IL117657A0 - Ceramic target for thin film deposition - Google Patents
Ceramic target for thin film depositionInfo
- Publication number
- IL117657A0 IL117657A0 IL11765796A IL11765796A IL117657A0 IL 117657 A0 IL117657 A0 IL 117657A0 IL 11765796 A IL11765796 A IL 11765796A IL 11765796 A IL11765796 A IL 11765796A IL 117657 A0 IL117657 A0 IL 117657A0
- Authority
- IL
- Israel
- Prior art keywords
- thin film
- film deposition
- ceramic target
- ceramic
- target
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3423—Shape
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IL11765796A IL117657A0 (en) | 1996-03-26 | 1996-03-26 | Ceramic target for thin film deposition |
AU19383/97A AU1938397A (en) | 1996-03-26 | 1997-03-26 | Ceramic target for thin film deposition |
PCT/IL1997/000108 WO1997036020A1 (en) | 1996-03-26 | 1997-03-26 | Ceramic target for thin film deposition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IL11765796A IL117657A0 (en) | 1996-03-26 | 1996-03-26 | Ceramic target for thin film deposition |
Publications (1)
Publication Number | Publication Date |
---|---|
IL117657A0 true IL117657A0 (en) | 1996-07-23 |
Family
ID=11068700
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL11765796A IL117657A0 (en) | 1996-03-26 | 1996-03-26 | Ceramic target for thin film deposition |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU1938397A (en) |
IL (1) | IL117657A0 (en) |
WO (1) | WO1997036020A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060006064A1 (en) * | 2004-07-09 | 2006-01-12 | Avi Tepman | Target tiles in a staggered array |
US7550066B2 (en) | 2004-07-09 | 2009-06-23 | Applied Materials, Inc. | Staggered target tiles |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57145982A (en) * | 1981-03-03 | 1982-09-09 | Toshiba Corp | Target for sputtering device |
US4415427A (en) * | 1982-09-30 | 1983-11-15 | Gte Products Corporation | Thin film deposition by sputtering |
KR910007382B1 (en) * | 1987-08-07 | 1991-09-25 | 가부시기가이샤 히다찌세이사꾸쇼 | Superconductor material and method of manufacturing super-conductor film |
JPH0621344B2 (en) * | 1988-02-17 | 1994-03-23 | 工業技術院長 | Superconducting thin film production equipment |
JPH01290765A (en) * | 1988-05-16 | 1989-11-22 | Toshiba Corp | Sputtering target |
US5187147A (en) * | 1991-05-31 | 1993-02-16 | Florida State University | Method for producing freestanding high Tc superconducting thin films |
JPH05109655A (en) * | 1991-10-15 | 1993-04-30 | Applied Materials Japan Kk | Cvd-sputtering system |
JPH05230640A (en) * | 1992-02-25 | 1993-09-07 | Fujitsu Ltd | Sputtering apparatus |
US5344302A (en) * | 1993-09-03 | 1994-09-06 | B&W Nuclear Service Company | Remote impression tool |
-
1996
- 1996-03-26 IL IL11765796A patent/IL117657A0/en unknown
-
1997
- 1997-03-26 WO PCT/IL1997/000108 patent/WO1997036020A1/en active Application Filing
- 1997-03-26 AU AU19383/97A patent/AU1938397A/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO1997036020A1 (en) | 1997-10-02 |
AU1938397A (en) | 1997-10-17 |
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