Publications (1)

Publication Number Publication Date
IL325091A true IL325091A (en) 2026-02-01

Family

ID=93795873

Family Applications (1)

Application Number Title Priority Date Filing Date
IL325091A IL325091A (en) 2023-06-06 2023-06-06 A semiconductor device having conductive connections of one component connected to both sides of the chip, and a method for forming the semiconductor device, and a system comprising the same

Country Status (6)

Country Link
EP (1) EP4702595A1 (fr)
KR (1) KR20260040221A (fr)
CN (1) CN121866898A (fr)
IL (1) IL325091A (fr)
TW (1) TW202524723A (fr)
WO (1) WO2024253639A1 (fr)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW409379B (en) * 1998-03-11 2000-10-21 Motorola Inc A semiconductor package and method for forming same
US6249041B1 (en) * 1998-06-02 2001-06-19 Siliconix Incorporated IC chip package with directly connected leads
US6040626A (en) * 1998-09-25 2000-03-21 International Rectifier Corp. Semiconductor package
US7094633B2 (en) * 2003-06-23 2006-08-22 Sandisk Corporation Method for efficiently producing removable peripheral cards
JP5612268B2 (ja) * 2008-03-28 2014-10-22 株式会社東芝 半導体装置及びｄｃ−ｄｃコンバータ

Also Published As

Publication number Publication date
KR20260040221A (ko) 2026-03-24
CN121866898A (zh) 2026-04-14
TW202524723A (zh) 2025-06-16
WO2024253639A1 (fr) 2024-12-12
EP4702595A1 (fr) 2026-03-04

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