IL124199A - Apparatus for cleaving crystals - Google Patents
Apparatus for cleaving crystalsInfo
- Publication number
- IL124199A IL124199A IL12419998A IL12419998A IL124199A IL 124199 A IL124199 A IL 124199A IL 12419998 A IL12419998 A IL 12419998A IL 12419998 A IL12419998 A IL 12419998A IL 124199 A IL124199 A IL 124199A
- Authority
- IL
- Israel
- Prior art keywords
- cleaving
- crystals
- cleaving crystals
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
- B28D5/0023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/30—Breaking or tearing apparatus
- Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
- Y10T225/321—Preliminary weakener
- Y10T225/325—With means to apply moment of force to weakened work
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/30—Breaking or tearing apparatus
- Y10T225/371—Movable breaking tool
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Sampling And Sample Adjustment (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IL12419998A IL124199A (en) | 1998-04-23 | 1998-04-23 | Apparatus for cleaving crystals |
US09/298,773 US6223961B1 (en) | 1998-04-23 | 1999-04-22 | Apparatus for cleaving crystals |
DE69930205T DE69930205T2 (de) | 1998-04-23 | 1999-04-22 | Kristallspaltvorrichtung |
EP99201233A EP0951980B1 (fr) | 1998-04-23 | 1999-04-22 | Dispositif de clivage de crystaux |
JP11493499A JP4037557B2 (ja) | 1998-04-23 | 1999-04-22 | 結晶体の劈開装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IL12419998A IL124199A (en) | 1998-04-23 | 1998-04-23 | Apparatus for cleaving crystals |
Publications (1)
Publication Number | Publication Date |
---|---|
IL124199A true IL124199A (en) | 2001-03-19 |
Family
ID=11071432
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL12419998A IL124199A (en) | 1998-04-23 | 1998-04-23 | Apparatus for cleaving crystals |
Country Status (5)
Country | Link |
---|---|
US (1) | US6223961B1 (fr) |
EP (1) | EP0951980B1 (fr) |
JP (1) | JP4037557B2 (fr) |
DE (1) | DE69930205T2 (fr) |
IL (1) | IL124199A (fr) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19958803C1 (de) * | 1999-12-07 | 2001-08-30 | Fraunhofer Ges Forschung | Verfahren und Vorrichtung zum Handhaben von Halbleitersubstraten bei der Prozessierung und/oder Bearbeitung |
KR100637590B1 (ko) * | 2005-07-08 | 2006-10-23 | 주식회사 탑 엔지니어링 | 평판표시장치 제조용 기판 스크라이빙장치 |
SG177823A1 (en) * | 2010-07-06 | 2012-02-28 | Camtek Ltd | Method and system for preparing a lamella |
SG177822A1 (en) | 2010-07-06 | 2012-02-28 | Camtek Ltd | Method and system for preparing a sample |
US10773420B2 (en) * | 2011-11-10 | 2020-09-15 | LatticeGear, LLC | Device and method for cleaving a substrate |
US20130119106A1 (en) * | 2011-11-10 | 2013-05-16 | LatticeGear, LLC | Device and Method for Cleaving. |
US10065340B2 (en) * | 2011-11-10 | 2018-09-04 | LatticeGear, LLC | Device and method for cleaving |
JP5983412B2 (ja) * | 2011-11-16 | 2016-08-31 | 日本電気硝子株式会社 | 板ガラス割断装置、板ガラス割断方法、板ガラス作製方法、および、板ガラス割断システム |
JP5750202B1 (ja) * | 2013-07-08 | 2015-07-15 | 川崎重工業株式会社 | 脆性材料の板材の分断方法及び分断装置 |
US10213940B2 (en) | 2014-09-30 | 2019-02-26 | Ib Labs, Inc. | Device and method for cleaving a crystalline sample |
JP2019038238A (ja) * | 2017-08-29 | 2019-03-14 | 三星ダイヤモンド工業株式会社 | ブレイク装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE310768B (fr) * | 1962-08-31 | 1969-05-12 | Lkb Produkter Ab | |
US3680213A (en) | 1969-02-03 | 1972-08-01 | Karl O Reichert | Method of grooving semiconductor wafer for the dividing thereof |
IT999495B (it) * | 1972-11-29 | 1976-02-20 | Takenaka Komuten Co | Frantumatrice per calcestruzzo |
SE410308B (sv) * | 1978-07-04 | 1979-10-08 | Lkb Produkter Ab | Anordning for att bryta en glasplatta sa att en skarp egg bildas |
US4228937A (en) | 1979-03-29 | 1980-10-21 | Rca Corporation | Cleaving apparatus |
JPS6282008A (ja) | 1985-10-04 | 1987-04-15 | 三菱電機株式会社 | 半導体ウエハ−ブレイク装置 |
GB8611399D0 (en) * | 1986-05-09 | 1986-06-18 | York Technology Ltd | Cleaving optical fibres |
JPH01133704A (ja) * | 1987-11-19 | 1989-05-25 | Sharp Corp | 半導体基板の分割方法 |
US4837915A (en) * | 1988-01-04 | 1989-06-13 | James D. Welch | Method of breaking bearings |
IT1218088B (it) * | 1988-06-16 | 1990-04-12 | Aisa Spa | Attrezzatura per la separazione automatica lungo le linee di frattura per flessione predisposte in piastrelle ceramiche di base di circuiti elettronici ibridi |
CA2115744A1 (fr) | 1991-08-14 | 1993-03-04 | Colin Smith | Appareil de separation de plaquettes a gravure en semiconducteur et methode connexe |
DE4133150A1 (de) * | 1991-09-30 | 1993-04-01 | Siemens Ag | Verfahren zum abtrennen eines halbleiter-plaettchens aus einem halbleiter-plaettchenverband |
FR2749794B1 (fr) * | 1996-06-13 | 1998-07-31 | Charil Josette | Dispositif de clivage d'une plaque de materiau semi-conducteur |
JP3326384B2 (ja) * | 1998-03-12 | 2002-09-24 | 古河電気工業株式会社 | 半導体ウエハーの劈開方法およびその装置 |
-
1998
- 1998-04-23 IL IL12419998A patent/IL124199A/xx not_active IP Right Cessation
-
1999
- 1999-04-22 US US09/298,773 patent/US6223961B1/en not_active Expired - Lifetime
- 1999-04-22 EP EP99201233A patent/EP0951980B1/fr not_active Expired - Lifetime
- 1999-04-22 JP JP11493499A patent/JP4037557B2/ja not_active Expired - Fee Related
- 1999-04-22 DE DE69930205T patent/DE69930205T2/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2000266652A (ja) | 2000-09-29 |
US6223961B1 (en) | 2001-05-01 |
EP0951980A2 (fr) | 1999-10-27 |
DE69930205D1 (de) | 2006-05-04 |
EP0951980A3 (fr) | 2003-01-15 |
EP0951980B1 (fr) | 2006-03-08 |
DE69930205T2 (de) | 2006-11-23 |
JP4037557B2 (ja) | 2008-01-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FF | Patent granted | ||
KB | Patent renewed | ||
KB | Patent renewed | ||
KB | Patent renewed | ||
KB | Patent renewed | ||
KB | Patent renewed | ||
EXP | Patent expired |