IL138158A - שיטה לקביעת אוריינטציה פנימית של פרוסת סיליקון - Google Patents

שיטה לקביעת אוריינטציה פנימית של פרוסת סיליקון

Info

Publication number
IL138158A
IL138158A IL13815800A IL13815800A IL138158A IL 138158 A IL138158 A IL 138158A IL 13815800 A IL13815800 A IL 13815800A IL 13815800 A IL13815800 A IL 13815800A IL 138158 A IL138158 A IL 138158A
Authority
IL
Israel
Prior art keywords
determining
wafer
orientation
coordinate system
relative
Prior art date
Application number
IL13815800A
Other languages
English (en)
Other versions
IL138158A0 (en
Original Assignee
Nova Measuring Instr Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nova Measuring Instr Ltd filed Critical Nova Measuring Instr Ltd
Priority to IL13815800A priority Critical patent/IL138158A/he
Priority to US09/931,731 priority patent/US6544805B2/en
Publication of IL138158A0 publication Critical patent/IL138158A0/xx
Publication of IL138158A publication Critical patent/IL138158A/he

Links

Classifications

    • H10P74/277—
    • H10W46/201—

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
IL13815800A 2000-08-30 2000-08-30 שיטה לקביעת אוריינטציה פנימית של פרוסת סיליקון IL138158A (he)

Priority Applications (2)

Application Number Priority Date Filing Date Title
IL13815800A IL138158A (he) 2000-08-30 2000-08-30 שיטה לקביעת אוריינטציה פנימית של פרוסת סיליקון
US09/931,731 US6544805B2 (en) 2000-08-30 2001-08-16 Method for determining the internal orientation of a wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IL13815800A IL138158A (he) 2000-08-30 2000-08-30 שיטה לקביעת אוריינטציה פנימית של פרוסת סיליקון

Publications (2)

Publication Number Publication Date
IL138158A0 IL138158A0 (en) 2001-10-31
IL138158A true IL138158A (he) 2004-06-20

Family

ID=11074574

Family Applications (1)

Application Number Title Priority Date Filing Date
IL13815800A IL138158A (he) 2000-08-30 2000-08-30 שיטה לקביעת אוריינטציה פנימית של פרוסת סיליקון

Country Status (2)

Country Link
US (1) US6544805B2 (he)
IL (1) IL138158A (he)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6836690B1 (en) 2002-07-19 2004-12-28 Nanometrics Incorporated High precision substrate prealigner
US7102206B2 (en) * 2003-01-20 2006-09-05 Matsushita Electric Industrial Co., Ltd. Semiconductor substrate, method for fabricating the same, and method for fabricating semiconductor device
JP2004235354A (ja) * 2003-01-29 2004-08-19 Canon Inc 露光装置
US8064730B2 (en) * 2003-09-22 2011-11-22 Asml Netherlands B.V. Device manufacturing method, orientation determination method and lithographic apparatus
IL158086A (en) * 2003-09-24 2010-02-17 Nova Measuring Instr Ltd Method and system for positioning articles with respect to a processing tool
US7373277B1 (en) 2004-03-09 2008-05-13 Kla-Tencor Technologies Corp. Methods and systems for detection of selected defects particularly in relatively noisy inspection data
JP4262232B2 (ja) * 2005-10-17 2009-05-13 リンテック株式会社 測定装置
US7397554B1 (en) 2006-01-04 2008-07-08 N&K Technology, Inc. Apparatus and method for examining a disk-shaped sample on an X-Y-theta stage
JP4665933B2 (ja) * 2006-07-04 2011-04-06 セイコーエプソン株式会社 文書編集支援装置、プログラムおよび記憶媒体
JP4337867B2 (ja) * 2006-12-01 2009-09-30 セイコーエプソン株式会社 文書編集支援装置、文書編集装置、プログラムおよび記憶媒体
JP5328812B2 (ja) * 2008-01-28 2013-10-30 シーメンス・ヘルスケア・ダイアグノスティックス・インコーポレーテッド 物体を検出するための補助照明のための装置及び方法
US20120313213A1 (en) * 2011-06-07 2012-12-13 Raytheon Company Polygon shaped power amplifier chips
US8614797B2 (en) * 2011-06-27 2013-12-24 Infineon Technologies Ag Wafer orientation sensor
US9355440B1 (en) 2012-10-10 2016-05-31 Kla-Tencor Corp. Detection of selected defects in relatively noisy inspection data
US9513230B2 (en) * 2012-12-14 2016-12-06 Kla-Tencor Corporation Apparatus and method for optical inspection, magnetic field and height mapping
US9442077B2 (en) 2013-08-28 2016-09-13 Kla-Tencor Corp. Scratch filter for wafer inspection
US11295975B2 (en) * 2019-09-13 2022-04-05 Brooks Automation Us, Llc Method and apparatus for substrate alignment
US11302030B2 (en) * 2020-05-14 2022-04-12 Kla Corporation System, method, and target for wafer alignment
US12100132B2 (en) * 2021-10-18 2024-09-24 Kla Corporation Laser anneal pattern suppression
TWI840217B (zh) * 2023-05-09 2024-04-21 中華學校財團法人中華科技大學 應用霍夫變換之晶圓定位系統及方法
US20240429101A1 (en) * 2023-06-23 2024-12-26 Taiwan Semiconductor Manufacturing Co., Ltd. Auto Recipe Generation and Dicing Process
WO2025253901A1 (ja) * 2024-06-04 2025-12-11 東京エレクトロン株式会社 基板処理装置および基板処理方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5083378A (en) * 1991-01-14 1992-01-28 The United States Of America As Represented By The Administrator, National Aeronautics And Space Administration Two dimensional vernier
AUPO206596A0 (en) * 1996-08-30 1996-09-26 Anca Pty Ltd Tool grinding simulation system

Also Published As

Publication number Publication date
US6544805B2 (en) 2003-04-08
IL138158A0 (en) 2001-10-31
US20020042153A1 (en) 2002-04-11

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