HUP0303470A2 - Oxygen-free copper alloy and its use - Google Patents
Oxygen-free copper alloy and its useInfo
- Publication number
- HUP0303470A2 HUP0303470A2 HU0303470A HUP0303470A HUP0303470A2 HU P0303470 A2 HUP0303470 A2 HU P0303470A2 HU 0303470 A HU0303470 A HU 0303470A HU P0303470 A HUP0303470 A HU P0303470A HU P0303470 A2 HUP0303470 A2 HU P0303470A2
- Authority
- HU
- Hungary
- Prior art keywords
- oxygen
- copper alloy
- free copper
- wires
- weldable
- Prior art date
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title abstract 2
- 230000000712 assembly Effects 0.000 abstract 2
- 238000000429 assembly Methods 0.000 abstract 2
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 abstract 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- 229910052748 manganese Inorganic materials 0.000 abstract 1
- 239000011572 manganese Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/05—Alloys based on copper with manganese as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
- Arc Welding In General (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
A találmány szerinti oxigénmentes rézötvözet a hegeszthetőséget fokozómikroötvözőket: 1-250 ppm ónt és/vagy 1-150 ppm mangánt tartalmaz éselektromos vezetőképessége 100% IACS fölött van. Az ötvözet jólalkalmazható szalagkábelek, kábelen belüli vezetékek, példáulkoaxiális kábelek, hegeszthető vezetékelrendezések, hegeszthető ésmegmunkálható vezetékelrendezések, víz alatti kábelen belülivezetékek, valamint bordás csövek előállítására. ÓThe oxygen-free copper alloy according to the invention contains weldability-enhancing microalloys: 1-250 ppm tin and/or 1-150 ppm manganese and its electrical conductivity is above 100% IACS. The alloy is well suited for the production of ribbon cables, wires within a cable such as coaxial cables, weldable wire assemblies, weldable and machined wire assemblies, wires within an underwater cable, and finned tubes. HE
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20010473A FI113061B (en) | 2001-03-09 | 2001-03-09 | copper alloy |
PCT/FI2002/000184 WO2002072901A1 (en) | 2001-03-09 | 2002-03-08 | Micro-alloyed oxygen-free copper alloy and its use |
Publications (2)
Publication Number | Publication Date |
---|---|
HUP0303470A2 true HUP0303470A2 (en) | 2004-01-28 |
HUP0303470A3 HUP0303470A3 (en) | 2005-10-28 |
Family
ID=8560689
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HU0303470A HUP0303470A3 (en) | 2001-03-09 | 2002-03-08 | Oxygen-free copper alloy and its use |
Country Status (11)
Country | Link |
---|---|
US (1) | US20040096353A1 (en) |
EP (1) | EP1373588A1 (en) |
JP (1) | JP2004538362A (en) |
CN (1) | CN1496416A (en) |
BR (1) | BR0207879A (en) |
CZ (1) | CZ20032372A3 (en) |
FI (1) | FI113061B (en) |
HU (1) | HUP0303470A3 (en) |
PL (1) | PL363969A1 (en) |
SK (1) | SK11512003A3 (en) |
WO (1) | WO2002072901A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009024132A2 (en) * | 2007-08-21 | 2009-02-26 | Prymetall Gmbh & Co. Kg | Cable having a coaxial design for transmitting high-frequency signals and method for producing such a cable |
ITUA20163211A1 (en) * | 2016-05-06 | 2017-11-06 | De Angeli Prod S R L | ELECTRIC CONDUCTOR FOR ELECTRIC WINDINGS, ESPECIALLY FOR CONTINUOUS TRAVEL CABLE |
EP3622094B1 (en) | 2017-05-10 | 2021-07-28 | Haldor Topsøe A/S | A process for reducing the content of oxygen in metallic copper |
CN111549254A (en) * | 2020-04-29 | 2020-08-18 | 铜陵有色金属集团股份有限公司金威铜业分公司 | Oxygen-free copper-based microalloy and preparation method and application thereof |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FI40237B (en) * | 1966-05-04 | 1968-07-31 | Outokumpu Oy | |
US4059437A (en) * | 1975-07-02 | 1977-11-22 | Phelps Dodge Industries, Inc. | Oxygen-free copper product and process |
US4233067A (en) * | 1978-01-19 | 1980-11-11 | Sumitomo Electric Industries, Ltd. | Soft copper alloy conductors |
US4311522A (en) * | 1980-04-09 | 1982-01-19 | Amax Inc. | Copper alloys with small amounts of manganese and selenium |
JP2726939B2 (en) * | 1989-03-06 | 1998-03-11 | 日鉱金属 株式会社 | Highly conductive copper alloy with excellent workability and heat resistance |
-
2001
- 2001-03-09 FI FI20010473A patent/FI113061B/en not_active IP Right Cessation
-
2002
- 2002-03-08 PL PL02363969A patent/PL363969A1/en not_active Application Discontinuation
- 2002-03-08 WO PCT/FI2002/000184 patent/WO2002072901A1/en not_active Application Discontinuation
- 2002-03-08 JP JP2002571950A patent/JP2004538362A/en not_active Abandoned
- 2002-03-08 SK SK1151-2003A patent/SK11512003A3/en unknown
- 2002-03-08 HU HU0303470A patent/HUP0303470A3/en unknown
- 2002-03-08 US US10/471,191 patent/US20040096353A1/en not_active Abandoned
- 2002-03-08 CN CNA028062434A patent/CN1496416A/en active Pending
- 2002-03-08 CZ CZ20032372A patent/CZ20032372A3/en unknown
- 2002-03-08 EP EP02703649A patent/EP1373588A1/en not_active Withdrawn
- 2002-03-08 BR BR0207879-1A patent/BR0207879A/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP1373588A1 (en) | 2004-01-02 |
CZ20032372A3 (en) | 2003-12-17 |
PL363969A1 (en) | 2004-11-29 |
FI20010473A0 (en) | 2001-03-09 |
US20040096353A1 (en) | 2004-05-20 |
BR0207879A (en) | 2004-03-02 |
JP2004538362A (en) | 2004-12-24 |
FI113061B (en) | 2004-02-27 |
HUP0303470A3 (en) | 2005-10-28 |
CN1496416A (en) | 2004-05-12 |
SK11512003A3 (en) | 2004-04-06 |
FI20010473A (en) | 2002-09-10 |
WO2002072901A1 (en) | 2002-09-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FD9A | Lapse of provisional protection due to non-payment of fees |