IL247648A0 - Testing apparatus for a high speed communications jack and methods of operating the same - Google Patents

Testing apparatus for a high speed communications jack and methods of operating the same

Info

Publication number
IL247648A0
IL247648A0 IL247648A IL24764816A IL247648A0 IL 247648 A0 IL247648 A0 IL 247648A0 IL 247648 A IL247648 A IL 247648A IL 24764816 A IL24764816 A IL 24764816A IL 247648 A0 IL247648 A0 IL 247648A0
Authority
IL
Israel
Prior art keywords
operating
methods
high speed
same
testing apparatus
Prior art date
Application number
IL247648A
Other languages
Hebrew (he)
Original Assignee
Sentinel Connector Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US14/223,405 external-priority patent/US10014990B2/en
Application filed by Sentinel Connector Systems Inc filed Critical Sentinel Connector Systems Inc
Publication of IL247648A0 publication Critical patent/IL247648A0/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6473—Impedance matching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R31/00—Coupling parts supported only by co-operation with counterpart
    • H01R31/06—Intermediate parts for linking two coupling parts, e.g. adapter
    • H01R31/065—Intermediate parts for linking two coupling parts, e.g. adapter with built-in electric apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/38—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
    • H01R24/40—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency
    • H01R24/50—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency mounted on a PCB [Printed Circuit Board]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/60—Contacts spaced along planar side wall transverse to longitudinal axis of engagement
    • H01R24/62—Sliding engagements with one side only, e.g. modular jack coupling devices
    • H01R24/64—Sliding engagements with one side only, e.g. modular jack coupling devices for high frequency, e.g. RJ 45
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09027—Non-rectangular flat PCB, e.g. circular
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
IL247648A 2014-03-24 2016-09-05 Testing apparatus for a high speed communications jack and methods of operating the same IL247648A0 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/223,405 US10014990B2 (en) 2012-02-13 2014-03-24 Testing apparatus for a high speed cross over communications jack and methods of operating the same
PCT/US2015/022032 WO2015148388A1 (en) 2014-03-24 2015-03-23 Testing apparatus for a high speed cross over communications jack and methods of operating the same

Publications (1)

Publication Number Publication Date
IL247648A0 true IL247648A0 (en) 2016-11-30

Family

ID=54196270

Family Applications (1)

Application Number Title Priority Date Filing Date
IL247648A IL247648A0 (en) 2014-03-24 2016-09-05 Testing apparatus for a high speed communications jack and methods of operating the same

Country Status (11)

Country Link
EP (1) EP3123619A4 (en)
JP (1) JP2017519968A (en)
KR (1) KR20160137558A (en)
CN (1) CN106233636A (en)
AU (1) AU2015236378A1 (en)
CA (1) CA2942149A1 (en)
IL (1) IL247648A0 (en)
MX (1) MX2016011853A (en)
PH (1) PH12016501876A1 (en)
RU (1) RU2016141146A (en)
WO (1) WO2015148388A1 (en)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3901004B2 (en) * 2001-06-13 2007-04-04 セイコーエプソン株式会社 ELECTRO-OPTICAL DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE
JP2003015902A (en) * 2001-07-03 2003-01-17 Sony Corp Testing device
US7474737B2 (en) * 2002-10-10 2009-01-06 The Siemon Company Telecommunications test plugs having tuned near end crosstalk
CN101673885B (en) * 2004-11-29 2012-07-18 Fci公司 Improved matched-impedance surface-mount technology footprints
US7264516B2 (en) * 2004-12-06 2007-09-04 Commscope, Inc. Communications jack with printed wiring board having paired coupling conductors
CN101909401B (en) * 2009-06-05 2013-11-06 鸿富锦精密工业（深圳）有限公司 Printed circuit board structure
US8637987B2 (en) * 2011-08-09 2014-01-28 Micron Technology, Inc. Semiconductor assemblies with multi-level substrates and associated methods of manufacturing
US8858266B2 (en) * 2012-02-13 2014-10-14 Sentinel Connector Systems, Inc. High speed communication jack

Also Published As

Publication number Publication date
CN106233636A (en) 2016-12-14
PH12016501876A1 (en) 2017-01-09
JP2017519968A (en) 2017-07-20
CA2942149A1 (en) 2015-10-01
KR20160137558A (en) 2016-11-30
MX2016011853A (en) 2016-12-05
AU2015236378A1 (en) 2016-09-22
RU2016141146A (en) 2018-04-24
WO2015148388A1 (en) 2015-10-01
EP3123619A4 (en) 2018-03-14
EP3123619A1 (en) 2017-02-01

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