IL140055A0 - Method and apparatus for determining processing chamber cleaning or wafer etching endpoint - Google Patents

Method and apparatus for determining processing chamber cleaning or wafer etching endpoint

Info

Publication number
IL140055A0
IL140055A0 IL14005599A IL14005599A IL140055A0 IL 140055 A0 IL140055 A0 IL 140055A0 IL 14005599 A IL14005599 A IL 14005599A IL 14005599 A IL14005599 A IL 14005599A IL 140055 A0 IL140055 A0 IL 140055A0
Authority
IL
Israel
Prior art keywords
processing chamber
chamber cleaning
determining processing
wafer etching
etching endpoint
Prior art date
Application number
IL14005599A
Original Assignee
On Line Techn Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by On Line Techn Inc filed Critical On Line Techn Inc
Publication of IL140055A0 publication Critical patent/IL140055A0/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
    • G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
    • G01N21/35—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light
    • G01N21/3504—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light for analysing gases, e.g. multi-gas analysis
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/85—Investigating moving fluids or granular solids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H01J37/32972—Spectral analysis
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N2021/8411—Application to online plant, process monitoring

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Plasma & Fusion (AREA)
  • Engineering & Computer Science (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Investigating Or Analysing Materials By The Use Of Chemical Reactions (AREA)
  • Drying Of Semiconductors (AREA)
IL14005599A 1998-06-12 1999-06-11 Method and apparatus for determining processing chamber cleaning or wafer etching endpoint IL140055A0 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US8908998P 1998-06-12 1998-06-12
US32952099A 1999-06-10 1999-06-10
PCT/US1999/013339 WO1999064814A1 (en) 1998-06-12 1999-06-11 Method and apparatus for determining processing chamber cleaning or wafer etching endpoint

Publications (1)

Publication Number Publication Date
IL140055A0 true IL140055A0 (en) 2002-02-10

Family

ID=26780239

Family Applications (1)

Application Number Title Priority Date Filing Date
IL14005599A IL140055A0 (en) 1998-06-12 1999-06-11 Method and apparatus for determining processing chamber cleaning or wafer etching endpoint

Country Status (4)

Country Link
EP (1) EP1086353A4 (en)
JP (1) JP2002517740A (en)
IL (1) IL140055A0 (en)
WO (1) WO1999064814A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4801709B2 (en) * 2003-03-14 2011-10-26 キヤノンアネルバ株式会社 Film forming method using CVD apparatus
JP4385086B2 (en) * 2003-03-14 2009-12-16 パナソニック株式会社 CVD apparatus cleaning apparatus and CVD apparatus cleaning method
JP4264479B2 (en) * 2003-03-14 2009-05-20 キヤノンアネルバ株式会社 Cleaning method for CVD apparatus
US7479454B2 (en) 2003-09-30 2009-01-20 Tokyo Electron Limited Method and processing system for monitoring status of system components
JP4884180B2 (en) * 2006-11-21 2012-02-29 東京エレクトロン株式会社 Substrate processing apparatus and substrate processing method
JP2010190824A (en) * 2009-02-20 2010-09-02 Shimadzu Corp Absorption spectrometric apparatus for semiconductor manufacturing process
DE102013101610B4 (en) * 2013-02-19 2015-10-01 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Apparatus and method for remote detection of a non-infrared active target gas
US10043641B2 (en) * 2016-09-22 2018-08-07 Applied Materials, Inc. Methods and apparatus for processing chamber cleaning end point detection
TWI636253B (en) * 2017-01-05 2018-09-21 富蘭登科技股份有限公司 Measuring device using spectrometer to measure gas dissociation state
WO2018222942A1 (en) * 2017-06-01 2018-12-06 Aecom (Delaware Corporation) Quantum cascade laser trace-gas detection for in-situ monitoring, process control, and automating end-point determination of chamber clean in semiconductor manufacturing

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4095899A (en) * 1976-03-01 1978-06-20 The United States Of America As Represented By The Secretary Of The Air Force Apparatus for double-beaming in fourier spectroscopy
US5683538A (en) * 1994-12-23 1997-11-04 International Business Machines Corporation Control of etch selectivity
US6194628B1 (en) * 1995-09-25 2001-02-27 Applied Materials, Inc. Method and apparatus for cleaning a vacuum line in a CVD system
US6161054A (en) * 1997-09-22 2000-12-12 On-Line Technologies, Inc. Cell control method and apparatus
US6192287B1 (en) * 1997-09-23 2001-02-20 On-Line Technologies, Inc. Method and apparatus for fault detection and control

Also Published As

Publication number Publication date
EP1086353A1 (en) 2001-03-28
JP2002517740A (en) 2002-06-18
WO1999064814A1 (en) 1999-12-16
EP1086353A4 (en) 2001-08-22

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