IL161977A0 - Abrasive article for the deposition and polishing of a conductive material - Google Patents

Abrasive article for the deposition and polishing of a conductive material

Info

Publication number
IL161977A0
IL161977A0 IL16197702A IL16197702A IL161977A0 IL 161977 A0 IL161977 A0 IL 161977A0 IL 16197702 A IL16197702 A IL 16197702A IL 16197702 A IL16197702 A IL 16197702A IL 161977 A0 IL161977 A0 IL 161977A0
Authority
IL
Israel
Prior art keywords
polishing
deposition
conductive material
abrasive article
abrasive
Prior art date
Application number
IL16197702A
Other languages
English (en)
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of IL161977A0 publication Critical patent/IL161977A0/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/046—Lapping machines or devices; Accessories designed for working plane surfaces using electric current
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/02—Backings, e.g. foils, webs, mesh fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
IL16197702A 2001-12-13 2002-10-15 Abrasive article for the deposition and polishing of a conductive material IL161977A0 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/021,161 US6838149B2 (en) 2001-12-13 2001-12-13 Abrasive article for the deposition and polishing of a conductive material
PCT/US2002/032864 WO2003051577A1 (en) 2001-12-13 2002-10-15 Abrasive article for the deposition and polishing of a conductive material

Publications (1)

Publication Number Publication Date
IL161977A0 true IL161977A0 (en) 2005-11-20

Family

ID=21802689

Family Applications (1)

Application Number Title Priority Date Filing Date
IL16197702A IL161977A0 (en) 2001-12-13 2002-10-15 Abrasive article for the deposition and polishing of a conductive material

Country Status (10)

Country Link
US (1) US6838149B2 (ko)
EP (1) EP1465750A1 (ko)
JP (1) JP4405805B2 (ko)
KR (1) KR100926198B1 (ko)
CN (1) CN100450716C (ko)
AU (1) AU2002335025A1 (ko)
IL (1) IL161977A0 (ko)
MY (1) MY138955A (ko)
TW (1) TWI229153B (ko)
WO (1) WO2003051577A1 (ko)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0411268D0 (en) * 2004-05-20 2004-06-23 3M Innovative Properties Co Method for making a moulded abrasive article
US6958002B1 (en) * 2004-07-19 2005-10-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with flow modifying groove network
GB0418633D0 (en) * 2004-08-20 2004-09-22 3M Innovative Properties Co Method of making abrasive article
US7179159B2 (en) * 2005-05-02 2007-02-20 Applied Materials, Inc. Materials for chemical mechanical polishing
JP5448289B2 (ja) * 2006-06-15 2014-03-19 スリーエム イノベイティブ プロパティズ カンパニー 研磨ディスク
CN101541479B (zh) * 2006-07-14 2012-11-28 圣戈本磨料股份有限公司 无背衬研磨制品
US7820068B2 (en) * 2007-02-21 2010-10-26 Houghton Technical Corp. Chemical assisted lapping and polishing of metals
US20090191376A1 (en) * 2008-01-30 2009-07-30 3M Innovative Properties Company Method, apparatus, and system using adapter assembly for modifying surfaces
US20140234639A1 (en) * 2013-02-21 2014-08-21 Prakash B Malla Self binding nano particle mineral pigment
US8083828B2 (en) * 2009-06-19 2011-12-27 Hollingsworth & Vose Company Fiber web having a high stiffness
CN102107397B (zh) 2009-12-25 2015-02-04 3M新设资产公司 研磨砂轮的制造方法及研磨砂轮
WO2011090721A2 (en) * 2009-12-29 2011-07-28 Saint-Gobain Abrasives, Inc. Method of cleaning a household surface
CN102233540B (zh) * 2011-04-12 2013-05-29 安泰科技股份有限公司 一种珩磨条及其制造方法
US9073172B2 (en) * 2012-05-11 2015-07-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Alkaline-earth metal oxide-polymeric polishing pad
US8888877B2 (en) * 2012-05-11 2014-11-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Forming alkaline-earth metal oxide polishing pad
US9421666B2 (en) 2013-11-04 2016-08-23 Applied Materials, Inc. Printed chemical mechanical polishing pad having abrasives therein
US10150900B2 (en) 2014-04-21 2018-12-11 3M Innovative Properties Company Abrasive particles and abrasive articles including the same
JP6838811B2 (ja) * 2014-05-02 2021-03-03 スリーエム イノベイティブ プロパティズ カンパニー 断続的構造化研磨物品並びに被加工物の研磨方法
KR101520743B1 (ko) * 2014-05-16 2015-05-18 코닝정밀소재 주식회사 발광 다이오드 패키지 제조방법
EP3148742B1 (en) 2014-05-29 2020-11-18 Saint-Gobain Abrasives, Inc. Abrasive article having a core including a polymer material
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
WO2016060712A1 (en) 2014-10-17 2016-04-21 Applied Materials, Inc. Cmp pad construction with composite material properties using additive manufacturing processes
KR102584551B1 (ko) * 2015-10-16 2023-10-05 어플라이드 머티어리얼스, 인코포레이티드 적층 제조 프로세스를 이용하여 진보된 연마 패드를 형성하기 위한 방법 및 장치
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US10252200B2 (en) 2016-02-17 2019-04-09 Hollingsworth & Vose Company Filter media including a filtration layer comprising synthetic fibers
US11014030B2 (en) 2016-02-17 2021-05-25 Hollingsworth & Vose Company Filter media including flame retardant fibers
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
MX2020006850A (es) 2017-12-29 2020-08-24 Saint Gobain Abrasives Inc Articulos pulidores abrasivos.
WO2020050932A1 (en) 2018-09-04 2020-03-12 Applied Materials, Inc. Formulations for advanced polishing pads
US20220212314A1 (en) * 2019-04-15 2022-07-07 Arizona Board Of Regents On Behalf Of The University Of Arizona Pitch layer pad for smoothing optical surfaces
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
CN112934133B (zh) * 2021-03-15 2023-10-31 乌鲁木齐益好天成新型节能材料有限公司 一种改性固相硅凝胶的制备方法
CN114211411B (zh) * 2021-12-28 2022-09-13 江苏华东砂轮有限公司 一种大尺寸单晶硅片超精密加工抛光砂轮及其制备方法
CN114952642B (zh) * 2022-06-15 2023-10-31 安徽禾臣新材料有限公司 一种蓝宝石防护盖板抛光用阻尼布及其生产工艺

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4314827A (en) 1979-06-29 1982-02-09 Minnesota Mining And Manufacturing Company Non-fused aluminum oxide-based abrasive mineral
US4623364A (en) 1984-03-23 1986-11-18 Norton Company Abrasive material and method for preparing the same
CA1254238A (en) 1985-04-30 1989-05-16 Alvin P. Gerk Process for durable sol-gel produced alumina-based ceramics, abrasive grain and abrasive products
US4652274A (en) 1985-08-07 1987-03-24 Minnesota Mining And Manufacturing Company Coated abrasive product having radiation curable binder
US4770671A (en) 1985-12-30 1988-09-13 Minnesota Mining And Manufacturing Company Abrasive grits formed of ceramic containing oxides of aluminum and yttrium, method of making and using the same and products made therewith
US4881951A (en) 1987-05-27 1989-11-21 Minnesota Mining And Manufacturing Co. Abrasive grits formed of ceramic containing oxides of aluminum and rare earth metal, method of making and products made therewith
US4879258A (en) 1988-08-31 1989-11-07 Texas Instruments Incorporated Integrated circuit planarization by mechanical polishing
US4903440A (en) 1988-11-23 1990-02-27 Minnesota Mining And Manufacturing Company Abrasive product having binder comprising an aminoplast resin
US5061294A (en) 1989-05-15 1991-10-29 Minnesota Mining And Manufacturing Company Abrasive article with conductive, doped, conjugated, polymer coat and method of making same
US5081796A (en) 1990-08-06 1992-01-21 Micron Technology, Inc. Method and apparatus for mechanical planarization and endpoint detection of a semiconductor wafer
US5137542A (en) 1990-08-08 1992-08-11 Minnesota Mining And Manufacturing Company Abrasive printed with an electrically conductive ink
US5152917B1 (en) 1991-02-06 1998-01-13 Minnesota Mining & Mfg Structured abrasive article
US5236472A (en) 1991-02-22 1993-08-17 Minnesota Mining And Manufacturing Company Abrasive product having a binder comprising an aminoplast binder
US5196353A (en) 1992-01-03 1993-03-23 Micron Technology, Inc. Method for controlling a semiconductor (CMP) process by measuring a surface temperature and developing a thermal image of the wafer
US5203884A (en) 1992-06-04 1993-04-20 Minnesota Mining And Manufacturing Company Abrasive article having vanadium oxide incorporated therein
US5378252A (en) 1993-09-03 1995-01-03 Minnesota Mining And Manufacturing Company Abrasive articles
US5433651A (en) 1993-12-22 1995-07-18 International Business Machines Corporation In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing
JP3313505B2 (ja) 1994-04-14 2002-08-12 株式会社日立製作所 研磨加工法
US5658185A (en) 1995-10-25 1997-08-19 International Business Machines Corporation Chemical-mechanical polishing apparatus with slurry removal system and method
US5609517A (en) 1995-11-20 1997-03-11 International Business Machines Corporation Composite polishing pad
US5692950A (en) * 1996-08-08 1997-12-02 Minnesota Mining And Manufacturing Company Abrasive construction for semiconductor wafer modification
CA2287404C (en) 1997-04-30 2007-10-16 David A. Kaisaki Method of planarizing the upper surface of a semiconductor wafer
US6121143A (en) * 1997-09-19 2000-09-19 3M Innovative Properties Company Abrasive articles comprising a fluorochemical agent for wafer surface modification
US6106371A (en) 1997-10-30 2000-08-22 Lsi Logic Corporation Effective pad conditioning
US6251235B1 (en) 1999-03-30 2001-06-26 Nutool, Inc. Apparatus for forming an electrical contact with a semiconductor substrate
US6103628A (en) 1998-12-01 2000-08-15 Nutool, Inc. Reverse linear polisher with loadable housing
US6328872B1 (en) 1999-04-03 2001-12-11 Nutool, Inc. Method and apparatus for plating and polishing a semiconductor substrate
US6179887B1 (en) * 1999-02-17 2001-01-30 3M Innovative Properties Company Method for making an abrasive article and abrasive articles thereof
US6692588B1 (en) 1999-07-12 2004-02-17 Nutool, Inc. Method and apparatus for simultaneously cleaning and annealing a workpiece
JP2001150333A (ja) * 1999-11-29 2001-06-05 Nec Corp 研磨パッド
KR100770852B1 (ko) * 2000-05-27 2007-10-26 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 화학 기계적 평탄화용 그루브형 연마 패드
US7201829B2 (en) * 2001-03-01 2007-04-10 Novellus Systems, Inc. Mask plate design
US7238092B2 (en) * 2001-09-28 2007-07-03 Novellus Systems, Inc. Low-force electrochemical mechanical processing method and apparatus
AU2002363479A1 (en) * 2001-11-02 2003-05-19 Nutool, Inc. Electrochemical mechanical processing with advancible sweeper

Also Published As

Publication number Publication date
CN1604834A (zh) 2005-04-06
EP1465750A1 (en) 2004-10-13
KR100926198B1 (ko) 2009-11-09
JP2005511337A (ja) 2005-04-28
TWI229153B (en) 2005-03-11
MY138955A (en) 2009-08-28
KR20040062681A (ko) 2004-07-07
JP4405805B2 (ja) 2010-01-27
US20030113509A1 (en) 2003-06-19
WO2003051577A1 (en) 2003-06-26
US6838149B2 (en) 2005-01-04
TW200300805A (en) 2003-06-16
CN100450716C (zh) 2009-01-14
AU2002335025A1 (en) 2003-06-30

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