IL268216B2 - Post etch residue cleaning compositions and methods of using the same - Google Patents
Post etch residue cleaning compositions and methods of using the sameInfo
- Publication number
- IL268216B2 IL268216B2 IL268216A IL26821619A IL268216B2 IL 268216 B2 IL268216 B2 IL 268216B2 IL 268216 A IL268216 A IL 268216A IL 26821619 A IL26821619 A IL 26821619A IL 268216 B2 IL268216 B2 IL 268216B2
- Authority
- IL
- Israel
- Prior art keywords
- type
- corrosion inhibitors
- ascorbic acid
- cleaning composition
- acid
- Prior art date
Links
- 238000004140 cleaning Methods 0.000 title claims 9
- 239000000203 mixture Substances 0.000 title claims 9
- 238000000034 method Methods 0.000 title claims 2
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 claims 11
- 238000005260 corrosion Methods 0.000 claims 11
- 230000007797 corrosion Effects 0.000 claims 11
- 239000003112 inhibitor Substances 0.000 claims 11
- 229960005070 ascorbic acid Drugs 0.000 claims 9
- 239000011668 ascorbic acid Substances 0.000 claims 9
- 235000010323 ascorbic acid Nutrition 0.000 claims 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims 4
- LNTHITQWFMADLM-UHFFFAOYSA-N gallic acid Chemical compound OC(=O)C1=CC(O)=C(O)C(O)=C1 LNTHITQWFMADLM-UHFFFAOYSA-N 0.000 claims 4
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims 3
- 239000004065 semiconductor Substances 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 3
- VFPFQHQNJCMNBZ-UHFFFAOYSA-N ethyl gallate Chemical compound CCOC(=O)C1=CC(O)=C(O)C(O)=C1 VFPFQHQNJCMNBZ-UHFFFAOYSA-N 0.000 claims 2
- 235000004515 gallic acid Nutrition 0.000 claims 2
- 229940074391 gallic acid Drugs 0.000 claims 2
- 229940093915 gynecological organic acid Drugs 0.000 claims 2
- FBSFWRHWHYMIOG-UHFFFAOYSA-N methyl 3,4,5-trihydroxybenzoate Chemical group COC(=O)C1=CC(O)=C(O)C(O)=C1 FBSFWRHWHYMIOG-UHFFFAOYSA-N 0.000 claims 2
- 238000004377 microelectronic Methods 0.000 claims 2
- 150000007524 organic acids Chemical class 0.000 claims 2
- 235000005985 organic acids Nutrition 0.000 claims 2
- 239000004262 Ethyl gallate Substances 0.000 claims 1
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 claims 1
- HNDVDQJCIGZPNO-YFKPBYRVSA-N L-histidine Chemical compound OC(=O)[C@@H](N)CC1=CN=CN1 HNDVDQJCIGZPNO-YFKPBYRVSA-N 0.000 claims 1
- KACHFMOHOPLTNX-UHFFFAOYSA-N Methyl EudesMate Chemical compound COC(=O)C1=CC(OC)=C(OC)C(OC)=C1 KACHFMOHOPLTNX-UHFFFAOYSA-N 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- 150000001413 amino acids Chemical class 0.000 claims 1
- 229940027987 antiseptic and disinfectant phenol and derivative Drugs 0.000 claims 1
- 235000019277 ethyl gallate Nutrition 0.000 claims 1
- HNDVDQJCIGZPNO-UHFFFAOYSA-N histidine Natural products OC(=O)C(N)CC1=CN=CN1 HNDVDQJCIGZPNO-UHFFFAOYSA-N 0.000 claims 1
- IBKQQKPQRYUGBJ-UHFFFAOYSA-N methyl gallate Natural products CC(=O)C1=CC(O)=C(O)C(O)=C1 IBKQQKPQRYUGBJ-UHFFFAOYSA-N 0.000 claims 1
- -1 organic acid salts Chemical class 0.000 claims 1
- 235000006408 oxalic acid Nutrition 0.000 claims 1
- 150000002989 phenols Chemical class 0.000 claims 1
- HBZMQFJTPHSKNH-UHFFFAOYSA-N phenyl 3,4,5-trihydroxybenzoate Chemical compound OC1=C(O)C(O)=CC(C(=O)OC=2C=CC=CC=2)=C1 HBZMQFJTPHSKNH-UHFFFAOYSA-N 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D17/00—Detergent materials or soaps characterised by their shape or physical properties
- C11D17/0008—Detergent materials or soaps characterised by their shape or physical properties aqueous liquid non soap compositions
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/0005—Other compounding ingredients characterised by their effect
- C11D3/0073—Anticorrosion compositions
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2075—Carboxylic acids-salts thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/33—Amino carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/261—Alcohols; Phenols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/265—Carboxylic acids or salts thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3218—Alkanolamines or alkanolimines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3245—Aminoacids
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
- H01L21/02063—Cleaning during device manufacture during, before or after processing of insulating layers the processing being the formation of vias or contact holes
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Health & Medical Sciences (AREA)
- Emergency Medicine (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Claims (8)
1./2 Claims: We claim: 1. A semiconductor substrate cleaning composition comprising 20 to 99.5 % by weight of water; 0.1 to 10 % by weight of oxalic acid, and 1.1 to 15 % by weight of two or three types of corrosion inhibitors selected from the following three types of corrosion inhibitors: (a) from 1 to 10 % by weight of one or more amino acids selected from the group consisting of histidine and glycine; (b) 1 to 10 % by weight of one or more non-phenolic-type organic acids, non- phenolic-type organic acid salts or other derivatives of non-phenolic-type organic acids, selected from the group consisting of ascorbic acid, 2-O-alkyl ascorbic acid ether, 3-O-alkyl ascorbic acid ether, 5-6-O-alkylidene-ascorbic acid, 2-O-alkanoyl- ascorbic acid, 3-O-alkanoyl-ascorbic acid and 6-O-alkanoyl-ascorbic acid, and (c) 0.1 to 10 % by weight of one or more of phenol and derivatives of phenol, selected from the group consisting of gallic acid, gallic acid methyl gallate, phenyl gallate, 3,4,5 triacetoxygallic acid, trimethyl gallic acid methyl ester, ethyl gallate, or gallic acid anhydride.
2. The cleaning composition of claim 1 comprising one or more of said type (a) corrosion inhibitors and one or more of said type (b) corrosion inhibitors.
3. The cleaning composition of claim 2 wherein one or more of said type (b) corrosion inhibitors comprises ascorbic acid.
4. The cleaning composition of claim 1 comprising one or more of said type (a) corrosion inhibitors and one or more of said type (c) corrosion inhibitors.
5. The cleaning composition of claim 1 comprising one or more of said type (b) corrosion inhibitors and one or more of said type (c) corrosion inhibitors. 28 268216/2
6. The cleaning composition of claim 5 wherein said one or more of said type (b) corrosion inhibitors comprises ascorbic acid.
7. The cleaning composition of claim 2 further comprising one or more of said type (c) corrosion inhibitors.
8. A method of cleaning a microelectronic device or semiconductor substrate comprising the step of: contacting one or more microelectronic device or semiconductor substrates with a composition of claim 1. 29
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862702663P | 2018-07-24 | 2018-07-24 | |
| US16/457,119 US11091727B2 (en) | 2018-07-24 | 2019-06-28 | Post etch residue cleaning compositions and methods of using the same |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| IL268216A IL268216A (en) | 2019-11-28 |
| IL268216B IL268216B (en) | 2022-10-01 |
| IL268216B2 true IL268216B2 (en) | 2023-02-01 |
Family
ID=68728629
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL268216A IL268216B2 (en) | 2018-07-24 | 2019-07-22 | Post etch residue cleaning compositions and methods of using the same |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR102321217B1 (en) |
| IL (1) | IL268216B2 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015165562A (en) * | 2014-02-06 | 2015-09-17 | 三菱化学株式会社 | Substrate cleaning liquid for semiconductor devices and method for cleaning substrate for semiconductor devices |
| US20150307818A1 (en) * | 2010-07-16 | 2015-10-29 | Advanced Technology Materials, Inc. | Aqueous cleaner for the removal of post-etch residues |
| WO2016111990A1 (en) * | 2015-01-05 | 2016-07-14 | Entegris, Inc. | Post chemical mechanical polishing formulations and method of use |
-
2019
- 2019-07-22 IL IL268216A patent/IL268216B2/en unknown
- 2019-07-24 KR KR1020190089691A patent/KR102321217B1/en active IP Right Grant
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150307818A1 (en) * | 2010-07-16 | 2015-10-29 | Advanced Technology Materials, Inc. | Aqueous cleaner for the removal of post-etch residues |
| JP2015165562A (en) * | 2014-02-06 | 2015-09-17 | 三菱化学株式会社 | Substrate cleaning liquid for semiconductor devices and method for cleaning substrate for semiconductor devices |
| WO2016111990A1 (en) * | 2015-01-05 | 2016-07-14 | Entegris, Inc. | Post chemical mechanical polishing formulations and method of use |
Also Published As
| Publication number | Publication date |
|---|---|
| IL268216B (en) | 2022-10-01 |
| IL268216A (en) | 2019-11-28 |
| KR20200011385A (en) | 2020-02-03 |
| KR102321217B1 (en) | 2021-11-03 |
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