IL109638A - Polishing tool components - Google Patents

Polishing tool components

Info

Publication number
IL109638A
IL109638A IL10963894A IL10963894A IL109638A IL 109638 A IL109638 A IL 109638A IL 10963894 A IL10963894 A IL 10963894A IL 10963894 A IL10963894 A IL 10963894A IL 109638 A IL109638 A IL 109638A
Authority
IL
Israel
Prior art keywords
elements
abrasive
component according
carrier
working
Prior art date
Application number
IL10963894A
Other languages
English (en)
Other versions
IL109638A0 (en
Original Assignee
De Beers Ind Diamond
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by De Beers Ind Diamond filed Critical De Beers Ind Diamond
Publication of IL109638A0 publication Critical patent/IL109638A0/xx
Publication of IL109638A publication Critical patent/IL109638A/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D99/00Subject matter not provided for in other groups of this subclass
    • B24D99/005Segments of abrasive wheels
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
    • B24D7/066Grinding blocks; their mountings or supports

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Cutting Tools, Boring Holders, And Turrets (AREA)
  • Processing Of Terminals (AREA)
  • Gripping On Spindles (AREA)
IL10963894A 1993-05-14 1994-05-12 Polishing tool components IL109638A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB939309972A GB9309972D0 (en) 1993-05-14 1993-05-14 Tool insert

Publications (2)

Publication Number Publication Date
IL109638A0 IL109638A0 (en) 1994-08-26
IL109638A true IL109638A (en) 1998-09-24

Family

ID=10735491

Family Applications (1)

Application Number Title Priority Date Filing Date
IL10963894A IL109638A (en) 1993-05-14 1994-05-12 Polishing tool components

Country Status (12)

Country Link
US (1) US5607346A (de)
EP (1) EP0655024B1 (de)
JP (1) JPH08502930A (de)
AT (1) ATE187377T1 (de)
AU (1) AU682184B2 (de)
CA (1) CA2136014A1 (de)
DE (1) DE69422004T2 (de)
ES (1) ES2139075T3 (de)
GB (1) GB9309972D0 (de)
IL (1) IL109638A (de)
WO (1) WO1994026470A1 (de)
ZA (1) ZA943301B (de)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1269964B (it) * 1994-06-29 1997-04-16 S E A Utensili Diamantati S P Utensile porta-inserti diamantati per macchine automatiche e manuali tipo calibratrici, levigatrici e lucidatrici per l'industria lapidea, ceramica e piastrelle
US5958794A (en) 1995-09-22 1999-09-28 Minnesota Mining And Manufacturing Company Method of modifying an exposed surface of a semiconductor wafer
US5692950A (en) * 1996-08-08 1997-12-02 Minnesota Mining And Manufacturing Company Abrasive construction for semiconductor wafer modification
US6368198B1 (en) * 1999-11-22 2002-04-09 Kinik Company Diamond grid CMP pad dresser
US6194317B1 (en) 1998-04-30 2001-02-27 3M Innovative Properties Company Method of planarizing the upper surface of a semiconductor wafer
US8092707B2 (en) 1997-04-30 2012-01-10 3M Innovative Properties Company Compositions and methods for modifying a surface suited for semiconductor fabrication
IT246526Y1 (it) * 1999-02-16 2002-04-09 Master Service S R L Spazzola per il trattamento superficiale di materiali
JP2002050016A (ja) * 2000-07-28 2002-02-15 Fujitsu Ltd 磁気ヘッドスライダの製造方法及び装置
JP3789744B2 (ja) 2000-10-27 2006-06-28 富士通株式会社 ラッピング装置及びラッピング方法
SG90192A1 (en) * 2000-11-06 2002-07-23 Kinik Co A diamond grid cmp pad dresser
USD501857S1 (en) * 2003-04-24 2005-02-15 3M Innovative Properties Company Abrasive member
USD498654S1 (en) 2003-10-20 2004-11-23 Smith Abrasives, Inc. Diamond bench stone
KR101165114B1 (ko) * 2004-10-06 2012-07-12 라지브 바자즈 향상된 화학 기계적 평탄화 작업용 장치 및 방법
CN100513082C (zh) * 2004-10-06 2009-07-15 拉杰夫·巴贾 用于改善的化学机械抛光的方法和设备
US8075745B2 (en) * 2004-11-29 2011-12-13 Semiquest Inc. Electro-method and apparatus for improved chemical mechanical planarization pad with uniform polish performance
US20070224925A1 (en) * 2006-03-21 2007-09-27 Rajeev Bajaj Chemical Mechanical Polishing Pad
US7846008B2 (en) * 2004-11-29 2010-12-07 Semiquest Inc. Method and apparatus for improved chemical mechanical planarization and CMP pad
US20090061744A1 (en) * 2007-08-28 2009-03-05 Rajeev Bajaj Polishing pad and method of use
US7530880B2 (en) * 2004-11-29 2009-05-12 Semiquest Inc. Method and apparatus for improved chemical mechanical planarization pad with pressure control and process monitor
US20080318505A1 (en) * 2004-11-29 2008-12-25 Rajeev Bajaj Chemical mechanical planarization pad and method of use thereof
US7815778B2 (en) * 2005-11-23 2010-10-19 Semiquest Inc. Electro-chemical mechanical planarization pad with uniform polish performance
US7762871B2 (en) * 2005-03-07 2010-07-27 Rajeev Bajaj Pad conditioner design and method of use
US8398463B2 (en) * 2005-03-07 2013-03-19 Rajeev Bajaj Pad conditioner and method
USD576185S1 (en) * 2006-11-23 2008-09-02 Rin-Soon Park Abrasive segment
USD566141S1 (en) * 2007-02-23 2008-04-08 Rin-Soon Park Abrasive agent
US20090011679A1 (en) * 2007-04-06 2009-01-08 Rajeev Bajaj Method of removal profile modulation in cmp pads
US8894731B2 (en) * 2007-10-01 2014-11-25 Saint-Gobain Abrasives, Inc. Abrasive processing of hard and /or brittle materials
USD594889S1 (en) * 2007-12-07 2009-06-23 Rin-Soon Park Grinding tip for grinder
US20090266002A1 (en) * 2008-04-29 2009-10-29 Rajeev Bajaj Polishing pad and method of use
WO2009134775A1 (en) * 2008-04-29 2009-11-05 Semiquest, Inc. Polishing pad composition and method of manufacture and use
US20090313905A1 (en) * 2008-06-18 2009-12-24 Stephen Fisher Method and apparatus for assembly of cmp polishing pads
WO2010002832A2 (en) * 2008-07-02 2010-01-07 Saint-Gobain Abrasives, Inc. Abrasive slicing tool for electronics industry
US8292692B2 (en) * 2008-11-26 2012-10-23 Semiquest, Inc. Polishing pad with endpoint window and systems and method using the same
CH701596B1 (de) * 2009-08-11 2013-08-15 Meister Abrasives Ag Abrichtwerkzeug.
ES1071330Y (es) * 2009-09-30 2010-05-12 Matilla Botella Raquel Pieza multicapa para el pulido de piedra
US10226853B2 (en) 2013-01-18 2019-03-12 Applied Materials, Inc. Methods and apparatus for conditioning of chemical mechanical polishing pads
KR20240061651A (ko) * 2021-09-29 2024-05-08 엔테그리스, 아이엔씨. 양면 패드 컨디셔너

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1290990A (en) * 1916-05-09 1919-01-14 Francis Bancroft Abrading-disk.
US1953983A (en) * 1928-02-07 1934-04-10 Carborundum Co Manufacture of rubber bonded abrasive articles
US2000772A (en) * 1934-09-24 1935-05-07 William H Mcgill Grindstone
US2145888A (en) * 1936-06-06 1939-02-07 American Optical Corp Abrading tool
US2225193A (en) * 1937-09-15 1940-12-17 Carborundum Co Abrasive wheel
FR894614A (fr) * 1943-02-05 1944-12-29 Fromholt Et Janssens Ets Perfectionnements apportés aux meules abrasives
US3343308A (en) * 1965-12-30 1967-09-26 Fessel Paul Cutting and grinding devices
FR1533693A (fr) * 1967-08-04 1968-07-19 Tyrolit Schleifmittel Werke Sw Meule flexible
DE2238387A1 (de) * 1972-08-04 1974-03-28 Winter & Sohn Ernst Mehrschneidiges zerspanwerkzeug
DE2601788A1 (de) * 1976-01-20 1977-07-21 Effgen Fa Guenter Schleifscheibe o.dgl.
ZA781154B (en) * 1978-02-28 1979-09-26 De Beers Ind Diamond Abrasive bodies
FR2532875A1 (fr) * 1982-09-14 1984-03-16 Sti Applic Indles Diamant Meule a patins abrasifs multiples
JPS59156669A (ja) * 1983-02-21 1984-09-05 Sumitomo Electric Ind Ltd ソ−ブレ−ド用セグメント
DE8706303U1 (de) * 1987-05-02 1987-06-19 FAG Kugelfischer Georg Schäfer KGaA, 8720 Schweinfurt Schleifkörper
GB8720498D0 (en) * 1987-08-29 1987-10-07 Saville P A Tool/tools

Also Published As

Publication number Publication date
JPH08502930A (ja) 1996-04-02
WO1994026470A1 (en) 1994-11-24
US5607346A (en) 1997-03-04
AU6655194A (en) 1994-12-12
ES2139075T3 (es) 2000-02-01
GB9309972D0 (en) 1993-06-30
DE69422004D1 (de) 2000-01-13
EP0655024A1 (de) 1995-05-31
DE69422004T2 (de) 2000-06-29
ATE187377T1 (de) 1999-12-15
CA2136014A1 (en) 1994-11-24
AU682184B2 (en) 1997-09-25
EP0655024B1 (de) 1999-12-08
IL109638A0 (en) 1994-08-26
ZA943301B (en) 1995-01-16

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Legal Events

Date Code Title Description
FF Patent granted
KB Patent renewed
KB Patent renewed
MM9K Patent not in force due to non-payment of renewal fees