IL290194A - Pattern transfer printing systems and methods - Google Patents

Description

P-606575-IL PATTERN TRANSFER PRINTING SYSTEMS AND METHODS BACKGROUND OF THE INVENTION 1. TECHNICAL FIELD [0001]The present invention relates to the field of pattern transfer printing, and more particularly, to producing photovoltaic cells. 2. DISCUSSION OF RELATED ART [0002]U.S. Patent Application Publication No. 2017/013724, which is incorporated herein by reference in its entirety, teaches an apparatus for generating a transfer pattern to be used in a transfer printing process. The pattern is generated in a substrate that could be a web substrate and that bears one or more trenches. A filler, e.g., high viscosity metal paste, to be transferred is made to fill the trenches within the web substrate. Upon completion of the trench of the substrate filled with filler, the filling head, which may include a scraper and a squeegee, is translated from the working zone in a synchronized movement, such that in course of the translation movement the filling head remains in full contact with the substrate. [0003]Lossen et al. (2015), Pattern Transfer Printing (PTP™) for c-Si solar cell metallization, 5th Workshop on Metallization for Crystalline Silicon Solar Cells, Energy Procedia 67:156-162, which is incorporated herein by reference in its entirety, teaches pattern transfer printing (PTP™) as a non-contact printing technology for advanced front side metallization of c-Si PV solar cells, which is based on laser-induced deposition from a polymer substrate. SUMMARY OF THE INVENTION [0004]The following is a simplified summary providing an initial understanding of the invention. The summary does not necessarily identify key elements nor limit the scope of the invention, but merely serves as an introduction to the following description. [0005]One aspect of the present invention provides a pattern transfer printing (PTP) system comprising: a tape handling unit configured to handle a tape comprising, as sections P-606575-IL thereof, a plurality of pattern transfer sheets having respective patterns of trenches, and to controllably deliver the pattern transfer sheets for paste filling and consecutively for pattern transfer, a paste filling unit configured to fill the trenches on the delivered pattern transfer sheets with conductive printing paste, a wafer handling unit configured to controllably deliver a plurality of wafers for the pattern transfer at a close proximity to the pattern transfer sheet, a paste transfer unit configured to transfer the conductive printing paste from a respective one of the pattern transfer sheets onto a respective one of the delivered wafers, by releasing the printing paste from the trenches upon illumination by a laser beam, wherein the tape handling unit is configured to move the tape in a step-and-repeat manner from an unwinder roll to a re-winding roll and optionally to clean and dry the tape after printing during such movement. [0006]Another aspect of the present invention provides a pattern transfer printing (PTP) system comprising a wafer handling system in which each of two x,z-stages working in parallel comprise two chucks for holding wafers, each chuck ensuring wafer movement in y, θ – axis thus enabling faster wafer handling and continuous wafers movement during pattern transfer. Multiple cameras imaging incoming wafers enable more accurate wafer alignment within the printing system thus more accurate alignment of printed conductive lines onto wafer pattern. [0007]These, additional, and/or other aspects and/or advantages of the present invention are set forth in the detailed description which follows; possibly inferable from the detailed description; and/or learnable by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS [0008]For a better understanding of embodiments of the invention and to show how the same may be carried into effect, reference will now be made, purely by way of example, to the accompanying drawings in which like numerals designate corresponding elements or sections throughout. [0009]In the accompanying drawings: [0010] Figure 1Ais a high-level schematic illustration of a pattern transfer printing (PTP) system, according to some embodiments of the invention .

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[0011] Figures 1Band 1Care high-level schematic illustrations of maintenance options and arrangements of PTP systems in a dual-lane production line, according to some embodiments of the invention. [0012] Figures 2Aand 2Bare high-level schematic side view and front view illustrations, respectively, of units and elements in PTP systems, according to some embodiments of the invention. [0013] Figure 3A is a high-level schematic side view illustration of a tape handling unit, according to some embodiments of the invention. [0014] Figures 3B-3E are high-level schematic illustrations of tapes with pattern transfer sheets and of the pattern transfer stage, according to some embodiments of the invention. [0015] Figure 4 is a high-level schematic illustration of a tape re-use unit, according to some embodiments of the invention. [0016] Figures 5A and 5B are high-level schematic illustrations of paste filling units, according to some embodiments of the invention. [0017] Figures 5C-5E are high-level schematic illustrations of printing heads, according to some embodiments of the invention [0018] Figures 6A-6C are high-level schematic illustrations of wafer handling units and of their operation, according to some embodiments of the invention. [0019] Figures 6Dand 6E are high-level schematic illustrations of wafer measurement units, according to some embodiments of the invention. [0020] Figures 7A-7C are high-level schematic illustrations of tape stretching units and trench alignment monitoring units, according to some embodiments of the invention. [0021] Figure 8 is a high-level schematic illustration of a print quality control unit, according to some embodiments of the invention. [0022] Figure 9A is a high-level flowchart illustrating PTP methods, according to some embodiments of the invention. [0023] Figure 9B is a high-level flowchart illustrating the parallel processes in the pattern transfer printing (PTP) method, according to some embodiments of the invention. [0024] Figure 10 is a high-level block diagram of exemplary computing device, which may be used with embodiments of the present invention.

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[0025]It will be appreciated that for simplicity and clarity of illustration, elements shown in the figures have not necessarily been drawn to scale. For example, the dimensions of some of the elements may be exaggerated relative to other elements for clarity. Further, where considered appropriate, reference numerals may be repeated among the figures to indicate corresponding or analogous elements. DETAILED DESCRIPTION OF THE INVENTION [0026]In the following description, various aspects of the present invention are described. For purposes of explanation, specific configurations and details are set forth in order to provide a thorough understanding of the present invention. However, it will also be apparent to one skilled in the art that the present invention may be practiced without the specific details presented herein. Furthermore, well known features may have been omitted or simplified in order not to obscure the present invention. With specific reference to the drawings, it is stressed that the particulars shown are by way of example and for purposes of illustrative discussion of the present invention only, and are presented in the cause of providing what is believed to be the most useful and readily understood description of the principles and conceptual aspects of the invention. In this regard, no attempt is made to show structural details of the invention in more detail than is necessary for a fundamental understanding of the invention, the description taken with the drawings making apparent to those skilled in the art how the several forms of the invention may be embodied in practice. [0027]Before at least one embodiment of the invention is explained in detail, it is to be understood that the invention is not limited in its application to the details of construction and the arrangement of the components set forth in the following description or illustrated in the drawings. The invention is applicable to other embodiments that may be practiced or carried out in various ways as well as to combinations of the disclosed embodiments. Also, it is to be understood that the phraseology and terminology employed herein are for the purpose of description and should not be regarded as limiting. [0028]Unless specifically stated otherwise, as apparent from the following discussions, it is appreciated that throughout the specification discussions utilizing terms such as P-606575-IL "processing", "computing", "calculating", "determining", "enhancing", "deriving" or the like, refer to the action and/or processes of a computer or computing system, or similar electronic computing device, that manipulates and/or transforms data represented as physical, such as electronic, quantities within the computing system's registers and/or memories into other data similarly represented as physical quantities within the computing system's memories, registers or other such information storage, transmission or display devices. [0029]Embodiments of the present invention provide efficient and economical methods and mechanisms for pattern transfer printing and thereby provide improvements to the technological field of producing electrical contacts, and specifically of producing photovoltaic cells. Pattern transfer printing (PTP) systems and methods are provided to improve the quality, accuracy and throughput of pattern transfer printing. PTP systems comprise a tape handling unit for handling a tape with pattern transfer sheets and for controllably delivering the pattern transfer sheets one-by-one for paste filling and consecutively for pattern transfer, with the tape moving from an unwinder roll to a re-winding roll. PTP systems further comprise a paste filling unit which enables continuous paste filling using a supporting counter roll opposite to the paste filling head, a wafer handling unit controllably delivering wafers for the pattern transfer in a parallelized manner that increases throughput, a paste transfer unit with enhanced accuracy and efficiency due to exact monitoring and wafer alignment, as well as a print quality control. The PTP system may be configured to be used in a dual lane configuration with two parallel wafer flows so that the tape and the paste replacement and maintenance in each system are accessible from their front sides. [0030] Figure 1A is a high-level schematic illustration of a pattern transfer printing (PTP) system 100 , according to some embodiments of the invention. Figures 1Band 1Care high-level schematic illustrations of maintenance options and arrangements of PTP systems 100in a dual-lane production line 101 , according to some embodiments of the invention. Figure 1A is a schematic perspective front view of PTP system 100 , Figure 1B is a schematic perspective view of a front side 102 of PTP system 100 , made accessible for easy maintenance, and Figure 1C is a schematic top view of PTP systems 100 arranged in P-606575-IL a dual-lane production line 101 . Figures 2Aand 2B are high-level schematic side view and front view illustrations, respectively, of units and elements in PTP systems 100 , according to some embodiments of the invention. The highly schematic side view illustration of Figure 2A provides a non-limiting example for the arrangement of elements in tape handling unit 200with respect to paste filling unit 120 (carrying out a paste filling stage 203 ) and paste transfer unit 350 (carrying out a pattern transfer stage 353 , see, e.g., in Figures 2A and 2B ), while the highly schematic front view illustration of Figure 2B provides a non-limiting example for the arrangement of elements in wafer handling unit 400 and with respect to tape handling unit 200 . Units and elements illustrated in Figures 2A and 2B are described briefly below, with more details of non-limiting embodiments providing in the consecutive figures. One or more control units 105 (see, e.g., in Figures 2A and 2B ), may be configured to monitor and/or control the units of PTP system 100 , possibly via various processors, and coordinate the operation of PTP system 100 . [0031]PTP system 100 is configured to apply patterns of conductive material onto wafers by non-contact printing. PTP system 100 comprises a tape handling unit 200 configured to handle a tape 205 (see, e.g., Figure 2A ) comprising, as sections thereof, a plurality of pattern transfer sheets 205A , 205B(see, e.g., Figure 2A ) having respective patterns of trenches, and to controllably deliver pattern transfer sheets for paste filling 205A and consecutively for pattern transfer 205B , respectively. Tape handling unit 200 is configured to move tape 205 in a step-and-repeat manner (sheet by sheet) from an unwinder roll 222 to a re-winding roll 242 . PTP system 100 further comprises a paste filling unit 120 configured to fill the trenches on delivered pattern transfer sheets 205A with conductive printing paste. Tape handling unit 200may be further configured to deliver the pattern transfer sheets one-by-one for the paste filling (denoted sheets 205A ) and/or for the pattern transfer (denoted sheets 205B ) with continuous monitoring of the tension and the Machine Direction (MD, along the tape movement) and Cross Machine Direction (CMD, perpendicularly to MD) positions of tape 205 . PTP system 100 further comprises a wafer handling unit 400 configured to controllably deliver a plurality of wafers 90 (see, e.g., Figure 2B ) for the pattern transfer, at a close proximity (e.g., in a range of between 0.1mm and 0.5mm) to the pattern transfer sheet. The PTP system 100 further comprises a paste P-606575-IL transfer unit 350 configured to transfer the conductive printing paste from respective pattern transfer sheet 205B onto respective delivered wafer 90B , by releasing the printing paste from the trenches upon illumination by a laser beam 80 (illustrated, e.g., in Figure 3A ). [0032]The units of PTP system 100 are mounted on a rigid frame in a compact manner, to minimize the system’s footprint. As a general design feature, tape handling is carried out along a vertical direction (denoted "z") and along one horizontal direction (denoted "y", termed machine direction, MD), while wafer handling is carried out along a perpendicular direction thereto, e.g., in another horizontal direction (denoted "x", termed cross machine direction, CMD). [0033]Tape handling unit 200 may be configured to deliver pattern transfer sheets one-by-one for the paste filling (e.g., pattern transfer sheet 205A) - at a paste filling process stage 203 , by help of a moving paste filling head 122- and/or for the pattern transfer (e.g., pattern transfer sheet 205B) - in a paste pattern transfer unit carrying out paste transfer process stage 353 , by help of a movable scanner 355 (e.g., moveable along the x and y axes and optionally tiltable at an angle θ, or possibly an optical head that scans along the y axis, is moveable along the x axis and optionally tiltable at an angle θ), see, e.g., Figure 2A . Details concerning tape 205 and pattern transfer sheets thereupon are provided below. It is noted that in Figure 2B pattern transfer sheet 205A is illustrated schematically at the plane of the drawing as it is located in the paste filling unit 120almost vertically. For example, paste filling unit 120 and pattern transfer sheet 205B plane may be set at an angle deviating 0-30° from the vertical x-z plane. [0034]In embodiments, one or more top dancer 225 and bottom dancer 245 (see, e.g., Figure 2A ) may be configured to buffer the step-and-repeat movement of tape 205 from unwinder roll 222 and to re-winding roll 242 , respectively, as pattern transfer sheet 205A is being filled with paste and/or as paste from pattern transfer sheet 205B is being transferred, so as to ensure that these are carried out with the respective pattern transfer sheet in static positions. Top dancer(s) 225 and/or bottom dancer(s) 245 may be configured to maintain the tension in tape 205 moving through at least a part of PTP system 100 .

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[0035]It is noted that in PTP system 100 , paste filling unit 120 is positioned almost vertically (along the z axis) to ensure a short travelling distance of pattern transfer sheet 205A from paste filling to pattern transfer sheet 205B at paste transfer unit 350 thus enabling to minimize changes of the filled paste condition (e.g., due to drying before printing ) . For example, the near-vertical position may be configured to enable a smaller movement distance for the pattern transfer sheets from state 205A to state 205B , and thereby optionally to locate the laser scanner just behind the vertical filling unit, closer to roll 227A positioned between 205A and 205B , illustrated schematically in Figure 2A . The near-vertical position of paste filling unit 120 is advantageous with respect to prior art horizontal position of paste filling units, as it reduces the distance between the paste filling position ( 205A ) and the paste transfer position ( 205B ) of the pattern transfer sheet 205 . [0036]As illustrated schematically in Figure 1B , front side 102 of PTP system 100 may be configured to have unwinder roll 222 and re-winding roll 242 easily accessible for replacement and maintenance requirements, as well as have paste filling unit 120 easily accessible for paste filling and maintenance requirements – from same front side 102 . Moreover, as illustrated schematically in Figure 1C , PTP systems 100 may be arranged back-to-back, in dual-lane production line 101 , with each of front sides 102 of PTP systems 100A , 100B easily accessible for maintenance. Dual-lane production line 101 may be configured to include two lanes 101A , 101B , each with one or more (serially arranged) PTP systems 100A , 100B , which operate on two (or more) paths of wafers 90 (e.g., independent paths for higher throughput), using a relatively small footprint. [0037]PTP system 100 may further comprise a tape re-use unit 250 (see, e.g., Figure 2A ) configured to clean pattern transfer sheets after the pattern transfer to provide reusable pattern transfer sheets. For example, tape re-use unit 250 may comprise a tape cleaning unit 252 in which tape 205 may be cleaned mechanically, e.g., using scraper(s), ultrasound, and/or other means, and/or chemically using cleaning solutions; and a tape drying unit 255 , with idle rolls 244 , 246 positioned as needed to maintain safe tape movements. Tape 205 may be moved by one or more tape drive motor(s) 230 (illustrated schematically), and further supported by one or more rolls 227 along the way of tape 205 through PTP system 100 . A non-limiting example for tape handling unit 200 is illustrated with more details in P-606575-IL Figures 3A-3E . A non-limiting example for tape re-use unit 250 is illustrated with more details in Figure 4 . [0038]Paste filling unit 120 (see, e.g., Figure 2A ) may comprise moveable paste filling head 122 and a countering moveable roll 125 configured to support a back side of pattern transfer sheet 205A during the paste filling. A non-limiting example for paste filling unit 120 is illustrated with more details in Figures 5A-5E . [0039]In certain embodiments, wafer handling unit 400 may comprise at least one stage 410 enabling movement in x and z axes (termed in the following – the x,z-stage), with each stage 410 comprising at least one holder (e.g., chuck) 415 , and with each holder supporting wafer 90 and enabling wafer movement in y and θ axes (θ axis relates to rotation of a wafer with respect to the x-y plane). In certain embodiments, two x,z-stages 410 of wafer handling unit 400 may be configured to operate in parallel with respect to each other. Each stage 410 may comprise two holders 415 for holding wafers 90 , each holder 415 ensuring wafer movement in y, θ – axis thus enabling faster wafer handling and continuous wafers movement during pattern transfer. Multiple cameras imaging incoming wafers enable more accurate wafer alignment within the printing system thus more accurate alignment of printed conductive lines onto wafer pattern. [0040]Wafer handling unit 400 (see, e.g., Figure 2B ) may comprise two stages 410A , 410B , with each stage 410 supporting two wafers 90 , e.g., via wafer holders 415A , 415B (e.g., vacuum chucks). Each stage 410 may support at least one wafer holder (chuck) 415 , e.g., two or three holders (chucks) 415 . As a non-limiting example, two holders (chucks) 415A , 415B for each of two stages 410A , 410B are illustrated. Stages 410 may be configured to enable movement along the x and z axes, while each holder (chuck) 415 may be configured to support wafer 90 and enable additional wafer movement at least along the y and θ axes, as explained below. [0041]Wafer handling unit 400 may be configured to alternate two stages 410A , 410B during operation to enable parallel operation on wafers 90 by different units of PTP system 100 . For example, the position of wafer 90A may be measured by a wafer alignment unit 420 while wafer 90B received transferred paste by paste transfer unit 350 and wafer 90C is inspected by a print quality control unit 450 , as disclosed herein. During the alteration P-606575-IL of stages 410 , two wafers 90 may be processed by respective units, increasing the overall throughput of PTP system 100 . For example, wafer handling unit 400 may be configured to provide simultaneous (i) wafer measurement of two wafers 90A (first and second wafers, mounted on holders (chucks) 415Aand 415Bon stage 410A , respectively), (ii) pattern transfer to a third wafer 90B (mounted on holder (chuck) 415A on stage 410B ) and (iii) print quality control of a fourth wafer 90C (mounted on holder (chuck) 415B on stage 410B ). Then, wafer handling unit 400 may be configured to move stages 410A , 410B according to arrows 411A , so that the wafers are move to the consecutive operations (e.g., wafer 90A is moved from wafer measurement to pattern transfer, wafer 90B is moved from pattern transfer to print quality control and wafer 90C is moved out of the system, while a new wafer is moved to wafer measurement). Following the linear stage movements along CMD, stages 410A , 410B may be switched (arrow 411B ), so that wafer 90 are further processed, and the movements repeat cyclically, as illustrated schematically in Figure 6C ). [0042]Wafer handling unit 400 may further comprise mechanical elements such as input wafer conveyor 412 for supplying wafers 90 and mounting them on wafer holders 415 of respective stage 410 and output wafer conveyor 419 for receiving printed wafers 90 from wafer holders 415 of respective stage 410 . A non-limiting example for wafer handling unit 400 and a schematic description of its operation is illustrated with more details in Figures 6A-6C . [0043]Wafer alignment unit(s) 420 (e.g., 420A and 420B , see Figure 2B ) may be configured to detect and measure features on wafers and to adjust the wafer position to the pattern transfer accordingly – is illustrated with more details in a non-limiting example in Figures 6D and 6E . [0044]In certain embodiments, wafer handling unit 400 may comprise more than two stages 410 , accompanied with multiplication of any of wafer alignment unit 420 , paste transfer unit 350 and/or print quality control unit 450 - to further increase the throughput of PTP system 100 . [0045]PTP system 100 may further comprise a tape stretching unit 270 (see, e.g., Figures 2Aand 7A ) configured to affix and flatten respective pattern transfer sheet 205B during the paste pattern transfer from pattern transfer sheet 205B to wafer 90B . PTP system 100 P-606575-IL may further comprise a trench alignment monitoring unit 300 configured to monitor a position (e.g., in x, y and theta (tilt) directions) and a distortion of the trenches prior to the pattern transfer. A non-limiting example for tape stretching unit 270 and trench alignment monitoring unit 300 is illustrated with more details in Figures 7A-7C . [0046]Paste transfer unit 350 (e.g., a laser scanner) may comprise a laser scanner (scanning head) 355 (e.g., movable along CMD, e.g., by a linear stage, a ball-screw stage, etc.) configured to control the illumination of pattern transfer sheets 205B by the laser beam for depositing the paste from the patterned trenches of pattern transfer sheets 205B . [0047]PTP system 100 may further comprise a print quality control unit(s) 450(e.g., 450Aand 450B , see Figure 2B ) configured to control a print quality of the pattern transfer, in particular to detect tiny defects such as openings or gaps within the printed fingers or other defects in the pattern that was transferred onto the wafer. For example, print quality control unit(s) 450 may be based on imaging cameras, which transfer the acquired images of inspected wafers to processor(s) 452 for image processing. A non-limiting example for a print quality control unit 450 is illustrated with more details in Figure 8 . [0048] Figure 3A is a high-level schematic side view illustration of tape handling unit 200 , according to some embodiments of the invention. Tape handling unit 200 may be configured to move tape 205 , while delivering pattern transfer sheets 205A one-by-one for the paste filling (at paste filling unit 120 , see, e.g., Figure 2A ) and/or for the pattern transfer (at pattern transfer unit 350 ) by continuously controlling the tape tensions and accurate position of the sheets in both MD and CMD coordinates. Figures 3B-3E are high-level schematic illustrations of tape 205 with pattern transfer sheets 205B (see, e.g., Figure 2A ) and of paste pattern transfer unit 350 , according to some embodiments of the invention. [0049]The CMD positions of unwinder roll 222 and re-winding roll 242 may be continuously controlled and if needed corrected by help of one or more control unit(s) 105 , e.g., by controlling driving motor(s) thereof. Top dancer(s) 225 and bottom dancer(s) 245 may be configured to support fast stepwise movements of pattern transfer sheets 205A , 205B (as segments of tape 205 ) to their respective positions for paste filling and pattern transfer. Idle rolls 227 (only some of which indicated) may be configured to direct tape movement through tape handling unit 200 .

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[0050]Tape handling unit 200 may be configured to enable fast and accurate provision and changing of the tape segments (pattern transfer sheets) used to print the wafers. Tape handling unit 200 may be further configured to have a compact design with a minimal footprint, and be set within a stable and rigid frame or chassis for supporting its operation and also for enabling easy maintenance. Tape re-use unit 250 may be set within the frame and in the path of tape 205 and enable reusing tape 205 – making the overall process more efficient and economical. [0051] Figures 3B-3E are high-level schematic illustrations of tape 205 with pattern transfer sheets 205B and of pattern transfer unit 350 , according to some embodiments of the invention, which are disclosed in more details in Chinese Patent Applications Nos. 202111034191X and 2021221306455, incorporated herein by reference in their entirety. [0052]Highly schematic Figure 3B illustrates transfer of patterned paste from the pattern transfer sheet 205B to substrate (e.g., wafer) 90B using laser illumination by laser scanner(s) 355 . Pattern transfer sheets 205B comprises a plurality of trenches 210 arranged in a specified pattern and configured to receive printing paste and release the printing paste from trenches 210upon illumination by laser beam 80 onto a receiving substrate such as wafer 90B . Figures 3Band 3E schematically illustrate the filling of trenches 110 on an empty pattern transfer sheet on tape 205with paste to yield filled pattern transfer sheet 205A , which is then moved further in PTP system 100 to have the paste released from trenches 210 of pattern transfer sheet 205Bonto wafer 90B . It is noted that while the tape is denoted generally by the numeral 205 , sections of tape 205 that are designed as used as pattern transfer sheets are denoted by numeral 205A when they are in paste filling stage 203 and are denoted by numeral 205B when they are in paste pattern transfer stage 353(illustrated schematically in Figure 3B by an arrow). [0053]Pattern transfer sheets may further comprise at least one trace mark 220that is located outside the specified pattern of trenches 210 and is configured to receive the printing paste. Trace mark(s) 220 is aligned with respect to respective trench(es) 210and is wider than a width of laser beam 80 . Upon illumination by laser beam 80 , only a part of the paste in trace mark(s) 220 is released (off pattern transfer sheet 205B ), because the width of trace mark(s) 220 is larger than the width of laser beam 80 – yielding a gap that P-606575-IL may be used to detect the actual position of the laser beam relative to the position of the corresponding trench. [0054]Pattern transfer sheet may further comprise a plurality of working window marks 223that are located outside the specified pattern of trenches 210 and are configured to receive the printing paste. Working window marks 223 are set at specified offsets with respect to specified trenches 210 of the specified pattern, with different working window marks 223 being set at different offsets. Working window marks 223 may be used to monitor the power of laser beam 80 needed for releasing paste from all the trenches. [0055]In certain embodiments, pattern transfer sheet may comprise both trace mark(s) 220 and working window marks 223 , which may be configured to enable unambiguous detection by image processing, e.g., by a trench alignment monitoring unit 300. [0056]Pattern transfer sheet may further comprise a plurality of alignment marks (not shown) that are located outside the specified pattern of trenches 210 , aligned with respective trenches 210 , configured to receive the printing paste and used to provide initial laser scanner alignment with respect to the specified pattern of trenches 210 . [0057]A trench alignment monitoring unit 300 may be configured to monitor the pattern transfer process optically, e.g., monitoring the transfer of the printing paste by emptying of trenches 210 and of marks 220 , 223 onto the substrate, as explained herein. One or more processor(s) 356 or controller(s), in communication with control unit(s) 105 , may be in communication with laser scanner(s) 355(in paste transfer unit 350 ) and imaging unit(s) 300 and be configured to adjust optical parameters of laser illumination by modifying the settings of power and position of laser scanner(s) 355 according to image analysis of images taken by imaging unit(s) 300 . These adjustments and modifications improve the quality and accuracy of pattern transfer stage 353 . For example, processor(s) 356 or controller(s) may be configured to calculate an alignment of laser beam 80 according to traces on pattern transfer sheet (after the paste is released therefrom), e.g., detect misalignment of laser scanner 355 upon detection of asymmetric trace(s) as disclosed in Chinese patent application Nos. 202111034191X and 2021221306455, incorporated herein by reference in their entirety. Processor(s) 356 or controller(s) may be further configured to calculate an effective working window of laser illumination 80 using remaining working P-606575-IL window marks 223on pattern transfer sheet (after the paste is released therefrom), and adjust laser power of the laser scanner 355 accordingly. Additional non-limiting details for PTP systems 100 are provided, e.g., in U.S. Patent No. 9,616,524. [0058]Disclosed PTP systems 100 and tape 205 may be used to print fine lines 92 of thick metallic paste to produce electronic circuits, e.g., creating conductive lines or pads or other features on laminates for PCBs or other printed electronic boards, or on silicon wafers, e.g., for photovoltaic (PV) cells. Other applications may comprise creating conductive features in the manufacturing processes of mobile phones antennas, decorative and functional automotive glasses, semiconductor integrated circuits (IC), semiconductor IC packaging connections, printed circuit boards (PCB), PCB components assembly, optical biological, chemical and environment sensors and detectors, radio frequency identification (RFID) antennas, organic light-emitting diode (OLED) displays (passive or active matrix), OLED illuminations sheets, printed batteries and other applications. For example, in non-limiting solar applications, the metallic paste may comprise metal powder(s), optional glass frits and modifier(s), volatile solvent(s) and non-volatile polymer(s) and/or or resin(s). A non-limiting example for the paste includes SOL9651B™ from Heraeus™. [0059] Figure 3C is a high-level schematic cross section illustration of tape (pattern transfer sheet) 205 , according to some embodiments of the invention. In certain embodiments, tape 205 may be transparent to laser illumination and comprise at least a top polymer layer 214 comprising trenches 210 and marks 220 , 223 (illustrated schematically in Figure 3B ) which formed by press molding , pneumatic molding or laser molding thereon. In the illustrated non-limiting example, trenches 210 are illustrated as being trapezoid in cross section. [0060]Tape 205 may comprise at least one polymer layer, which may be selected from at least one of: polyethylene, polypropylene, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, fully aromatic polyester, other copolymer polyester, polymethyl methacrylate, other copolymer acrylate, polycarbonate, polyamide, polysulfone, polyether sulfone, polyether ketone, polyamideimide, polyether imide, aromatic polyimide, alicyclic polyimide, fluorinated polyimide, cellulose acetate, cellulose P-606575-IL nitrate, aromatic polyamide, polyvinyl chloride, polyphenol, polyarylate, polyphenylene sulfide, polyphenylene oxide, or polystyrene. [0061]It is noted that while schematic Figure 3C shows periodical trenches 210 , marks 220 and/or 223 (illustrated schematically in Figure 3B ) may comprise trenches, recesses and/or indentations that are embossed in a similar manner into top polymer layer 214 , and may have similar or different profiles. For example, trenches 210 , trace marks 220 and/or working window marks 223 , and alignment marks may have various profiles (cross section shapes), such as trapezoid, rounded, square, rectangular and triangular profiles. In various embodiments, the pattern of trenches 210 on tape 205 may comprise continuous trenches 210 and/or arrays of separated dents. It is noted that the term "trenches" is not to be construed as limiting the shape of trenches 210 to linear elements, but is understood in a broad sense to include any shape of trenches 210 . [0062]Tape 205 may comprise a top polymer layer 214and a bottom polymer layer 212, the bottom polymer layer 212 having a melting temperature that is higher than an embossing temperature of the top polymer layer 214 . In some embodiments, top polymer layer 214may be made of semi-crystalline polymer and have a melting temperature, e.g., below 150°C, below 130°C, below 110°C or have intermediate values. In some embodiments, top polymer layer 214may be made of amorphous polymer and have a glass temperature below 160°C, e.g., below 140°C, below 120°C, below 100°C or have intermediate values. Bottom polymer layer 212may have a higher melting temperature than the melting temperature or the glass temperature of top polymer layer 214 . For example, bottom polymer layer 212may have a melting temperature above 150°C, above 160°C (e.g., bi-axially-oriented polypropylene), above 170°C, and up to 400°C (e.g., certain polyimides), or have intermediate values. [0063]In certain embodiments, top and bottom polymer layers 214 , 212(respectively) may be between 10µm and 100µm thick, e.g., between 15µm and 80µm thick, between 20µm and 60µm thick, between 25µm and 45µm thick, or have other intermediate values - with bottom polymer layer 212being preferably at least as thick as top polymer layer 214 . The polymer layers may be attached by an adhesive layer 213that is thinner than 10µm (e.g., thinner than 8µm, thinner than 6µm, thinner than 4µm, thinner than 2µm or have P-606575-IL intermediate values) and is likewise transparent to the laser illumination. For example, in certain embodiments, top polymer layer 214may be thicker than the depth of trenches 210 by several µm, e.g., by 5µm, by 3-7µm, by 1-9µm, or by up to 10µm. For example, trenches 210 may be 20µm deep, top polymer layer 214 may be 20-30µm thick and bottom polymer layer 212may range in thickness between 25µm and 45µm (it is noted that thicker bottom polymer layer provide better mechanical performances). It is noted that the term "trenches" is not to be construed as limiting the shape of trenches 210 to linear elements, but is understood in a broad sense to include any shape of trenches 210 . [0064]The temperature and thickness of top and bottom polymer layers ( 214 , 212respectively) may be designed so that top polymer layer 214has good molding, ductility and certain mechanical strength, while bottom polymer layer 212has good mechanical strength. Both top and bottom polymer layers ( 214 , 212respectively) may be designed to have good bonding properties. [0065] Figures 3D and 3Eare high-level schematic illustrations of dynamic PTP system 100 , according to some embodiments of the invention. Dynamic PTP system 100 comprises at least one laser scanner optical head(s) 355 configured to illuminate with laser beam(s) 80 pattern transfer sheet 205B with trenches 210 arranged in a first pattern 206 and holding printing paste in filled trenches 92 , which is then released onto wafers 90 upon the illumination by laser beam 80 from laser scanner optical head(s) 355 configured to have a fast-scanning axis along machine direction 87(y axis, MD) and may be moved along cross machine direction 85(x axis, CMD). The releasing of the paste from the trenches implements pattern transfer stage 353 , which is indicated schematically in Figures 3D and 3Eby arrows. [0066]Dynamic PTP system 100 may comprises moveable stages 410 with wafer holders 415 affixing wafers 90 (e.g., by help of vacuum clamping) to moveable stage 410 during the releasing of printing paste 92 from pattern transfer sheet 205B . Moveable stage 410 may comprise any type of stage or wafer holder that can affix and move wafers 90 . Moveable stage 410 may be moved by any type of actuator, e.g., by linear or step motors. [0067]Dynamic PTP system 100 may further comprises controller(s) and/or processor(s) 357 , possibly associated with control unit(s) 105 , and configured to control laser scanner P-606575-IL optical head 355 to direct laser beam 80 along trenches 210 (along machine direction 87 -MD), and at a cross machine direction 85 (CMD, scanning direction) across trenches 210 . Processor(s) 357may further be configured to move moveable stage 410 (the movements are denoted schematically by numeral 417 ) to yield a second pattern 96 of deposited paste on wafer 90 , which is different from first pattern 206 of trenches 210on pattern transfer sheet 205B . Advantageously, in contrast to current practice which is limited to transferring the same pattern (e.g., of lines) from pattern transfer sheet 205B to wafer 90 , various embodiments of dynamic PTP system 100 enable to deposit the transferred metal paste onto wafer 90 at patterns (second pattern 96 ) which are different from first pattern 206 of trenches 210 on pattern transfer sheet 205B . [0068]As illustrated schematically in Figure 3E , wafer 90B may comprise a pattern of substantially parallel linear locations arranged with a certain receiving pitch p 2, for receiving the paste release from trenches 210 of pattern transfer sheet 205B , in a close proximity (e.g., in a range of between 0.1mm and 0.5mm) to pattern transfer sheet 205B in such a way that the first trench on pattern transfer sheet 205B is located exactly opposite to the first linear location on wafer 90B . Scanning the paste-filled trench pattern 206 on pattern transfer sheet 205B by laser beam 80 sequentially from the first trench to the last trench results in the deposition of the paste onto the specified locations on wafer 90B to yield deposited paste in a specified pattern 96 . As processor(s) 357 and/or control unit 105 move wafer 90B during the scanning (movements indicated schematically by numeral 417 ), the paste is deposited at a different pitch (p 2≠p 1), depending on the direction and speed of motion. [0069]It is noted that scanning along x-axis may be carried out in forward and/or backward directions, and respective movements 417 of wafer 90 may be adjusted accordingly. In the present disclosure cross machine direction 85 is illustrated in one direction, as a non-limiting example. [0070]For example, first pattern 206 of trenches 210 on pattern transfer sheet 205B may have a first pitch ("p 1") and second pattern 96 of deposited paste on wafer 90 may have a second pitch ("p 2"), that may be smaller or larger than first pitch ("p 1"), e.g., p 1>p 2 or p 1 P-606575-IL wafer 90 or over a part of the extent of wafer 90 . In some examples, the difference of pattern may comprise p 1>p 2 in some area(s) of wafer 90while p 1 p 2), processor 357 may be configured to move moveable stage 410 along scanning direction 85 (CMD, denoted 417A ) at a forward speed set to convert first pitch p 1 to second pitch p 2. For example, with forward speed denoted as vF and the time between deposition of consecutive lines denoted as t, p 2=p 1-vF·t. Alternatively or complementarily, denoting the scanner speed across trenches 210 as v S=p 1/t, the approximate relation between the pitches is p 2=p 1·(vS-v F)/v S. [0072]In certain embodiments, with first pitch p 1 being smaller than second pitch p (p 1 P-606575-IL may be set to direct tape movement through and after tape re-use unit 250 . During the tape segment advance movement, one or more idles rolls 248shown in the bottom part of unit 250 may move upward enabling smooth tape movement and continuous tension control performing as dancers, similar to dancers 225 , 245 . After finishing the segment advance, rolls 248 may go downwards under their own weight. Alternatively or complementarily, tape re-use unit 250 may comprise one or more dancers configured to maintain the tension in tape 205 moving through tape re-use unit 250 . [0074] Figures 5Aand 5B are high-level schematic illustrations of paste filling unit 120 , according to some embodiments of the invention. Figure 5A is a perspective view and Figure 5B is a side view. Figures 5C-5E are high-level schematic illustrations of filling head 122 , according to some embodiments of the invention. Figures 5C and 5E are schematic side view in cross section and Figure 5D is a perspective view from below filling head 122 . [0075]As illustrated schematically in Figures 5A and 5B , paste filling unit 120 may comprise a frame on which paste filling head 122 and bottom roll 125 are mounted, and with respect to which they are moved simultaneously. Movements of the paste filling head assembly may be controlled by one or more control unit(s) 105 e.g., via controlling respective flexible rack 126 attached to paste filling head 122 , drive motors 124 and/or gantry motion system 128. [0076]Bottom roll 125 may be configured to counter paste filling head 122 and support pattern transfer sheet 205A of tape 205 during the filling of pattern transfer sheet 205A with the paste by paste filling head 122 . Bottom roll 125 may be configured to roll during operation, possibly controllably. [0077]Paste filling unit 120 may be configured to enable fast, uniform and accurate filling of the high viscosity paste into the trenches having a high aspect ratio. Paste filling unit 120 may be further configured to clean the surface of tape 205 after filling, e.g., disclosed in WIPO Publication No. 2015128857, which is incorporated herein by reference in its entirety. [0078]As illustrated schematically in Figures 5C-5E , and disclosed in more details in Chinese Patent Applications Nos. 2021106730065 and 2021213505781, incorporated P-606575-IL herein by reference in their entirety, filling head 122 of paste filling unit 120 may comprise at least two feeding openings 161 , 169 , an internal cavity 165 and at least one dispensing opening 160 that are in fluid communication (see, e.g., Figures 5D and 5E ) and a pressurized paste supply unit 155 configured to circulate paste 190 through printing head 150 . The pressure in the pressurized paste supply unit may be adjusted to maintain continuous circulation of the paste through feeding openings 161 , 169 and internal cavity 165 and to control dispensing of the paste through dispensing opening(s) 160 . For example, pressurized paste supply unit 155 may comprise a pressurized paste reservoir 154 and a paste pump 152 in fluid communication with internal cavity 165 of printing head 150 , which are configurated to circulate the paste therethrough. In non-limiting examples, paste pump 152 may comprise rotating pressure-tight displacement systems with self-sealing, rotor/stator designs for dispensing precise volumes such as eco-PEN450™ from Dymax™. [0079]In various embodiments, paste filling unit 120 comprises at least one pressure sensor 140 configured to measure the pressure of the circulating paste, e.g., pressure sensor 140 illustrated schematically in Figures 5C-5E and associated with a paste mixer 130 or pressure sensors 140A , 140B illustrated schematically in Figure 5C , at either ends of printing head 150 , as non-limiting examples. Alternatively or complementarily, pressure measurement may be implemented within elements of pressurized paste supply unit 155 , such as paste pump 152 and/or paste reservoir 154 . Paste filling unit 120 may further comprise at least one processor 167 and/or controller (shown schematically in Figure 5E ), in communication with control unit(s) 105 and configured to adjust the pressure in pressurized paste supply unit 155 (or its components) with respect to the measured pressure of the circulating paste. Paste filling unit 120 may further comprise one or more paste mixer(s) 130 configured to mix the circulating paste. For example, paste mixer(s) 130 may be a static mixer, mixing the paste by utilizing its pressurization. In non-limiting examples, paste mixer(s) 130 may comprise plastic disposable static mixers such as GXF-10-2-ME™ from Stamixco™ made of large diameter plastic housing that includes multiple mixing elements. [0080]Pressurized paste supply unit 155 may be further configured to introduce the paste into internal cavity 165 via at least one entry opening 161 of the at least two feeding P-606575-IL openings and to receive the circulated paste via at least one exit opening 169 of the feeding openings in printing head 150 . Typically, entry opening(s) 161 and exit opening(s) 169 are at the top of printing head 150 , opposite to dispensing opening(s) 160 which faces the pattern transfer sheet with trenches which are to be filled by the paste. Alternatively or complementarily, entry opening(s) 161 and/or exit opening(s) 169 may be positioned on sides and/or extension(s) of printing head 150 . [0081]Pressurized paste supply unit 155 may comprise pressure-controlled paste reservoir 154 , paste pump 152 and mixer 130 that are in fluid communication. Pressure-controlled paste reservoir 154 may be configured to deliver paste to paste pump 152 , which may be configured to deliver the paste through mixer 130 to entry opening(s) 161 . Pressurized paste supply unit 155 may be further configured to mix paste from exit opening(s) 169 with the paste delivered from pressure-controlled paste reservoir 154 to paste pump 152 . For example, as illustrated schematically in Figures 5C and 5E , paste 190 in paste reservoir 154 may be delivered ( 191 ) to paste pump 152 , mixing ( 192 ) with paste 197 exiting from exit opening(s) 169 of printing head 150 , to be pumped by paste pump 152 into mixer 130 . Paste 193 from mixer 130 may be delivered ( 194 ) to entry opening(s) 161 of printing head 150 , wherein paste 196 moves along internal cavity 165 and some paste 195 may be dispensed through dispensing opening(s) 160 to form patterns on the transfer sheet 205A such as lines to be then printed (after the tape movement, from transfer sheet 205B ) on the receiving substrate such as wafer 90 (e.g., silver lines of about 20µm width on silicon wafers for PV cells, see, for non-limiting examples, Lossen et al. 2015). Remaining paste 197 is then mixed with paste 191 from paste reservoir 154 (e.g., delivered through nozzle 163 at junction 151 ) to compensate for the dispensed amount, and the paste is circulated through Paste filling unit 120 to maintain its mechanical characteristics and support continued mixing of the paste to maintain its uniform composition. In certain embodiments, paste filling unit 120 may be further configured to modify paste composition, e.g., by adding additives such as solvents to keep the paste homogenized, possibly in relation to the monitored pressures throughout paste filling unit 120 . For example, additives such as solvents may be added to the paste entering mixer 130 if needed.

P-606575-IL id="p-82" id="p-82" id="p-82" id="p-82" id="p-82" id="p-82" id="p-82" id="p-82" id="p-82" id="p-82" id="p-82"

[0082]In various embodiments, printing head 150 , internal cavity 165 and dispensing slit as opening 160 limited by slit edges 162 (e.g., metallic slit lips) may be elongated (see, e.g., Figure 5D ) and configured with respect to paste properties (e.g., viscosity values), specified throughput and specified features (e.g., length, width and optionally cross section) of the lines or other elements that are to be dispensed by printing head 150 . In certain embodiments, dispensing opening 160 may comprise one or more slits, one or more opening, a plurality of linearly-arranged openings, e.g., one or more lines of circular or elliptical openings, and so forth. [0083]In various embodiments, paste material may comprise conductive silver based metallic paste, and may typically be of high viscosity (e.g., in the range of several tens to several hundreds of Pa·s). For example, in non-limiting solar applications, the metallic paste may comprise metal powder(s), optional glass frits and modifier(s), volatile solvent(s) and non-volatile polymer(s) and/or or resin(s). A non-limiting example for the paste includes SOL9651B™ from Heraeus™. [0084]Paste filling unit 120 may comprise one or more pressure sensor (s) 140 , 140A , 140B configured to measure the pressure of the circulating paste at one or more respective locations along the paste circulation path. For example, pressure sensor(s) 140 , 140A , 140B may be set adjacent to entry opening(s) 161 , exit opening(s) 169 , in fluid communication with internal cavity 165 of printing head 150 and/or in association with any of mixer 130 , paste reservoir 154 and/or paste pump 152 . Pressure-related indications from pressurized paste reservoir 154 and/or paste pump 152 may also be used to monitor paste circulation through Paste filling unit 120 and/or to monitor and possibly modify the paste properties such as its viscosity, e.g., by adding solvent. Paste filling unit 120 may further comprise at least one controller (e.g., as part of or in communication with control unit 105 and/or as at least one computer processor 173 as illustrated in Figure 10 ), in communication with any of the components of paste filling unit 120 , e.g., via communication link(s)) configured to adjust the pressure in pressure-controlled paste reservoir 154 and/or paste pump 152 with respect to the measured pressure of the circulating paste, e.g., as received from one or more pressure sensor (s) 140 , 140A , 140B . In non-limiting examples, any of pressure sensor(s) 140 may comprise, e.g., small profile, media compatible, piezoresistive silicon pressure P-606575-IL sensors packaged in a stainless-steel housing (e.g., MEAS 86A™ from T.E. connectivity™ or equivalent sensors). [0085]In various embodiments, pressure-controlled paste reservoir 154 and paste pump 152 may open adjacently to exit opening(s) 169 of printing head 150 and paste filling unit 120may comprise a conduit 135 connecting the exit of mixer 130 to entry opening(s) 161 of printing head 150 . In some embodiments, pressure-controlled paste reservoir 154 and paste pump 152 may open adjacently to exit opening(s) 169 of printing head 150 , mixer 130 may be adjacent to entry opening(s) 161 of printing head 150 , and conduit 135 may connect paste pump 152 to mixer 130 . Pressure sensor 140 may be associated with mixer 130 . The dimensions and orientations of paste reservoir 154 and paste pump 152 may vary, e.g., both paste reservoir 154 and paste pump 152 may be set perpendicularly to printing head 150(see, e.g., Figure 5C ), or one or both of paste reservoir 154 and paste pump 154 may be set at an angle to printing head 150 . For example, paste pump 152 may be set obliquely to spread its weight more evenly over printing head 150 , as illustrated schematically in Figures 5Dand 5E . [0086]In various embodiments, conduit 135 may be adjusted to conform to any arrangement of paste reservoir 154 , paste pump 152and mixer 130 , so as to make paste filling unit 120 more compact or adjust it to a given space and weight distribution requirements within the printing machine. Holder 145 (see, e.g., Figure 5C ) is illustrated schematically as an attachment element for attaching paste filling unit 120to the printing machine (see, e.g., U.S. Patent No. 9,616,524 for a non-limiting example). In non-limiting examples, conduit 135 may be connected between an opening 131 in mixer 130 and an opening 138of connector 137 at entry opening 161 in printing head 150(see, e.g., Figure 5C ） ） ） ） or between opening 131 in paste pump 152 and opening 138 in mixer 130(see, e.g., Figure 5E ） ） ） ）. [0087] Figures 6A-6C are high-level schematic illustrations of wafer handling unit 400 and of its operation, according to some embodiments of the invention. Figure 6A is a side view, Figure 6B is a partial perspective view and Figure 6C is a schematic illustration of the wafer handling.

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[0088]Wafer handling unit 400 is configured to increase the throughput of PTP system 100 by enabling parallel processing of different wafers 90 . Wafer holders 415A , 415B (see Figure 6B , e.g., vacuum chucks) may be configured to move in parallel (e.g., along the horizontal x axis and also along vertical z axis) and apply wafer position corrections during movements along the horizontal y axis and with respect the wafer’s tilting angle (denoted θ). For example, each stage 410A , 410B may be configured to adjust both wafer holders 415A , 415B (that may adjust the wafer positions) along the x-axis and the z axis. Correspondingly, wafer handling unit 400 may comprise one or more motors 413 , e.g., a linear motor 413A (illustrated schematically) for moving stage 410A , along the x axis and a motor 418A (illustrated schematically) for adjusting the position of wafer stage 410A (with holders 415A and 415B ) along the z axis. The positions along the y and θ axes are adjusted by each holder 415 separately. Accordingly, a linear motor 413B (not shown), which is mounted in parallel to motor 413A , moves stage 410B along x axis and motor 418B adjusts wafer stage 410B (holders 415A and 415B ) along the z axis. Both stages 410A and 410B are operated in parallel along the x axis by motors 413A and 413B and are separated when moving in opposite directions by changing their z-position by motors 418A and 418B , accordingly. [0089]In various embodiments, wafer handling unit 400 may be configured to have two stages working in parallel which are each movable along x and z directions. Each stage 410 may comprise two holders 415for holding wafers 90 , with each holder 415 ensuring wafer movement along the y and θ axes (θ denoting tilting of the wafer) thus enabling faster wafer handling and continuous wafers movements during the pattern transfer process. Multiple cameras may be configured to capture images of the incoming wafers to enable more accurate wafer alignment within the printing system thus more accurate alignment of printed conductive lines onto wafer pattern(s). [0090]As illustrated schematically in Figure 6C , wafer handling unit 400 may be configured to move wafers 90 from input conveyor 412 through pre-alignment measurement stage (receiving the wafer at position 90A ), pattern transfer printing stage (receiving the wafer at position 90B ) and print quality control stage (receiving the wafer at position 90C ) to output conveyor 419 , while parallelizing wafer treatment so that wafers P-606575-IL supported by either stage 410A , 410B are processed in parallel. (e.g., during pattern transfer 90B to Wafer 1 (held by holder 415A ) of Stage 1 ( 410A ), Wafer 2 (held by holder 415B ) of Stage 2 ( 410B ) may already be pre-aligned (wafer 90A ), while Wafers 1 and (held by holders 415A , 415B , respectively) of Stage 1 ( 410A ) are pre-aligned ( 90A ) and printed ( 90B ), respectively, Wafer 1 (held by holder 415A ) of Stage 2 ( 410B ) undergoes quality control (wafer 90C ), etc. Wafer handling unit 400 may be mounted on a granite base 405 (see, e.g., in Figure 6B ) to stabilize all the modules and reduce inaccuracies that may result from frequent and fast movements of wafer stages and other moving parts. [0091]Wafers 90 may be a silicon wafer, as used, e.g., for manufacturing PV cells of different types as described in detail, e.g., in Luque and Hegedus (eds.) 2011, Handbook of photovoltaic science and engineering, pages 276-277, incorporated herein by reference in its entirety. [0092] Figures 6Dand 6E are high-level schematic illustrations of wafer alignment unit 420 , according to some embodiments of the invention. Each wafer 90A may be identified by specified features thereof and its placement may be adjusted relative to the paste transfer printing unit according to the exact locations of the specified features. For example, selective emitter (SE) solar cells comprise localized lines (SE lines) of heavy doping in Si substrate onto which the metal contacts are printed by paste transfer. Wafer alignment unit 420 may be configured to measure the locations of the SE lines on wafer 90A and the position of the wafer may be adjusted so that the paste transfer for each printed finger is done by paste transfer unit 350 with respect to the positions of the SE lines, as determined by wafer alignment unit 420 in order to increase the overall printing accuracy. [0093]Wafer alignment unit 420 may comprise camera array(s) 430 with associated illumination, configured to measure the locations of specific features on wafer 90A , e.g., of the SE lines. For example, wafer alignment unit 420 may comprise multiple imaging cameras configured to capture at least a part of a perimeter of wafer 90 , possibly most or all of the wafer perimeter. The cameras of array(s) 430 may be configured to image the wafer corners (using e.g., four cameras for the areas near the wafer corners) as well as features at a middle of the wafer (using, e.g., two or more cameras to image areas including P-606575-IL two opposite ends of the specific features, such as several trenches located in the middle of the wafer). [0094]In case of two wafer holders 415A , 415B with respective wafer per stage 410 , camera arrays 430 may comprise two respective sub-arrays 430A , 430B , each comprising, e.g., two rows of cameras, configured to measure wafer 90A at the respective position (e.g., as Wafer 1 or Wafer 2, illustrated schematically in Figure 6C ). In non-limiting examples, each camera sub-array 430A , 430B may comprise six cameras 435 with respective illumination sources (e.g., four LEDs boards 422 per sub-array configured to provide uniform illumination of the camera’s Field of View (FoV) with high contrast of the SE lines images) – which may be configured to provide accurate x and θ coordinates of the SE lines and the SE pitch even if the SE pitch is not unform in the x direction (CMD). [0095]Camera array(s) 430 may be mounted to the system chassis to ensure their stability and accuracy of the measurements. Processors 425 may receive the images from camera arrays 430 , apply high resolution image processing algorithms to yield an accuracy of the SE line measurements of one to few microns, and provide the data to control unit(s) 105 to adjust the wafer position relative to paste transfer unit 350 . Cameras 435 may be, for example, of 5 Mpix CMOS type, with an imaging lens, for example, of 25mm focal length. It should be noted that number of cameras 435 in each array 430 affects the accuracy of wafer alignment to the transfer sheet pattern thus of the position of printed finger lines 92 onto SE lines on wafer 90B (see, e.g., Figure 3E ). As a non-limiting example, the number of cameras may be six thus enabling to determine accurate x, θ - positions of the first and the last SE lines by four corner cameras as well as to estimate the SE pitch along the CMD by help of two intermediate cameras. In a non-limiting example, four LED boards 422 may be used to enable uniform illumination of FOVs of all the cameras by near-normal illumination, which enables high contrast imaging of the SE lines. [0096] Figures 7A-7Care high-level schematic illustrations of tape stretching unit 270 and trench alignment monitoring unit 300 , according to some embodiments of the invention. Figure 7A is a front view (without tape 205 ) with an inset side view and Figures 7B and 7C are perspective views from below (facing the front of tape stretching unit 270 ) and from above (facing the back of tape stretching unit 270 and alignment monitoring unit P-606575-IL

Claims (20)

1.P-606575-IL

2.CLAIMS What is claimed is: 1. A pattern transfer printing (PTP) system comprising: a tape handling unit configured to handle a tape comprising, as sections thereof, a plurality of pattern transfer sheets having respective patterns of trenches, and to controllably deliver the pattern transfer sheets for paste filling and consecutively for pattern transfer, a paste filling unit configured to fill the trenches on the delivered pattern transfer sheets with conductive printing paste, a wafer handling unit configured to controllably deliver at least one wafer for the pattern transfer at a close proximity to the pattern transfer sheet, a paste transfer unit configured to transfer the conductive printing paste from the pattern transfer sheets filled with the conductive printing paste onto the wafer delivered in position, by releasing the conductive printing paste from the trenches upon illumination by a laser beam, wherein the tape handling unit is configured to move the tape from an unwinder roll to a re-winding roll in a step-and-repeat mode. 2. The PTP system of claim 1, wherein the tape handling unit is further configured to deliver the pattern transfer sheets one-by-one for the paste filling and/or for the pattern transfer.

3. The PTP system of claim 1 or 2, wherein the tape handling unit further comprises at least one top dancer and at least one bottom dancer configured to maintain a tension of the tape continuously.

4. The PTP system of any one of claims 1-3, further comprising a tape re-use unit configured to clean the pattern transfer sheets after the pattern transfer to provide reusable pattern transfer sheets and optionally comprising a pre-cleaning compartment for removing clumps of paste, a cleaning compartment configured to remove fine paste remains and a drying unit for drying the tape before rewinding. P-606575-IL

5. The PTP system of claim 4, wherein the tape re-use unit further comprises at least one dancer and/or rolls configured to maintain a tension of the tape moving through the tape re-use unit.

6. The PTP system of any one of claims 1-5, wherein the paste filling unit comprises moveable paste filling head and a countering moveable roll configured to support a back side of the pattern transfer sheet during the paste filling.

7. The PTP system of any one of claims 1-6, wherein the paste filling unit is set at an angle in the range of 0-30° relative to the vertical axis.

8. The PTP system of any one of claims 1-7, wherein the wafer handling unit comprises at least one stage enabling movement in x and z axes, each of the at least one stage comprising at least one holder, with each of the at least one chuck supporting a wafer and enabling wafer movement in y, θ axes.

9. The PTP system of any one of claims 1-8, further comprising a pattern transfer unit configured to control the illumination of the paste-filled trenches on the transfer sheet by the laser beam.

10. The PTP system of claim 9, wherein the illumination of the paste-filled trenches is done one-by-one by help of an optical head enabling fast laser scanning along the MD and movable along the CMD.

11. The PTP system of any one of claims 1-10, further comprising a tape stretching unit configured to affix and flatten the respective pattern transfer sheet during the pattern transfer.

12. The PTP system of any one of claims 1-11, further comprising a trench alignment monitoring unit configured to monitor a position and a distortion of the trenches prior to the pattern transfer.

13. The PTP system of claim 12, wherein the trench alignment monitoring unit comprises multiple imaging cameras configured to capture ends of the trenches and at least two tilted imaging cameras configured to capture at least middle-sections of the trenches, wherein the tilt is with respect to a vertical direction and is configured to capture the middle-sections of the trenches. P-606575-IL

14. The PTP system of any one of claims 1-13, further comprising a wafer alignment unit configured to detect and measure features on the wafer and further adjust the wafer position in the pattern transfer unit accordingly.

15. The PTP system of claim 14, wherein the wafer alignment unit comprises multiple imaging cameras configured to capture at least a part of a perimeter of the wafer, the cameras optionally configured to image the wafer corners and features at a middle of the wafer.

16. The PTP system of any one of claims 1-15, further comprising a print quality control unit configured to detect defects of the transferred pattern on wafers.

17. A dual lane production line comprising two PTP systems of any one of claims 1-16, set back-to-back with the respective unwinder roll and re-winding roll of each of the PTP system accessible for maintenance.

18. A pattern transfer printing (PTP) method comprising: handling a tape comprising, as sections thereof, a plurality of pattern transfer sheets having respective patterns of trenches, to controllably deliver the pattern transfer sheets for paste filling and consecutively for pattern transfer, filling the trenches on the delivered pattern transfer sheets with conductive printing paste, controllably delivering the plurality of wafers for the pattern transfer, and transferring the conductive printing paste from the pattern transfer sheets onto the delivered wafers, by releasing the printing paste from the trenches upon illumination by a laser beam, wherein the handling of the tape comprises moving the tape from an unwinder roll to a re-winding roll in a step-and-repeat mode.

19. The PTP method of claim 18, further comprising at least one of: monitoring a tension and a position of the tape, cleaning the pattern transfer sheets after the pattern transfer to provide reusable pattern transfer sheets, supporting a back side of the pattern transfer sheet by a countering moveable roll during the paste filling, P-606575-IL affixing and flattening the pattern transfer sheet during the pattern transfer, monitoring positions and distortions of the trenches prior to the pattern transfer, detecting and measuring features on the wafer and adjusting accordingly the transferring of the conductive printing paste from the pattern transfer sheets onto the delivered wafers, and inspecting a quality of the transferred paste pattern.

20. The PTP method of claim 18 or 19, further comprising carrying out the PTP method using two PTP systems arranged back-to-back in a dual lane production line, with parallel wafer delivery and with the tape and the unwinder roll and re-winding roll accessible for replacement and maintenance from a front side of each of the PTP systems.