IL160695A0 - Method and apparatus for measuring the shape and thickness variation of polished opaque plates - Google Patents

Method and apparatus for measuring the shape and thickness variation of polished opaque plates

Info

Publication number
IL160695A0
IL160695A0 IL16069504A IL16069504A IL160695A0 IL 160695 A0 IL160695 A0 IL 160695A0 IL 16069504 A IL16069504 A IL 16069504A IL 16069504 A IL16069504 A IL 16069504A IL 160695 A0 IL160695 A0 IL 160695A0
Authority
IL
Israel
Prior art keywords
measuring
shape
thickness variation
opaque plates
polished opaque
Prior art date
Application number
IL16069504A
Other languages
English (en)
Original Assignee
Phase Shift Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phase Shift Technology Inc filed Critical Phase Shift Technology Inc
Publication of IL160695A0 publication Critical patent/IL160695A0/xx

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02015—Interferometers characterised by the beam path configuration
    • G01B9/02017—Interferometers characterised by the beam path configuration with multiple interactions between the target object and light beams, e.g. beam reflections occurring from different locations
    • G01B9/02021—Interferometers characterised by the beam path configuration with multiple interactions between the target object and light beams, e.g. beam reflections occurring from different locations contacting different faces of object, e.g. opposite faces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02015—Interferometers characterised by the beam path configuration
    • G01B9/02027—Two or more interferometric channels or interferometers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02015—Interferometers characterised by the beam path configuration
    • G01B9/02027—Two or more interferometric channels or interferometers
    • G01B9/02028—Two or more reference or object arms in one interferometer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2290/00—Aspects of interferometers not specifically covered by any group under G01B9/02
    • G01B2290/45—Multiple detectors for detecting interferometer signals

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
IL16069504A 2003-03-20 2004-03-02 Method and apparatus for measuring the shape and thickness variation of polished opaque plates IL160695A0 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/393,883 US6847458B2 (en) 2003-03-20 2003-03-20 Method and apparatus for measuring the shape and thickness variation of polished opaque plates

Publications (1)

Publication Number Publication Date
IL160695A0 true IL160695A0 (en) 2004-08-31

Family

ID=32824914

Family Applications (2)

Application Number Title Priority Date Filing Date
IL199519A IL199519A (en) 2003-03-20 2004-03-02 A device for measuring the shape and thickness of glossy opaque panels
IL16069504A IL160695A0 (en) 2003-03-20 2004-03-02 Method and apparatus for measuring the shape and thickness variation of polished opaque plates

Family Applications Before (1)

Application Number Title Priority Date Filing Date
IL199519A IL199519A (en) 2003-03-20 2004-03-02 A device for measuring the shape and thickness of glossy opaque panels

Country Status (4)

Country Link
US (1) US6847458B2 (ja)
EP (1) EP1460374B1 (ja)
JP (1) JP4170937B2 (ja)
IL (2) IL199519A (ja)

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US7847954B2 (en) * 2008-05-15 2010-12-07 Kla-Tencor Corporation Measuring the shape and thickness variation of a wafer with high slopes
US8068234B2 (en) * 2009-02-18 2011-11-29 Kla-Tencor Corporation Method and apparatus for measuring shape or thickness information of a substrate
US8537369B1 (en) 2009-07-16 2013-09-17 Kla Tencor Method and apparatus for measuring the shape and thickness variation of a wafer by two single-shot phase-shifting interferometers
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US8379219B2 (en) * 2011-05-27 2013-02-19 Corning Incorporated Compound interferometer with monolithic measurement cavity
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US9588441B2 (en) 2012-05-18 2017-03-07 Kla-Tencor Corporation Method and device for using substrate geometry to determine optimum substrate analysis sampling
US9279663B2 (en) * 2012-07-30 2016-03-08 Kla-Tencor Corporation Method and apparatus to fold optics in tools for measuring shape and/or thickness of a large and thin substrate
KR101257355B1 (ko) * 2012-11-06 2013-04-23 광주과학기술원 광간섭 단층촬영 장치
US9151667B1 (en) 2012-12-04 2015-10-06 Kla-Tencor Corporation Method and system for stabilizing power of tunable laser in wavelength-tuning phase shift interferometer
US9074873B1 (en) 2013-01-31 2015-07-07 Kla-Tencor Corporation Measurement of thickness variation and shape of wafers
US9163928B2 (en) 2013-04-17 2015-10-20 Kla-Tencor Corporation Reducing registration error of front and back wafer surfaces utilizing a see-through calibration wafer
US20140293291A1 (en) * 2013-04-01 2014-10-02 Kla-Tencor Corporation Wafer Shape and Thickness Measurement System Utilizing Shearing Interferometers
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US9632038B2 (en) 2014-08-20 2017-04-25 Kla-Tencor Corporation Hybrid phase unwrapping systems and methods for patterned wafer measurement
FR3026481B1 (fr) * 2014-09-25 2021-12-24 Fogale Nanotech Dispositif et procede de profilometrie de surface pour le controle de wafers en cours de process
US9651359B2 (en) 2014-11-21 2017-05-16 Kla-Tencor Corporation Dual wavelength dual interferometer with combiner-splitter
US10024654B2 (en) * 2015-04-06 2018-07-17 Kla-Tencor Corporation Method and system for determining in-plane distortions in a substrate
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US9897433B2 (en) 2015-10-30 2018-02-20 KLA—Tencor Corporation Method and system for regional phase unwrapping with pattern-assisted correction
JP6725988B2 (ja) * 2016-01-26 2020-07-22 大塚電子株式会社 厚み測定装置および厚み測定方法
WO2017185145A1 (en) * 2016-04-29 2017-11-02 The University Of Western Australia An optical coherence tomography system
US10475712B2 (en) 2016-09-30 2019-11-12 Kla-Tencor Corporation System and method for process-induced distortion prediction during wafer deposition
KR101785075B1 (ko) 2016-10-20 2017-10-26 (주)오로스 테크놀로지 이송용 기준 미러를 사용한 웨이퍼 형상 변화값을 검출하는 장치
US10571248B2 (en) 2017-01-09 2020-02-25 Kla-Tencor Corporation Transparent film error correction pattern in wafer geometry system
US10236222B2 (en) * 2017-02-08 2019-03-19 Kla-Tencor Corporation System and method for measuring substrate and film thickness distribution
US11164768B2 (en) * 2018-04-27 2021-11-02 Kla Corporation Process-induced displacement characterization during semiconductor production
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US10809055B2 (en) 2018-07-24 2020-10-20 Kla Corporation Apparatus and method for measuring topography and gradient of the surfaces, shape, and thickness of patterned and unpatterned wafers
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US11143503B2 (en) * 2018-08-07 2021-10-12 Kimball Electronics Indiana, Inc. Interferometric waviness detection systems
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US11035665B2 (en) 2019-07-30 2021-06-15 Kla Corporation System and method for enhancing data processing throughput using less effective pixel while maintaining wafer warp coverage
JP2022545500A (ja) * 2019-08-30 2022-10-27 アプライド マテリアルズ インコーポレイテッド 電子ビームｐｖｄ終点検出および閉ループ処理制御システム
US11469571B2 (en) 2019-11-21 2022-10-11 Kla Corporation Fast phase-shift interferometry by laser frequency shift
US11829077B2 (en) 2020-12-11 2023-11-28 Kla Corporation System and method for determining post bonding overlay
CN113203357B (zh) * 2021-04-09 2022-08-09 中国科学院上海光学精密机械研究所 一种双侧斐索干涉仪检测装置
CN113340212A (zh) * 2021-05-14 2021-09-03 中国科学院上海光学精密机械研究所 基于双侧干涉仪的形貌与厚度检测装置
CN113403601B (zh) * 2021-06-21 2022-10-21 中国科学院光电技术研究所 一种镀膜厚度光学控制装置和方法
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Also Published As

Publication number Publication date
JP4170937B2 (ja) 2008-10-22
IL199519A (en) 2015-06-30
EP1460374A3 (en) 2004-10-20
EP1460374B1 (en) 2016-05-11
EP1460374A2 (en) 2004-09-22
JP2004294432A (ja) 2004-10-21
US20040184038A1 (en) 2004-09-23
US6847458B2 (en) 2005-01-25

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