IL124199A - Apparatus for cleaving crystals - Google Patents

Apparatus for cleaving crystals

Info

Publication number
IL124199A
IL124199A IL12419998A IL12419998A IL124199A IL 124199 A IL124199 A IL 124199A IL 12419998 A IL12419998 A IL 12419998A IL 12419998 A IL12419998 A IL 12419998A IL 124199 A IL124199 A IL 124199A
Authority
IL
Israel
Prior art keywords
cleaving
crystals
cleaving crystals
Prior art date
Application number
IL12419998A
Other languages
English (en)
Inventor
Dmitri Boguslavsky
Colin Smith
Arnon Ben-Nathan
Original Assignee
Sela Semiconductor Enginering
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sela Semiconductor Enginering filed Critical Sela Semiconductor Enginering
Priority to IL12419998A priority Critical patent/IL124199A/xx
Priority to US09/298,773 priority patent/US6223961B1/en
Priority to DE69930205T priority patent/DE69930205T2/de
Priority to EP99201233A priority patent/EP0951980B1/fr
Priority to JP11493499A priority patent/JP4037557B2/ja
Publication of IL124199A publication Critical patent/IL124199A/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
    • Y10T225/321—Preliminary weakener
    • Y10T225/325—With means to apply moment of force to weakened work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/371—Movable breaking tool

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
IL12419998A 1998-04-23 1998-04-23 Apparatus for cleaving crystals IL124199A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
IL12419998A IL124199A (en) 1998-04-23 1998-04-23 Apparatus for cleaving crystals
US09/298,773 US6223961B1 (en) 1998-04-23 1999-04-22 Apparatus for cleaving crystals
DE69930205T DE69930205T2 (de) 1998-04-23 1999-04-22 Kristallspaltvorrichtung
EP99201233A EP0951980B1 (fr) 1998-04-23 1999-04-22 Dispositif de clivage de crystaux
JP11493499A JP4037557B2 (ja) 1998-04-23 1999-04-22 結晶体の劈開装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IL12419998A IL124199A (en) 1998-04-23 1998-04-23 Apparatus for cleaving crystals

Publications (1)

Publication Number Publication Date
IL124199A true IL124199A (en) 2001-03-19

Family

ID=11071432

Family Applications (1)

Application Number Title Priority Date Filing Date
IL12419998A IL124199A (en) 1998-04-23 1998-04-23 Apparatus for cleaving crystals

Country Status (5)

Country Link
US (1) US6223961B1 (fr)
EP (1) EP0951980B1 (fr)
JP (1) JP4037557B2 (fr)
DE (1) DE69930205T2 (fr)
IL (1) IL124199A (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19958803C1 (de) * 1999-12-07 2001-08-30 Fraunhofer Ges Forschung Verfahren und Vorrichtung zum Handhaben von Halbleitersubstraten bei der Prozessierung und/oder Bearbeitung
KR100637590B1 (ko) * 2005-07-08 2006-10-23 주식회사 탑 엔지니어링 평판표시장치 제조용 기판 스크라이빙장치
SG177823A1 (en) * 2010-07-06 2012-02-28 Camtek Ltd Method and system for preparing a lamella
SG177822A1 (en) 2010-07-06 2012-02-28 Camtek Ltd Method and system for preparing a sample
US10773420B2 (en) * 2011-11-10 2020-09-15 LatticeGear, LLC Device and method for cleaving a substrate
US20130119106A1 (en) * 2011-11-10 2013-05-16 LatticeGear, LLC Device and Method for Cleaving.
US10065340B2 (en) * 2011-11-10 2018-09-04 LatticeGear, LLC Device and method for cleaving
JP5983412B2 (ja) * 2011-11-16 2016-08-31 日本電気硝子株式会社 板ガラス割断装置、板ガラス割断方法、板ガラス作製方法、および、板ガラス割断システム
JP5750202B1 (ja) * 2013-07-08 2015-07-15 川崎重工業株式会社 脆性材料の板材の分断方法及び分断装置
US10213940B2 (en) 2014-09-30 2019-02-26 Ib Labs, Inc. Device and method for cleaving a crystalline sample
JP2019038238A (ja) * 2017-08-29 2019-03-14 三星ダイヤモンド工業株式会社 ブレイク装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE310768B (fr) * 1962-08-31 1969-05-12 Lkb Produkter Ab
US3680213A (en) 1969-02-03 1972-08-01 Karl O Reichert Method of grooving semiconductor wafer for the dividing thereof
IT999495B (it) * 1972-11-29 1976-02-20 Takenaka Komuten Co Frantumatrice per calcestruzzo
SE410308B (sv) * 1978-07-04 1979-10-08 Lkb Produkter Ab Anordning for att bryta en glasplatta sa att en skarp egg bildas
US4228937A (en) 1979-03-29 1980-10-21 Rca Corporation Cleaving apparatus
JPS6282008A (ja) 1985-10-04 1987-04-15 三菱電機株式会社 半導体ウエハ−ブレイク装置
GB8611399D0 (en) * 1986-05-09 1986-06-18 York Technology Ltd Cleaving optical fibres
JPH01133704A (ja) * 1987-11-19 1989-05-25 Sharp Corp 半導体基板の分割方法
US4837915A (en) * 1988-01-04 1989-06-13 James D. Welch Method of breaking bearings
IT1218088B (it) * 1988-06-16 1990-04-12 Aisa Spa Attrezzatura per la separazione automatica lungo le linee di frattura per flessione predisposte in piastrelle ceramiche di base di circuiti elettronici ibridi
CA2115744A1 (fr) 1991-08-14 1993-03-04 Colin Smith Appareil de separation de plaquettes a gravure en semiconducteur et methode connexe
DE4133150A1 (de) * 1991-09-30 1993-04-01 Siemens Ag Verfahren zum abtrennen eines halbleiter-plaettchens aus einem halbleiter-plaettchenverband
FR2749794B1 (fr) * 1996-06-13 1998-07-31 Charil Josette Dispositif de clivage d'une plaque de materiau semi-conducteur
JP3326384B2 (ja) * 1998-03-12 2002-09-24 古河電気工業株式会社 半導体ウエハーの劈開方法およびその装置

Also Published As

Publication number Publication date
JP2000266652A (ja) 2000-09-29
US6223961B1 (en) 2001-05-01
EP0951980A2 (fr) 1999-10-27
DE69930205D1 (de) 2006-05-04
EP0951980A3 (fr) 2003-01-15
EP0951980B1 (fr) 2006-03-08
DE69930205T2 (de) 2006-11-23
JP4037557B2 (ja) 2008-01-23

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Legal Events

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EXP Patent expired