JP2017519968A - High speed crossover communication jack testing apparatus and operation method thereof - Google Patents

Abstract

A substrate, a plurality of vias provided in the substrate, a plurality of pin traces having a height and a width, each extending from the respective via toward the edge of the substrate and terminating at an end point; and an end point of the pin trace And a plurality of termination traces having height and width, each termination trace extending from an end point of the respective pin trace toward a corresponding termination point near the pin trace. A test unit including a plurality of termination traces and a plurality of traces extending from each end point or end of the termination point to the edge of the substrate, wherein the end points of each pin trace are adjacent to each other. [Selection] Figure 2

Description

  The present disclosure relates to a network connection jack test framework used to connect a network cable to a device.

  As telecommunication equipment and related applications of telecommunication equipment become more sophisticated and powerful, the ability of telecommunication equipment to collect information and share information with other equipment becomes more important. With the proliferation of these intelligent inter-network devices, it is necessary to increase the data processing capacity on the network to which these devices are connected and to provide the improved data rate necessary to meet this requirement. . As a result, existing communication protocol standards are constantly being improved or new standards are being created. Nearly all of these standards require or benefit significantly from high-quality signal communication over a wired network, either directly or indirectly. The transmission of these high quality signals may have higher bandwidth and correspondingly higher frequency requirements and needs to be supported in a consistent manner. However, even though newer versions of various standards theoretically provide higher data rates or data rates, these high definition signals are still limited by the current design of certain physical components. . Unfortunately, the design of such physical components faces difficulties by not understanding what is necessary to achieve consistent signal quality at multi-gigahertz and higher frequencies.

  For example, a communication jack is used in a communication device and a device that connects or links cables used for transmitting and receiving electrical signals representing data to be communicated. A registered jack (RJ) is a standardized physical interface used to connect telecommunication and data devices. The RJ standardized physical interface has both a jack structure and a wiring pattern. The RJ standardized physical interface commonly used for data devices is the RJ45 physical network interface, also called the RJ45 jack. The RJ45 jack is widely used in local area networks, such as networks that implement the Institute of Electrical and Electronics Engineers (IEEE) 802.3 Ethernet protocol. RJ45 jacks are described in various standards, including those promulgated by the American National Standards Institute (ANSI) / American Telecommunications Industry Association (TIA) at ANSI / TIA-1096-A.

  All electrical interface components such as cables and jacks, including RJ45 jacks, not only resist the initial current flow, but also resist any current change. This characteristic is called reactance. Two related types of reactance are inductive reactance and capacitive reactance. Inductive reactance may occur, for example, based on the movement of current through a cable that creates resistance, causing a magnetic field that induces a voltage in the cable. On the other hand, capacitive reactance is generated by charging that appears when electrons from two opposing surfaces approach each other.

  The various components of the communication circuit preferably have matching impedances so as to reduce or avoid any degradation of the transmitted signal. Otherwise, a load with one impedance value reflects or echoes part of the signal carried by cables with different impedance levels, causing a signal failure. For this reason, designers and manufacturers of data communication equipment, such as cable distributors, are responsible for verifying that cable impedance values and resistance and capacitance levels meet certain performance parameters. Design and test the cables. The RJ45 jack is an important component in almost all communication circuits, but the manufacturer of the jack has not paid as much attention to the performance of the jack. Thus, while the problems with existing RJ45 jacks are well documented in testing and the adverse effects of existing RJ45 jacks on high frequency signal lines are understood, the industry is concerned with this important component of the physical layer. It seems not ambitious to deal with.

  As a result, an improved high speed jack is needed.

  One embodiment of the present invention has a substrate, a plurality of vias provided in the substrate, a height and a width, each extending from the respective via toward the edge of the substrate and terminating at an end point. Pin traces, a plurality of termination points adjacent to the end points of the pin trace, and a plurality of termination traces having a height and a width, each termination trace corresponding to the pin trace from the end point of the respective pin trace A plurality of termination traces extending toward the termination point, and a plurality of traces extending from each end point or end of the termination point to the edge of the substrate, each pin trace end point adjacent to each other And termination points disclose test units that are adjacent to each other such that adjacent termination trace pairs and adjacent termination point pairs are each adjacent to a different trace.

  In another embodiment, each pin trace is separated from each trace by a first distance.

  In another embodiment, each end point is separated from each trace by a second distance.

  In another embodiment, each termination point is connected by a termination trace to an end point of a pin trace that is not adjacent to the termination point.

  In another embodiment, adjacent pin traces are separated by a third distance.

  In another embodiment, the test unit includes a ground plane on the substrate that is spaced a distance from each trace.

  In another embodiment, the height and width of adjacent traces and the distance separating adjacent traces are adjusted so that adjacent traces are magnetically coupled.

  In another embodiment, the inductance and capacitance of each trace is adjusted by adjusting a first distance between the ground plane and each trace.

  In another embodiment, the height and width of adjacent termination traces are adjusted so that the termination traces are magnetically coupled.

  In another embodiment, the substrate is Rogers material RO XT8100.

  In another embodiment, the capacitance of each trace is adjusted between approximately 0.51 picofarads (pF) and approximately 2 pF.

  In another embodiment, the inductance and capacitance of each trace adjusts the distance between the first ground plane and the second ground plane and the distance between the first ground plane and each trace. It is adjusted by doing.

  In another embodiment, an RJ45 jack pin is connected to each via.

  In another embodiment, the end of each trace is magnetically coupled to the connection unit.

  In another embodiment, the connection unit is an RJ59 connector.

  In another embodiment, the height and width of adjacent pin traces and the distance separating adjacent pin traces are adjusted so that adjacent pin traces are magnetically coupled.

  In another embodiment, the heights and widths of adjacent endpoints and adjacent endpoints and the distance separating the adjacent endpoints and endpoints are such that the adjacent endpoints and adjacent endpoints are magnetically coupled. Adjusted to

  In another embodiment, the inductance and capacitance of each endpoint and termination point are adjusted by adjusting the distance between the ground plane and each termination trace and each branch trace.

  In another embodiment, the inductance and capacitance of each pin trace is adjusted along the length of the trace by adjusting a predetermined distance between the ground plane and each termination trace.

It is a figure which shows the test unit of the jack for high-speed communication. It is a figure which shows the matching part of the test unit of FIG. FIG. 2 is a schematic diagram of the test framework of FIG. 1. It is a figure of the circuit formed in the test unit of FIG. It is a figure which shows one Embodiment of the test unit of the jack for high-speed communication. FIG. 6 shows one embodiment of the connection of two test units of a high speed connection jack.

  FIG. 1 shows a test unit 100 for a high-speed communication jack. The test unit 100 or test framework includes a pin connection 102 configured to attach to a high speed communication jack such as, but not limited to, an RJ45 communication jack. Traces 104, 106, 108, 110, 112, 114, 116 and 118 extend radially from the pin connection 102 to the outer edge of the test unit 100. The end of each trace 104, 106, 108, 110, 112, 114, 116 and 118 terminates at the edge of the test unit 100 to allow connection of a communication unit (not shown). The connection units 120, 122, 124, 126, 128, 130, 132, and 134 can be any type of connector, including but not limited to an RJ45 connector.

  FIG. 2 shows an enlarged view of another embodiment of the connection 102. Connection portion 102 includes vias 204, 206, 208, 210, 212, 214, 216, and 218 that are sized to engage the pins of a high-speed communication jack. Pin traces 220, 222, 224, 226, 228, 230, 232 and 234 are traced from vias 204, 206, 208, 210, 212, 214, 216 and 218 to traces 104, 106, 108, 110, 112, 114, 116. And 118 extending radially toward 118. Each pin trace 220, 222, 224, 226, 228, 230, 232 and 234 extends to endpoints 236, 238, 240, 242, 244, 246, 248 and 250. Also, each pin trace 220, 222, 224, 226, 228, 230, 232 and 234 is aligned with an adjacent pin trace 220, 222, 224, 226, 228, 230, 232 and 234. As an illustrative example, pin trace 220 matches pin trace 222, pin trace 224 matches pin trace 226, pin trace 228 matches pin trace 230, and pin trace 232 matches pin trace 234. Each pin trace 220, 222, 224, 226, 228, 230, 232 and 234 has a length (L), a height (H) and a width (W), and is only a distance (S) from the adjacent pin trace. Are separated. The width of each pin trace 220, 222, 224, 226, 228, 230, 232 and 234 is approximately 35 mils. By adjusting the length, height and width of adjacent pin traces, the inductances of adjacent pin traces can be matched to each other. Each pin trace end point 236, 238, 240, 242, 244, 246, 248 or 250 is separated from the respective trace 102, 104, 106, 108, 110, 112 or 114 by a predetermined distance (Se).

  Termination traces 252, 254, 256, 258, 260, 262, 264, and 266 are pin points 220, 222, 224, 226, 228, 230, 232, and 234, respectively. Extends from 246, 248 or 250 to termination points 268, 270, 272, 274, 276, 278, 280 or 282. Also, the termination traces 252, 254, 256, 258, 260, 262, 264 and 266 are connected to the termination points 268, 270, 272, 274, 276, 278, 280 or 282. Termination points 268, 270, 272, 274, 276, 278, 280 or 282 are spaced a predetermined distance Se from the end of each respective trace 102, 104, 106, 108, 110, 112 or 114. In one embodiment, the distance Se is constant along the length of the termination traces 252, 254, 256, 258, 260, 262, 264, and 266. In another embodiment, the distance Se varies along the length of the termination traces 252, 254, 256, 258, 260, 262, 264 and 266. Each termination trace 252, 254, 256, 258, 260, 262, 264 and 266 has a length (L), a width (W) and a height (H). Different inductive and conductive configurations are achieved by adjusting the length, height and width of each termination trace 252, 254, 256, 258, 260, 262, 264 and 266 along with the separation Se. be able to. The width of each branch trace 234, 236, 238 and 240 can be approximately 35 mils. The width of each termination trace 252, 254, 256, 258, 260, 262, 264, and 266 can be approximately 10 mils.

  FIG. 3 shows a cutaway view of the connecting portion 102. The connection part 102 has an upper surface 302. The end points 236 and 238 and the end points 268 and 270 are located on the upper surface 304 such that the end points 236 and 238 and the end points 268 and 270 alternate across the surface 304 of the substrate. The first ground trace 306 and the second ground trace 308 are located in a dielectric layer below the top surface, and the first ground trace 306 is separated from the top surface 302 by a first dielectric layer having a height H1. Has been. The second ground trace 308 is separated from the first ground trace 306 by a second dielectric layer 310 having a second height H2. By adjusting the heights H1 and H2 of the dielectric layers 308 and 310, the capacitance of each trace, end point and end point can be adjusted. In addition, each termination trace 252, 254, 256, 258, 260, 262, 264 and 266, pin trace 220, 222, 224, 226, 228, 230, 232 and 234, end points 236, 238, 240, 242, 244, The impedance of 246, 248 or 250, and termination points 268, 270, 272, 274, 276, 278, 280 or 282 can be adjusted by changing the respective length, width and height. By adjusting the impedance of adjacent traces, endpoints and termination points, crosstalk or noise can be removed and adjacent traces and points can be magnetically coupled to each other. The dielectric layer is made from a material with a dielectric constant greater than 3.0, such as but not limited to ROGERS Material's RO XT8100, or any other material that can isolate high frequency electrical signals.

  FIG. 4 shows a diagram of a circuit formed in the test unit 100 of FIG. The wiring diagram includes a connection unit 402, an input stimulus 404, an RJ45 high-speed communication jack 406, and an output load 408. RJ45 jack 406 includes internal traces 410 and 412 connected to pins 416 and 418 that engage vias 422 and 424. Vias 422 and 424 are electrically connected to pin traces 424 and 426 of test unit 100. The length, width, height and separation of the termination traces 252, 254, 256, 258, 260, 262, 264 and 266 and the pin traces 220, 222, 224, 226, 228, 230, 232 and 234 are determined by the trace 102. , 104, 106, 108, 110, 112 or 114 are adjusted to provide different capacitance values along the length. The inductance of each pin trace is the height H1 of the dielectric layer below the pin trace 220, 222, 224, 226, 228, 230, 232 or 234 as well as each pin trace 220, 222, 224, 226, 228, 230, It is changed by adjusting the height H2 between the second ground trace 306 and the first ground trace 304 under 232 and 234. The capacitors produced by pin traces 220, 222, 224, 226, 228 and ground traces 304 and 306 are sized between approximately 1 picofarad (pF) and approximately 5 pF. To further enhance the operation of the circuit, the top and bottom surfaces of the unit 100 can be covered with a plastic insulating layer.

  The capacitors produced by traces 102, 104, 106, 108, 110, 112 or 114 and ground traces 304 and 306 are sized between approximately 0.51 pF and approximately 2 pF. To further enhance the operation of the circuit, the top and bottom surfaces of the unit 100 can be covered with a plastic insulating layer. In one embodiment, the signal is driven through the line with an output between approximately 4 mW and 20 mW.

  FIG. 5 illustrates one embodiment of a test unit for a high-speed communication jack. The test unit 500 includes a high-speed communication jack 502 connected to the connection unit 102 of the test unit. The high-speed communication jack 502 includes an RJ type connector, a universal serial bus (USB) connector and jack, and a fire-wire. ) (1394) connectors and jacks, HDMI (high definition multimedia interface) connectors and jacks, D-subminiature type connectors and jacks, ribbon type connectors or jacks, or any other that receives high-speed communication signals Connector or jack. The high-speed communication jack 502 is connected to the connection unit 102 so that each pin of the high-speed communication jack 502 corresponds to one of the vias 202, 204, 206, 208, 210, 212, 214, and 216. . The high speed communication jack 502 can be configured such that pin pairs are magnetically coupled to each other.

  Each trace 104, 106, 108, 110, 112, 114, 116 and 118 extends from the connection 102 to the connection units 120, 122, 124, 126, 128, 130, 132 and 134. The connection units 120, 122, 124, 126, 128, 130, 132, and 134 can detach cables having connectors such as RJ45 connectors to each of the connection units 120, 122, 124, 126, 128, 130, 132, and 134. It is configured so that it can be attached to. The connection units 120, 122, 124, 126, 128, 130, 132 and 134 are connected units 120, 122, 124, 126, 128, 130, 132 and 134 and connection units 104, 106, 108, 110, 112, Signals are transmitted from cables connected to associated traces 104, 106, 108, 110, 112, 114, 116 or 118 connected to 114, 116 and 118. The connection units 104, 106, 108, 110, 112, 114, 116 and 118 are attached to a connection plate 504 that extends around the outer periphery of the test unit 500. The connection plate 504 can be made from a metal such as steel or a metallized plastic. Each of the connection units 104, 106, 108, 110, 112, 114, 116 and 118 is such that the central axis of the connection unit 104, 106, 108, 110, 112, 114, 116 or 118 is relative to the surface of the test unit 500. It is attached to the side of the connection plate 504 so as to be substantially parallel.

  FIG. 6 shows a schematic representation of a plurality of test units connected to each other by a network. The first test unit 602 is connected to the second test unit 604 by a cable 606 connected to the high-speed communication jack of each of the test units 602 and 604. The cable 606 may be a communication cable such as an Ethernet cable, a category 5, 6 or 7 cable, a serial cable, a fire wire cable, a USB cable, or any other type of communication cable. Cable 606 includes a connector (not shown) that allows cable 606 to be removably connected to a high-speed communication jack. In one embodiment, the high speed communication jack of the first test unit 602 is the same type as the high speed communication jack of the second test unit 604. In another embodiment, the high speed communication jack of the first test unit 602 is a different type than the high speed communication jack of the second test unit 604. The cable can be any length including but not limited to 3 feet, 6 feet, 10 feet, 12 feet, 15 feet or 20 feet.

  Each of the connection units 104, 106, 108, 110, 112, 114, 116 or 118 is connected to the signal transmission / reception units 610 and 612, one end of which is the connection unit 104, 106, 108, 110, 112, 114, 116 or 118. The other end is connected via a cable connected to the signal transmission / reception units 610 and 612. In one embodiment, the signal transmission / reception unit 610 transmits signals from the first test unit 602 to the second test unit 604 via the high-speed communication jacks of the first test unit 602 and the second test unit 604. Send. Upon receiving the signal, the second test unit 604 transmits the signal to the signal transmitting / receiving unit 612. In one embodiment, the signal transceiver unit 612 transmits a new signal back to the signal transceiver unit 610 via the cable 608. In one embodiment, the signal transmission / reception unit 612 transmits to the signal transmission / reception unit 612 a second signal based on the signal previously transmitted by the signal transmission / reception unit 610. In another embodiment, the signal transceiver unit 612 transmits a second signal to the signal transceiver unit 610 that is substantially the same as the signal previously transmitted by the signal transceiver unit 610.

The foregoing detailed description is merely some examples and embodiments of the disclosure, and numerous modifications to the disclosed embodiments can be made without departing from the spirit or scope of the disclosure herein. Can be done according to. Accordingly, the foregoing description is not intended to limit the scope of the present disclosure, but to provide a disclosure sufficient to enable one of ordinary skill in the art to practice the invention without undue burden. .

Claims (20)

A substrate,
A plurality of vias provided in the substrate;
A plurality of pin traces having a height and a width, each extending from a respective via toward the edge of the substrate and terminating at an end point;
A plurality of termination points adjacent to the end points of the pin trace;
A plurality of termination traces having a height and a width, each termination trace extending from an end point of a respective pin trace toward a corresponding termination point near the pin trace; ,
A plurality of traces extending from the end of each end point or end point to the edge of the substrate;
Including
The test unit, wherein the end points of each pin trace are adjacent to each other, and the termination points are adjacent to each other such that the adjacent termination trace pairs and the adjacent termination point pairs are adjacent to different traces.   The test unit of claim 1, wherein each pin trace is separated from each trace by a first distance.   The test unit of claim 1, wherein each end point is separated from each trace by a second distance.   The test unit according to claim 1, wherein each termination point is connected by a termination trace to an end point of a pin trace that is not adjacent to the termination point.   The test unit of claim 1, wherein adjacent pin traces are separated by a third distance.   The test unit of claim 1, wherein the substrate includes a ground plane that is spaced a distance from each trace.   The test unit of claim 1, wherein the height and width of adjacent traces and the distance separating adjacent traces are adjusted so that the adjacent traces are magnetically coupled.   The test unit of claim 6, wherein the inductance and capacitance of each trace is adjusted by adjusting the first distance between the ground plane and each trace.   The test unit of claim 4, wherein the height and width of adjacent termination traces are adjusted such that the termination traces are magnetically coupled.   The test unit according to claim 1, wherein the substrate is RO XT8100 of Rogers material.   9. The test unit of claim 8, wherein the capacitance of each trace is adjusted between approximately 0.51 picofarads (pF) and approximately 2 pF.   The test unit according to claim 6, comprising a second ground plane disposed between the first ground plane and a surface of the substrate opposite to the surface of the substrate having the plurality of traces. .   The inductance and capacitance of each trace adjusts the distance between the first ground plane and the second ground plane and the distance between the first ground plane and each trace. The test unit according to claim 12, adjusted by:   The test unit according to claim 1, wherein a pin of an RJ45 jack is connected to each via.   The test unit according to claim 1, wherein an end of each trace is magnetically coupled to the connection unit.   The test unit according to claim 15, wherein the connection unit is an RJ45 connector.   The test unit of claim 1, wherein the height and width of adjacent pin traces and the distance separating adjacent pin traces are adjusted so that the adjacent pin traces are magnetically coupled.   The height and width of adjacent end points and adjacent end points and the distance separating adjacent end points and end points are adjusted such that the adjacent end points and adjacent end points are magnetically coupled. The test unit according to claim 1.   The test unit according to claim 6, wherein the inductance and capacitance at each end point and termination point are adjusted by adjusting the distance between the ground plane and each respective end point or termination point. 7. The test of claim 6, wherein the inductance and capacitance of each pin trace is adjusted along the length of the trace by adjusting a predetermined distance between the ground plane and each termination trace. unit.

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