IL146999A0 - Interconnection method and structure - Google Patents

Interconnection method and structure

Info

Publication number
IL146999A0
IL146999A0 IL14699901A IL14699901A IL146999A0 IL 146999 A0 IL146999 A0 IL 146999A0 IL 14699901 A IL14699901 A IL 14699901A IL 14699901 A IL14699901 A IL 14699901A IL 146999 A0 IL146999 A0 IL 146999A0
Authority
IL
Israel
Prior art keywords
interconnection method
interconnection
Prior art date
Application number
IL14699901A
Other languages
English (en)
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Publication of IL146999A0 publication Critical patent/IL146999A0/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/811—Interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/08—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs
    • H10W70/09—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9413—Dispositions of bond pads on encapsulations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
IL14699901A 2000-12-18 2001-12-09 Interconnection method and structure IL146999A0 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/681,066 US6671948B2 (en) 2000-12-18 2000-12-18 Interconnection method using an etch stop

Publications (1)

Publication Number Publication Date
IL146999A0 true IL146999A0 (en) 2002-08-14

Family

ID=24733667

Family Applications (1)

Application Number Title Priority Date Filing Date
IL14699901A IL146999A0 (en) 2000-12-18 2001-12-09 Interconnection method and structure

Country Status (5)

Country Link
US (2) US6671948B2 (https=)
EP (1) EP1215726B1 (https=)
JP (1) JP4242585B2 (https=)
DE (1) DE60144216D1 (https=)
IL (1) IL146999A0 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6964881B2 (en) * 2002-08-27 2005-11-15 Micron Technology, Inc. Multi-chip wafer level system packages and methods of forming same
US7212698B2 (en) * 2004-02-10 2007-05-01 International Business Machines Corporation Circuit board integrated optical coupling elements
US7112877B2 (en) * 2004-06-28 2006-09-26 General Electric Company High density package with wrap around interconnect
US7316509B2 (en) * 2004-06-30 2008-01-08 Intel Corporation Apparatus for electrical and optical interconnection
US20070012965A1 (en) * 2005-07-15 2007-01-18 General Electric Company Photodetection system and module
US8492762B2 (en) * 2006-06-27 2013-07-23 General Electric Company Electrical interface for a sensor array
US20080068815A1 (en) * 2006-09-18 2008-03-20 Oliver Richard Astley Interface Assembly And Method for Integrating A Data Acquisition System on a Sensor Array
US7586096B2 (en) * 2006-11-17 2009-09-08 General Electric Company Interface assembly for thermally coupling a data acquisition system to a sensor array
US8236609B2 (en) * 2008-08-01 2012-08-07 Freescale Semiconductor, Inc. Packaging an integrated circuit die with backside metallization
US8623699B2 (en) 2010-07-26 2014-01-07 General Electric Company Method of chip package build-up
DE102015218530A1 (de) 2015-09-25 2017-03-30 Elringklinger Ag Gehäuse für eine elektrochemische Zelle und Verfahren zur Herstellung eines Gehäuses für eine elektrochemische Zelle
DE202015105086U1 (de) 2015-09-25 2015-10-22 Elringklinger Ag Gehäuse für eine elektrochemische Zelle

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4374394A (en) * 1980-10-01 1983-02-15 Rca Corporation Monolithic integrated circuit
US5151776A (en) 1989-03-28 1992-09-29 General Electric Company Die attachment method for use in high density interconnected assemblies
US5355102A (en) 1990-04-05 1994-10-11 General Electric Company HDI impedance matched microwave circuit assembly
JPH04188741A (ja) * 1990-11-22 1992-07-07 Hitachi Ltd 半導体装置の製造方法とそれに使用するキャリアテープ
US5635762A (en) * 1993-05-18 1997-06-03 U.S. Philips Corporation Flip chip semiconductor device with dual purpose metallized ground conductor
US5527741A (en) 1994-10-11 1996-06-18 Martin Marietta Corporation Fabrication and structures of circuit modules with flexible interconnect layers
JPH0927606A (ja) * 1995-07-12 1997-01-28 Fuji Film Micro Device Kk Ｃｏｇ構造の固体撮像素子

Also Published As

Publication number Publication date
US6671948B2 (en) 2004-01-06
JP4242585B2 (ja) 2009-03-25
US20020075107A1 (en) 2002-06-20
US20040099947A1 (en) 2004-05-27
EP1215726A2 (en) 2002-06-19
EP1215726A3 (en) 2006-08-09
EP1215726B1 (en) 2011-03-16
DE60144216D1 (de) 2011-04-28
US6933813B2 (en) 2005-08-23
JP2002305199A (ja) 2002-10-18

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