CN204221162U - A kind of electromagnetic pump of pumping liquid metal flux - Google Patents
A kind of electromagnetic pump of pumping liquid metal flux Download PDFInfo
- Publication number
- CN204221162U CN204221162U CN201420689700.1U CN201420689700U CN204221162U CN 204221162 U CN204221162 U CN 204221162U CN 201420689700 U CN201420689700 U CN 201420689700U CN 204221162 U CN204221162 U CN 204221162U
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- mixed flow
- flow chamber
- solder
- pump
- liquid metal
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Abstract
The electromagnetic pump of pumping liquid metal flux, comprising: solder trough, mixed flow chamber, Nozzle combination, pump ditch, open core, magnet exciting coil; Arrange mixed flow chamber at the middle part of solder trough, the inner space of solder trough is divided into exocoel and inner chamber by the chamber wall in mixed flow chamber, arranges Nozzle combination on the top in mixed flow chamber; The bottom of the inner chamber in mixed flow chamber is communicated with the upper port of pump ditch, and the lower end of pump ditch is communicated with the exocoel being arranged in solder trough; Open core is vertically nested on pump ditch, and magnet exciting coil is sleeved on the bottom lateral column of open core; When after magnet exciting coil incoming transport voltage, in the opening air gap of open core, excitation is played magnetic flux distribution, make the liquid metal soft solder material in pump ditch stressed, liquid metal soft solder material upwards flows in the inner chamber in mixed flow chamber, after the mixed flow of mixed flow chamber, form the overflow ripple of liquid metal soft solder material in the exit of Nozzle combination.This electromagnetic pump improves quality of welding spot and the reliability of abnormity perforation components and parts.
Description
Technical field
The utility model relates to a kind of electromagnetic pump of pumping liquid metal flux, is related specifically to when to weld a small amount of perforation abnormity components and parts on the printed circuit board of double-sided high density Hybrid assembling, the electromagnetic pump of pumping liquid metal flux.
Background technology
Prior art is when solving the problem of welding a small amount of abnormity perforation components and parts (as connector, transformer, relay, electrolytic capacitor etc.) on high-density printed circuit board, solder masks plate is normally adopted to avoid the components and parts on printed circuit board face to touch scaling powder and liquid solder, but these solder masks plates have impact on the even preheating of populated circuit board, add the residual of pollution on populated circuit board and scaling powder, in addition, the solder flowing of its disorder result also in the increase of weld defect; Also have in prior art and to adopt electric iron manual welding, due to a good welding procedure, be difficult to reappear completely in manual welding, the subjective ability of operator because it places one's entire reliance upon, welding result is also subject to the high temperature of solder horn and the impact of wearing and tearing, bad process repeatability, makes manual welding be regarded as affecting the hidden danger of quality, will avoid adopting in the assemble printed circuit boards field requiring high-quality and high reliability as far as possible.
Utility model content
The purpose of this utility model is: for the welding quality existed when high-density printed circuit board welding a small amount of abnormity perforation components and parts and integrity problem, a kind of electromagnetic pump of pumping liquid metal flux is provided, the liquid soft solder local overflow ripple that it is formed, welding resistance template can be replaced and overcome the problem existing for welding method such as manual electric iron soldering appliance, thus improve quality of welding spot and the reliability of abnormity perforation components and parts.
The utility model is realized by following technical proposals: the electromagnetic pump of the pumping liquid metal flux related to, and is made up of solder trough, mixed flow chamber, flood nozzle combination, upper cover plate, pump ditch, electromagnet, heating in combination and nitrogen gas delivery-line.In solder trough, be provided with mixed flow chamber, solder trough internal capacity is separated into inner chamber and exocoel by it, has installed the flood nozzle combination that can produce little local overflow ripple above mixed flow chamber.Be provided with in the bottom of solder trough in trumpet-shaped pump ditch, the intracavity inter-connection in the horn mouth on pump ditch top and mixed flow chamber, the lower end of pump ditch is connected with the exocoel in solder trough by left and right changeover portion.Pump ditch is vertically embedded in the open core of electromagnet, and magnet exciting coil is vertically sleeved on the bottom of open core.Heating in combination is arranged in the surrounding outside solder trough, and nitrogen gas delivery-line is configured near Qian Bi limit, solder trough front end.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of the electromagnetic pump of the utility model pumping liquid metal flux;
Fig. 2 is the A-A profile of the electromagnetic pump of pumping liquid metal flux in Fig. 1;
Fig. 3 is the B-B profile of the electromagnetic pump of pumping liquid metal flux in Fig. 1;
Fig. 4 is the C-C profile of the electromagnetic pump of pumping liquid metal flux in Fig. 1;
Fig. 5 is the schematic diagram of the little local rectangle overflow ripple that nozzle produces.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the utility model embodiment, be clearly and completely described the technical scheme in the utility model embodiment, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
Please consult Fig. 1-Fig. 4 respectively, structural representation, A-A profile, B-B profile, the C-C profile of the electromagnetic pump of the pumping liquid metal flux provided for the utility model, this electromagnetic pump is combined (3), upper cover plate (4), pump ditch (5), open core (6), magnet exciting coil (7), left and right heating in combination (8), front and back heating in combination (9), inert gas carrier pipe (10) etc. formed by solder trough (1), mixed flow chamber (2), flood nozzle, in the present embodiment, inert gas preferred nitrogen.Mixed flow chamber (2) is provided with at the middle part of solder trough (1), the inner space of solder trough (1) is separated into exocoel (11) and inner chamber (12) by the chamber wall in mixed flow chamber (2), the arranged on left and right sides depth as shallow of exocoel (11), the front and rear sides degree of depth is dark.Bottom along the forward and backward dark limit of exocoel (11) is provided with left and right changeover portion (13), (14).Flood nozzle combination (3) that can produce local overflow ripple is provided with on the top of mixed flow chamber (2).The upper cover plate (4) with sealing is arranged on the top of solder trough (1), and solder trough (1) inner space and space outerpace are separated by it.The bottom of the inner chamber (12) in mixed flow chamber (2) is directly communicated with the upper port of horn-like pump ditch (5), and the lower end of pump ditch (5) is communicated with the exocoel (11) being arranged in solder trough (1) by left and right changeover portion (13), (14).Open core (6) is vertically nested on pump ditch (5), and magnet exciting coil (7) is sleeved on the bottom lateral column of open core (6).Left and right heating in combination (8) and front and back heating in combination (9) are close to the outer surface of solder trough (1) surrounding, to improve the efficiency of heating surface.Nitrogen carrier pipe (10) is arranged on the shallow avris of solder trough (1) interior forward end, and the input port of its nitrogen is arranged on the bottom of solder trough (1), and outlet is arranged on the top of nitrogen carrier pipe (10).
After the magnet exciting coil (7) of one-way communication electromagnet accesses the alternating voltage of certain amplitude and 50Hz frequency, in the opening air gap of open core (6), excitation is played the discrepant magnetic flux distribution of equal tool in phase place and locus, make the liquid metal soft solder material that acts in pump ditch (5) stressed.Stressed size enters to pump ditch (5) internal magnetic field active region, export between the difference of two squares of magnetic flux density be directly proportional.Stressed direction points to delayed magnetic flux by advanced magnetic flux.Refer to Fig. 5, for the schematic diagram of the little local rectangle overflow ripple that nozzle produces, under the driving of pump ditch internal magnetic field power, liquid metal soft solder material just upwards flows in the inner chamber (12) in mixed flow chamber (2), after mixed flow chamber (2) mixed flow, form the local overflow ripple of liquid metal soft solder material in the exit of flood nozzle combination (3).
The nitrogen accessed by nitrogen carrier pipe (10) lower port; first after molten solder heating in solder trough (1); overflow from nitrogen carrier pipe (10) upper end open again; be filled in the space between the liquid level of solder trough (1) liquid solder and upper cover plate (4); and extruded by the oxygen in it, thus the molten solder protected in solder trough (1) is not oxidized.Meanwhile; flow of warm nitrogen gas also can along the gap between upper cover plate (4) and Nozzle combination (3) outside wall surface; be close to the molten solder surface reverse flow of being fallen by Nozzle combination (3) top; molten solder on Nozzle combination (3) is wrapped in wherein; intercept its contacting with oxygen; protect by the crest solder of flood nozzle combination (3) overflow not oxidized; thus improve the wetability of the overflow solder on flood nozzle combination (3) top, improve welding quality.
According to the electromagnetic pump of a kind of pumping liquid metal flux that the utility model embodiment provides, the liquid soft solder local overflow ripple that it is formed, welding resistance template can be replaced and overcome the problem existing for welding method such as manual electric iron soldering appliance, thus improve quality of welding spot and the reliability of abnormity perforation components and parts.
The foregoing is only the preferred embodiment of technical solutions of the utility model, be not intended to limit protection domain of the present utility model.All within spirit of the present utility model and principle, any amendment done, equivalent replacement, improvement etc., all should be included within protection domain of the present utility model.
Claims (6)
1. the electromagnetic pump of a pumping liquid metal flux, it is characterized in that, comprising: solder trough (1), mixed flow chamber (2), Nozzle combination (3), pump ditch (5), open core (6), magnet exciting coil (7); At the middle part of described solder trough (1), described mixed flow chamber (2) is set, the inner space of described solder trough (1) is divided into exocoel (11) and inner chamber (12) by the chamber wall of described mixed flow chamber (2), arranges described Nozzle combination (3) on the top of described mixed flow chamber (2); The bottom of the inner chamber (12) of described mixed flow chamber (2) is communicated with the upper port of described pump ditch (5), and the lower end of described pump ditch (5) is communicated with the exocoel (11) being arranged in described solder trough (1); Described open core (6) is vertically nested on described pump ditch (5), and described magnet exciting coil (7) is sleeved on the bottom lateral column of open core (6);
When after described magnet exciting coil (7) incoming transport voltage, in the opening air gap of described open core (6), excitation is played magnetic flux distribution, make the liquid metal soft solder material in described pump ditch (5) stressed, described liquid metal soft solder material upwards flows in the inner chamber (12) of described mixed flow chamber (2), after described mixed flow chamber (2) mixed flow, form the local overflow ripple of liquid metal soft solder material in the exit of described Nozzle combination (3).
2. electromagnetic pump as claimed in claim 1, it is characterized in that, also comprise: left and right heating in combination (8), front and back heating in combination (9), the outer surface of described solder trough (1) surrounding is close in described left and right heating in combination (8), front and back heating in combination (9).
3. electromagnetic pump as claimed in claim 1 or 2, it is characterized in that, also comprise: upper cover plate (4), described upper cover plate (4) is arranged on the top of described solder trough (1), and the inner space of described solder trough (1) and space outerpace are separated by described upper cover plate (4).
4. electromagnetic pump as claimed in claim 3, it is characterized in that, also comprise: inert gas carrier pipe (10), described inert gas carrier pipe (10) is arranged on the shallow avris of solder trough (1) interior forward end, the input port of described inert gas carrier pipe (10) is arranged on the bottom of solder trough (1), and the delivery outlet of described inert gas carrier pipe (10) is arranged on the top of described inert gas carrier pipe (10).
5. electromagnetic pump as claimed in claim 1, it is characterized in that, exocoel (11) the arranged on left and right sides depth as shallow in described solder trough (1), both sides, the front and back degree of depth is dark.
6. electromagnetic pump according to claim 1, is characterized in that, described pump ditch (2) is in horn-like, and horn mouth upward.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420689700.1U CN204221162U (en) | 2014-11-17 | 2014-11-17 | A kind of electromagnetic pump of pumping liquid metal flux |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420689700.1U CN204221162U (en) | 2014-11-17 | 2014-11-17 | A kind of electromagnetic pump of pumping liquid metal flux |
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| Publication Number | Publication Date |
|---|---|
| CN204221162U true CN204221162U (en) | 2015-03-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420689700.1U Active CN204221162U (en) | 2014-11-17 | 2014-11-17 | A kind of electromagnetic pump of pumping liquid metal flux |
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| CN (1) | CN204221162U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107020433A (en) * | 2015-10-21 | 2017-08-08 | 埃莎股份有限公司 | Weld pump |
-
2014
- 2014-11-17 CN CN201420689700.1U patent/CN204221162U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107020433A (en) * | 2015-10-21 | 2017-08-08 | 埃莎股份有限公司 | Weld pump |
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