IL140055A0 - Method and apparatus for determining processing chamber cleaning or wafer etching endpoint - Google Patents
Method and apparatus for determining processing chamber cleaning or wafer etching endpointInfo
- Publication number
- IL140055A0 IL140055A0 IL14005599A IL14005599A IL140055A0 IL 140055 A0 IL140055 A0 IL 140055A0 IL 14005599 A IL14005599 A IL 14005599A IL 14005599 A IL14005599 A IL 14005599A IL 140055 A0 IL140055 A0 IL 140055A0
- Authority
- IL
- Israel
- Prior art keywords
- processing chamber
- chamber cleaning
- determining processing
- wafer etching
- etching endpoint
- Prior art date
Links
- 238000004140 cleaning Methods 0.000 title 1
- 238000005530 etching Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
- G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
- G01N21/35—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light
- G01N21/3504—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light for analysing gases, e.g. multi-gas analysis
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/85—Investigating moving fluids or granular solids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
- H01J37/32972—Spectral analysis
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N2021/8411—Application to online plant, process monitoring
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Plasma & Fusion (AREA)
- Engineering & Computer Science (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
- Investigating Or Analysing Materials By The Use Of Chemical Reactions (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US8908998P | 1998-06-12 | 1998-06-12 | |
US32952099A | 1999-06-10 | 1999-06-10 | |
PCT/US1999/013339 WO1999064814A1 (en) | 1998-06-12 | 1999-06-11 | Method and apparatus for determining processing chamber cleaning or wafer etching endpoint |
Publications (1)
Publication Number | Publication Date |
---|---|
IL140055A0 true IL140055A0 (en) | 2002-02-10 |
Family
ID=26780239
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL14005599A IL140055A0 (en) | 1998-06-12 | 1999-06-11 | Method and apparatus for determining processing chamber cleaning or wafer etching endpoint |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1086353A4 (en) |
JP (1) | JP2002517740A (en) |
IL (1) | IL140055A0 (en) |
WO (1) | WO1999064814A1 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4801709B2 (en) * | 2003-03-14 | 2011-10-26 | キヤノンアネルバ株式会社 | Film forming method using CVD apparatus |
JP4385086B2 (en) | 2003-03-14 | 2009-12-16 | パナソニック株式会社 | CVD apparatus cleaning apparatus and CVD apparatus cleaning method |
JP4264479B2 (en) * | 2003-03-14 | 2009-05-20 | キヤノンアネルバ株式会社 | Cleaning method for CVD apparatus |
US7479454B2 (en) | 2003-09-30 | 2009-01-20 | Tokyo Electron Limited | Method and processing system for monitoring status of system components |
JP4884180B2 (en) * | 2006-11-21 | 2012-02-29 | 東京エレクトロン株式会社 | Substrate processing apparatus and substrate processing method |
JP2010190824A (en) * | 2009-02-20 | 2010-09-02 | Shimadzu Corp | Absorption spectrometric apparatus for semiconductor manufacturing process |
DE102013101610B4 (en) * | 2013-02-19 | 2015-10-01 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Apparatus and method for remote detection of a non-infrared active target gas |
US10043641B2 (en) | 2016-09-22 | 2018-08-07 | Applied Materials, Inc. | Methods and apparatus for processing chamber cleaning end point detection |
TWI636253B (en) * | 2017-01-05 | 2018-09-21 | 富蘭登科技股份有限公司 | Measuring device using spectrometer to measure gas dissociation state |
WO2018222942A1 (en) * | 2017-06-01 | 2018-12-06 | Aecom (Delaware Corporation) | Quantum cascade laser trace-gas detection for in-situ monitoring, process control, and automating end-point determination of chamber clean in semiconductor manufacturing |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4095899A (en) * | 1976-03-01 | 1978-06-20 | The United States Of America As Represented By The Secretary Of The Air Force | Apparatus for double-beaming in fourier spectroscopy |
US5683538A (en) * | 1994-12-23 | 1997-11-04 | International Business Machines Corporation | Control of etch selectivity |
US6194628B1 (en) * | 1995-09-25 | 2001-02-27 | Applied Materials, Inc. | Method and apparatus for cleaning a vacuum line in a CVD system |
US6161054A (en) * | 1997-09-22 | 2000-12-12 | On-Line Technologies, Inc. | Cell control method and apparatus |
WO1999016108A2 (en) * | 1997-09-23 | 1999-04-01 | On-Line Technologies, Inc. | Method and apparatus for fault detection and control |
-
1999
- 1999-06-11 WO PCT/US1999/013339 patent/WO1999064814A1/en not_active Application Discontinuation
- 1999-06-11 EP EP99928616A patent/EP1086353A4/en not_active Withdrawn
- 1999-06-11 JP JP2000553766A patent/JP2002517740A/en active Pending
- 1999-06-11 IL IL14005599A patent/IL140055A0/en unknown
Also Published As
Publication number | Publication date |
---|---|
WO1999064814A1 (en) | 1999-12-16 |
EP1086353A4 (en) | 2001-08-22 |
EP1086353A1 (en) | 2001-03-28 |
JP2002517740A (en) | 2002-06-18 |
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