IL160164A0 - Edge gripping pre-aligner - Google Patents

Edge gripping pre-aligner

Info

Publication number
IL160164A0
IL160164A0 IL16016402A IL16016402A IL160164A0 IL 160164 A0 IL160164 A0 IL 160164A0 IL 16016402 A IL16016402 A IL 16016402A IL 16016402 A IL16016402 A IL 16016402A IL 160164 A0 IL160164 A0 IL 160164A0
Authority
IL
Israel
Prior art keywords
aligner
edge gripping
gripping pre
edge
gripping
Prior art date
Application number
IL16016402A
Other languages
English (en)
Original Assignee
Integrated Dynamics Engineering
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Integrated Dynamics Engineering filed Critical Integrated Dynamics Engineering
Publication of IL160164A0 publication Critical patent/IL160164A0/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/57—Mask-wafer alignment
IL16016402A 2001-08-09 2002-08-09 Edge gripping pre-aligner IL160164A0 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US31129001P 2001-08-09 2001-08-09
PCT/US2002/025290 WO2003014000A2 (en) 2001-08-09 2002-08-09 Edge gripping pre-aligner

Publications (1)

Publication Number Publication Date
IL160164A0 true IL160164A0 (en) 2004-07-25

Family

ID=23206242

Family Applications (1)

Application Number Title Priority Date Filing Date
IL16016402A IL160164A0 (en) 2001-08-09 2002-08-09 Edge gripping pre-aligner

Country Status (5)

Country Link
US (1) US20030072645A1 (de)
EP (1) EP1417150A2 (de)
JP (1) JP2004537868A (de)
IL (1) IL160164A0 (de)
WO (1) WO2003014000A2 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070057164A1 (en) * 2003-07-02 2007-03-15 David Vaughnn Scheimpflug normalizer
WO2005055312A1 (ja) * 2003-12-04 2005-06-16 Hirata Corporation 基板位置決めシステム
US20080203641A1 (en) * 2005-01-19 2008-08-28 Tosoh Smd Etna, Llc End Effector For Handling Sputter Targets
US20080241384A1 (en) * 2007-04-02 2008-10-02 Asm Genitech Korea Ltd. Lateral flow deposition apparatus and method of depositing film by using the apparatus
JP5537416B2 (ja) * 2007-04-26 2014-07-02 アデプト テクノロジー， インコーポレイテッド 真空把持装置
AU2011204992B2 (en) * 2007-04-26 2012-09-06 Adept Technology, Inc. Uniform Lighting and Gripper Positioning System for Robotic Picking Operations
US20090217953A1 (en) * 2008-02-28 2009-09-03 Hui Chen Drive roller for a cleaning system
CN103863851A (zh) * 2012-12-14 2014-06-18 鸿富锦精密工业（深圳）有限公司 自动上下料设备
EP3117270B1 (de) * 2014-03-12 2018-07-18 ASML Netherlands B.V. Substrathandhabungssystem und lithografische vorrichtung
US10553472B2 (en) * 2018-06-22 2020-02-04 Jabil Inc. Apparatus, system and method for providing a bernoulli-based semiconductor wafer pre-aligner
JP2020174902A (ja) * 2019-04-18 2020-10-29 クオリカプス株式会社 割線情報取得装置および錠剤印刷装置
CN113644019B (zh) * 2021-08-09 2024-03-19 恩纳基智能科技无锡有限公司 一种半导体贴片机的复合上料装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3386269B2 (ja) * 1995-01-25 2003-03-17 株式会社ニュークリエイション 光学検査装置
US5608519A (en) * 1995-03-20 1997-03-04 Gourley; Paul L. Laser apparatus and method for microscopic and spectroscopic analysis and processing of biological cells
JP3549141B2 (ja) * 1997-04-21 2004-08-04 大日本スクリーン製造株式会社 基板処理装置および基板保持装置
WO2000033359A2 (en) * 1998-12-02 2000-06-08 Kensington Laboratories, Inc. Specimen holding robotic arm end effector
US6468022B1 (en) * 2000-07-05 2002-10-22 Integrated Dynamics Engineering, Inc. Edge-gripping pre-aligner
US6435807B1 (en) * 2000-12-14 2002-08-20 Genmark Automation Integrated edge gripper

Also Published As

Publication number Publication date
WO2003014000A2 (en) 2003-02-20
EP1417150A2 (de) 2004-05-12
US20030072645A1 (en) 2003-04-17
WO2003014000A3 (en) 2003-10-16
JP2004537868A (ja) 2004-12-16

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