HUE046900T2 - Solder pump - Google Patents

Solder pump

Info

Publication number
HUE046900T2
HUE046900T2 HUE16180008A HUE16180008A HUE046900T2 HU E046900 T2 HUE046900 T2 HU E046900T2 HU E16180008 A HUE16180008 A HU E16180008A HU E16180008 A HUE16180008 A HU E16180008A HU E046900 T2 HUE046900 T2 HU E046900T2
Authority
HU
Hungary
Prior art keywords
solder pump
solder
pump
Prior art date
Application number
HUE16180008A
Other languages
Hungarian (hu)
Inventor
Simon Hame
Richard Kressmann
Original Assignee
Ersa Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ersa Gmbh filed Critical Ersa Gmbh
Publication of HUE046900T2 publication Critical patent/HUE046900T2/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K44/00—Machines in which the dynamo-electric interaction between a plasma or flow of conductive liquid or of fluid-borne conductive or magnetic particles and a coil system or magnetic field converts energy of mass flow into electrical energy or vice versa
    • H02K44/02—Electrodynamic pumps
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K44/00—Machines in which the dynamo-electric interaction between a plasma or flow of conductive liquid or of fluid-borne conductive or magnetic particles and a coil system or magnetic field converts energy of mass flow into electrical energy or vice versa
    • H02K44/02—Electrodynamic pumps
    • H02K44/06—Induction pumps

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)
HUE16180008A 2015-10-21 2016-07-18 Solder pump HUE046900T2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102015220514.2A DE102015220514A1 (en) 2015-10-21 2015-10-21 solder pump

Publications (1)

Publication Number Publication Date
HUE046900T2 true HUE046900T2 (en) 2020-03-30

Family

ID=56497589

Family Applications (1)

Application Number Title Priority Date Filing Date
HUE16180008A HUE046900T2 (en) 2015-10-21 2016-07-18 Solder pump

Country Status (6)

Country Link
US (1) US10166619B2 (en)
EP (1) EP3160023B1 (en)
CN (1) CN107020433B (en)
DE (1) DE102015220514A1 (en)
HU (1) HUE046900T2 (en)
PL (1) PL3160023T3 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016118789A1 (en) * 2016-10-05 2018-04-05 Ersa Gmbh soldering device
CN112260513A (en) * 2020-09-21 2021-01-22 西安交通大学 Integrated permanent-magnet liquid metal electromagnetic pump

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2099593A (en) * 1935-04-12 1937-11-16 Buderus Eisenwerk Process for refining or separating electrically conductive liquids
US2915973A (en) * 1953-08-18 1959-12-08 Jacquelyn M Findlay Apparatus for pumping liquid metal
US3038409A (en) * 1960-04-15 1962-06-12 United Aircraft Corp Eddy current magnetic liquid metal pump
US3767102A (en) * 1969-12-05 1973-10-23 Gen Electric Apparatus for soldering electrical leads to terminals on a core and coil assembly
GB1325403A (en) 1970-10-20 1973-08-01 Heberlein & Co Ag Soldering appliance
US3941088A (en) * 1972-10-31 1976-03-02 Csongradmengyei Tanacs Vegyesiparm Szolgaltato Vallalat Standing wave metallizing apparatus for coating a substrate with molten metal
JPS62142066A (en) * 1985-12-14 1987-06-25 Sukegawa Denki Kogyo Kk Molten metal supplying device using electromagnetic pump
EP0366790B1 (en) * 1987-07-09 1993-03-17 Toshiba Kikai Kabushiki Kaisha Molten metal feeder
JPH01129760A (en) * 1987-11-12 1989-05-23 Toshiba Mach Co Ltd Electromagnetic pump
US5009399A (en) * 1988-10-28 1991-04-23 Bykhovskij David G Device for transfer of molten metal
US5080559A (en) * 1990-01-23 1992-01-14 The United States Of America As Represented By The United States Department Of Energy Liquid metal electric pump
US5240382A (en) * 1990-12-17 1993-08-31 Kanazawa University Converged magnetic flux type intense magnetic field electro-magnetic pump
JPH05161340A (en) * 1991-11-21 1993-06-25 Ishikawajima Harima Heavy Ind Co Ltd Molten metal circulating pump
EP0849023B1 (en) * 1996-06-11 2002-04-03 Kabushiki Kaisha Tamura Seisakusho Brazing apparatus
KR100504404B1 (en) * 1996-06-11 2005-11-01 가부시키가이샤 다무라 세이사쿠쇼 Soldering Equipment
US5981922A (en) * 1996-06-11 1999-11-09 Kabushiki Kaisha Tamura Seisakusho Brazing apparatus having electromagnetic induction pumps for moving a brazing filler metal in contact with a workpiece
WO2000028113A1 (en) * 1998-11-10 2000-05-18 Integrity Technologies, Llc Method of generating aqueous silica network particles and compositions including the silica network particles
US6726082B2 (en) * 2001-11-01 2004-04-27 Nihon Den-Netsu Keiki Co., Ltd. Soldering apparatus
JP5052486B2 (en) 2002-08-15 2012-10-17 株式会社デンソー Adsorbent
JP2007074837A (en) * 2005-09-08 2007-03-22 Sukegawa Electric Co Ltd Induction type electromagnetic pump for liquid metal
US20070068994A1 (en) * 2005-09-28 2007-03-29 Nihon Den-Netsu Keiki Co., Ltd. Soldering apparatus
JP5245172B2 (en) * 2007-11-21 2013-07-24 独立行政法人日本原子力研究開発機構 Magnetic field rotating electromagnetic pump with leveling magnetic field formation mechanism
CN101382153B (en) * 2008-04-10 2011-06-15 李宸 Air-cooled type aluminium pad permanent magnet pump
US8267669B2 (en) * 2008-05-19 2012-09-18 Hazelett Strip-Casting Corporation Magnetic induction pump
JP5546974B2 (en) * 2010-04-07 2014-07-09 株式会社ヂーマグ Non-ferrous metal melt pump and melting furnace system using the same
CN102562513A (en) * 2010-12-17 2012-07-11 中国科学院理化技术研究所 Convolute accelerating pump used for driving conducting fluid to flow
CN202334245U (en) * 2011-11-28 2012-07-11 上海大学 Permanent magnet electromagnetic pump in rotating magnetic field
CN102806398A (en) * 2012-08-17 2012-12-05 宁波市瑞通新材料科技有限公司 Electromagnetic pump for pumping liquid brazing filler metal
GB2515475B (en) * 2013-06-21 2016-08-31 Emp Tech Ltd Metallurgical apparatus
CN204221162U (en) * 2014-11-17 2015-03-25 龙仁福 A kind of electromagnetic pump of pumping liquid metal flux

Also Published As

Publication number Publication date
PL3160023T3 (en) 2020-03-31
EP3160023B1 (en) 2019-10-09
DE102015220514A8 (en) 2017-08-10
DE102015220514A1 (en) 2017-04-27
US20170113291A1 (en) 2017-04-27
CN107020433A (en) 2017-08-08
US10166619B2 (en) 2019-01-01
CN107020433B (en) 2019-12-24
EP3160023A1 (en) 2017-04-26

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