CN104032323A - Cleaning agent suitable for components after high-temperature welding - Google Patents
Cleaning agent suitable for components after high-temperature welding Download PDFInfo
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- CN104032323A CN104032323A CN201410084785.5A CN201410084785A CN104032323A CN 104032323 A CN104032323 A CN 104032323A CN 201410084785 A CN201410084785 A CN 201410084785A CN 104032323 A CN104032323 A CN 104032323A
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Abstract
A cleaning agent suitable for components after high-temperature welding is disclosed. The cleaning agent comprises following components by volume: 0.1-5.0% of an organic amine, 0.1-10.0% of a low-molecular-weight alcohol, 0.1-5.0% of a water-soluble alcohol ether auxiliary agent, 0.1-5.0% of a polymer auxiliary agent and 0.1-1.0% of an organic auxiliary agent, with the balance being deionized water. The cleaning agent has good effects for cleaning insulation varnish fusion pyrolysis products after welding at 320 DEG C or a higher temperature and for cleaning scaling powder solid residue, guarantees the quality of welding spots after welding and meets the requirements of environment protection. The cleaning agent is especially suitable for the electronic assembly industry, in particular, for cleaning of copper- and iron- based pins and enameled copper wires of electromagnetic components after welding adopting tin as a solder.
Description
[technical field]
The chemical method metallic substance the present invention relates to except electrolytic process cleans and oil removing, relates in particular to and comprises that the mixed solution of organic amine cleans or oil removing, particularly relates to electronic assemblies industry components and parts are implemented to 320 DEG C and the applicable clean-out system of above high temperature postwelding.
[background technology]
In electronic assemblies industry, components and parts used particularly must reach the Halogen standard that IEC 61249-2-21 specifies after electromagnetic component welding, require bromine, cl content to be less than respectively 900ppm, and the content summation of bromine and chlorine are less than 1500ppm; Weld rear ionic pollution degree according to IPC J-STD-001B standard-required, ionic pollution degree < 10.04 μ g.NaCl/sq.in(1.56 μ g.NaCl/cm
2).
Copper, iron-based stitch and enamel-cover copper conductor that prior art soldering processes often relate to electromagnetic component weld taking tin as solder, because wire is coated with insullac conventionally, are difficult to welding.Prior art mainly contains two kinds of modes for this type of welding: one is to improve pure tin furnace temperature, utilizes 320 DEG C and above high temperature that insullac melting is destroyed, and realizes the welding of element stitch and wire.Its shortcoming is, high temperature postwelding has a large amount of insullac residues, and causes soldering flux generation chemical transformation, solidify to form and be difficult to the residue removed.If cannot effectively clean, will have a strong impact on welding quality and follow-up use properties.Another kind is to use in advance laser technology that the insullac at wire bonds position is removed, expose immersed solder in 320 DEG C of pure tin stoves after copper conductor base material, but often the removal of insullac be not 100% clean, after also having the residual so that high-temperature soldering of part, have insullac residue, and after high-temperature soldering, the cured residue of soldering flux also must clean.The shortcoming of which also will be used specific installation, technical process complexity especially.
Prior art clean-out system, cannot effectively clean 320 DEG C and above high temperature postwelding insullac melting split product and soldering flux cured residue, repeated multiple times cleaning still cannot reach inspecting standard, and part clean-out system with an organic solvent, not only cannot reach the requirement of surface ion dustiness and the non-halogen standard of product, simultaneously also larger to environmental hazard.
Clean-out system provided by the invention, can solve the demand of prior art soldering processes to clean-out system, can ensure to weld rear solder joint quality, meet again environmental requirement, and the copper, iron-based stitch and the enamel-cover copper conductor that are specially adapted to electromagnetic component are implemented the cleaning of high temperature postwelding taking tin as solder.
[summary of the invention]
The technical problem to be solved in the present invention is to avoid above-mentioned the deficiencies in the prior art part and a kind of clean-out system that can effectively remove 320 DEG C and above high temperature postwelding insullac melting split product and soldering flux cured residue is provided, after cleaning, weldment surface meets Halogen standard, and ionic pollution degree is reduced to < 1.56 μ g.NaCl/cm
2level.
The technical scheme that the present invention solve the technical problem employing is, the applicable clean-out system of a kind of components and parts high temperature postwelding, comprise following component (by volume per-cent meter): organic amine 0.1～5.0%, low-molecular-weight alcohol 0.1～10.0%, water-soluble alcohol ether auxiliary agent 0.1～5.0%, pluronic polymer 0.1～5.0% and organic additive 0.1～1.0%, all the other are deionized water.
Described organic amine is quadrol, diethylenetriamine, triethylene tetramine, thanomin, diethanolamine, trolamine and dimethyl formamide, appoints and selects one or its at least two kinds of mixing.
Described low-molecular-weight alcohol is ethylene glycol, Virahol, propylene glycol and glycerol, appoints and selects one or its at least two kinds of mixing.
Described water-soluble alcohol ether auxiliary agent is ethylene glycol monobutyl ether, diethylene glycol monobutyl ether, propandiol butyl ether and triethylene glycol butyl ether, appoints and selects one or its at least two kinds of mixing.
Described pluronic polymer is polyoxyethylene glycol, modification polypropylene glycol and polyvidone, appoints and selects one.
Described organic additive is alpha-pyrrolidone, sherwood oil and hexanaphthene, appoints and selects one or its at least two kinds of mixing.
Described deionized water specific conductivity < 10 μ S/cm.
Described molecular weight polyethylene glycol is 200 ∽ 600.
Described modification polypropylene glycol is molecular weight 400 ∽ 800, and is formed with volume 1:4 mode modified poly by Diethylene Glycol and propylene glycol.
Described polyvidone molecular weight < 6000.
The preparation method of described clean-out system, comprises the steps:
1. under the envrionment temperature of 0 ~ 40 DEG C, deionized water is added in clean reactor;
2. add low-molecular-weight alcohol to stir;
3. add organic amine and pluronic polymer to continue to stir;
4. add successively remaining ingredient, be stirred to and mix;
5. stop stirring, leave standstill and filter.
The beneficial effect that clean-out system of the present invention comprises organic amine is, dissolves and peels off 320 DEG C and above high temperature postwelding soldering flux cured residue, and butt welding point tin layer and copper layer are corrosion-free, and water-soluble good, noresidue after washed with de-ionized water;
The beneficial effect that comprises low-molecular-weight alcohol is, cleans weldment surface electrolyte residues, water-soluble good, noresidue after washed with de-ionized water, ensure weldment clean after ionic pollution degree up to standard;
The beneficial effect that comprises water-soluble alcohol ether is: the solvability of auxiliary various components in deionized water, and the mixing uniformity of raising component, and butt-welding fitting metal level is corrosion-free, and water-soluble good, noresidue after washed with de-ionized water;
The beneficial effect that comprises pluronic polymer is: improve the wetting property on weldment surface, ensure the abundant cleaning of clean-out system butt-welding fitting solder joint;
The beneficial effect that comprises organic additive is: butt welding point insullac residue makes its Fast-swelling, accelerates its dissolving and peels off, and realizes Rapid Cleaning;
The use of deionized water can ensure that weldment surface is up to standard with regard to halogen-free environmental and surface ion degree of cleaning.
Compared with the existing technology, clean-out system of the present invention has following beneficial effect: after cleaning with described clean-out system, again through three grades of washed with de-ionized water, can reach ionic pollution degree standard-required, also without specific installation, technical process is simple, and solder joint corrosion can not occur, and can not cause detrimentally affect to operator and environment.
[embodiment]
Below in conjunction with 22 preferred embodiments that presented as this specification sheets end form 1 ∽ 5, the present invention is described in further detail.Wherein respectively this embodiment all comprises following component (by volume per-cent meter): organic amine 0.1 ∽ 5.0%, low-molecular-weight alcohol 0.1 ∽ 10.0%, water-soluble alcohol ether auxiliary agent 0.1 ∽ 5.0%, pluronic polymer 0.1 ∽ 5.0% and organic additive 0.1 ∽ 1.0%, all the other are deionized water, but content does not present in form.
Described organic amine is quadrol, diethylenetriamine, triethylene tetramine, thanomin, diethanolamine, trolamine and dimethyl formamide, appoints and selects one or its two kinds of mixing.
Described low-molecular-weight alcohol is ethylene glycol, Virahol, propylene glycol and glycerol, appoints and selects one or its two kinds of mixing.
Described water-soluble alcohol ether auxiliary agent is ethylene glycol monobutyl ether, diethylene glycol monobutyl ether, propandiol butyl ether and triethylene glycol butyl ether, appoints and selects one or its two kinds of mixing.
Described pluronic polymer is polyoxyethylene glycol, modification polypropylene glycol and polyvidone, appoints and selects one.
Described organic additive is alpha-pyrrolidone, sherwood oil and hexanaphthene, appoints and selects one or its at least two kinds of mixing.
Described deionized water specific conductivity < 10 μ S/cm.
The optimum weight scope of described polyoxyethylene glycol is 200 ∽ 600, can also be other molecular weight certainly.
Described modification polypropylene glycol optimum weight scope is 400 ∽ 800, and is formed with volume 1:4 mode modified poly by Diethylene Glycol and propylene glycol, can also be other molecular weight certainly, and other mode modified polies forms.
Described polyvidone optimum weight scope is < 6000, can also be other molecular weight certainly.
Conventionally the high-temperature soldering technique taking tin as solder: 320 DEG C of pure tin furnace temperatures, except 1 second insullac time, soak 1 second soldering flux time, 1.2 seconds scolding tin time.Clean respectively the weldments after the welding of 10,000 components and parts with the clean-out system of 22 preferred embodiments in form, the data that record with regard to its every effect after cleaning are shown in following form 7.From the data of form 6 and form 7, the circuit card that can reach 100% ratio after once cleaning with the clean-out system of 22 preferred embodiments is non-halogen.Qualification rate after standard surface ionic pollution degree once cleans is also very high, has reached more than 99.88%.Clean-out system of the present invention is splendid to a cleaning performance of insullac melting split product after 320 DEG C and above high-temperature soldering and soldering flux cured residue, need not repeated multiple timesly clean, and has improved cleaning efficiency.
The above embodiment has only been expressed the preferred embodiment of the present invention, can not therefore be interpreted as the restriction to the scope of the claims of the present invention; It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention; Therefore, all equivalents and modifications of doing with the claims in the present invention scope, all should belong to the covering scope of the claims in the present invention.
Claims (10)
1. the applicable clean-out system of components and parts high temperature postwelding, comprise following component (by volume per-cent meter): organic amine 0.1 ∽ 5.0%, low-molecular-weight alcohol 0.1 ∽ 10.0%, water-soluble alcohol ether auxiliary agent 0.1 ∽ 5.0%, pluronic polymer 0.1 ∽ 5.0% and organic additive 0.1 ∽ 1.0%, all the other are deionized water.
2. clean-out system as claimed in claim 1, described organic amine is quadrol, diethylenetriamine, triethylene tetramine, thanomin, diethanolamine, trolamine and dimethyl formamide, appoints and selects one or its at least two kinds of mixing.
3. clean-out system as claimed in claim 1, described low-molecular-weight alcohol is ethylene glycol, Virahol, propylene glycol and glycerol, appoints and selects one or its at least two kinds of mixing.
4. clean-out system as claimed in claim 1 ,-described water-soluble alcohol ether auxiliary agent is ethylene glycol monobutyl ether, diethylene glycol monobutyl ether, propandiol butyl ether and triethylene glycol butyl ether, appoints and selects one or its at least two kinds of mixing.
5. clean-out system as claimed in claim 1, described pluronic polymer is polyoxyethylene glycol, modification polypropylene glycol and polyvidone, appoints and selects one.
6. clean-out system as claimed in claim 1, described organic additive is alpha-pyrrolidone, sherwood oil and hexanaphthene, appoints and selects one or its at least two kinds of mixing.
7. clean-out system as claimed in claim 5, described molecular weight polyethylene glycol is 200 ∽ 600.
8. clean-out system as claimed in claim 5, described modification polypropylene glycol is molecular weight 400 ∽ 800, and is formed with volume 1:4 mode modified poly by Diethylene Glycol and propylene glycol.
9. clean-out system as claimed in claim 5, described polyvidone molecular weight < 6000.
10. a preparation method for clean-out system as claimed in claim 1, comprises the steps:
1. under the envrionment temperature of 0 ~ 40 DEG C, deionized water is added in clean reactor;
2. add low-molecular-weight alcohol to stir;
3. add organic amine and pluronic polymer to continue to stir;
4. add successively remaining ingredient, be stirred to and mix;
5. stop stirring, leave standstill and filter.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410084785.5A CN104032323B (en) | 2014-03-10 | 2014-03-10 | The cleaning agent that components and parts high temperature postwelding is suitable for |
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|---|---|---|---|
| CN201410084785.5A CN104032323B (en) | 2014-03-10 | 2014-03-10 | The cleaning agent that components and parts high temperature postwelding is suitable for |
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| CN104032323A true CN104032323A (en) | 2014-09-10 |
| CN104032323B CN104032323B (en) | 2016-08-31 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104294305A (en) * | 2014-09-30 | 2015-01-21 | 江苏中容铜业有限公司 | Quickly prepared copper material decontaminant |
| CN106216883A (en) * | 2016-07-19 | 2016-12-14 | 徐州工程学院 | A kind of for Cu Mg Sn Fe composite nano materials laser scaling powder and preparation method thereof |
| CN111117816A (en) * | 2019-12-31 | 2020-05-08 | 苏州市晶协高新电子材料有限公司 | Novel welding slag cleaning agent and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030228997A1 (en) * | 2002-06-07 | 2003-12-11 | Kyzen Corporation | Cleaning compositions containing dichloroethylene and six carbon alkoxy substituted perfluoro compounds |
| CN102108518A (en) * | 2009-12-25 | 2011-06-29 | 安集微电子（上海）有限公司 | Anticorrosive cleaning solution for metal |
| CN102482625A (en) * | 2009-09-03 | 2012-05-30 | 荒川化学工业株式会社 | Cleaning agent for removal of, removal method for, and cleaning method for water-soluble, lead-free solder flux |
-
2014
- 2014-03-10 CN CN201410084785.5A patent/CN104032323B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030228997A1 (en) * | 2002-06-07 | 2003-12-11 | Kyzen Corporation | Cleaning compositions containing dichloroethylene and six carbon alkoxy substituted perfluoro compounds |
| CN102482625A (en) * | 2009-09-03 | 2012-05-30 | 荒川化学工业株式会社 | Cleaning agent for removal of, removal method for, and cleaning method for water-soluble, lead-free solder flux |
| CN102108518A (en) * | 2009-12-25 | 2011-06-29 | 安集微电子（上海）有限公司 | Anticorrosive cleaning solution for metal |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104294305A (en) * | 2014-09-30 | 2015-01-21 | 江苏中容铜业有限公司 | Quickly prepared copper material decontaminant |
| CN104294305B (en) * | 2014-09-30 | 2016-06-29 | 江苏中容铜业有限公司 | A kind of can the copper material detergent of rapid preparing |
| CN106216883A (en) * | 2016-07-19 | 2016-12-14 | 徐州工程学院 | A kind of for Cu Mg Sn Fe composite nano materials laser scaling powder and preparation method thereof |
| CN106216883B (en) * | 2016-07-19 | 2018-02-13 | 徐州工程学院 | One kind is used for Cu Mg Sn Fe composite nano materials laser scaling powders and preparation method thereof |
| CN111117816A (en) * | 2019-12-31 | 2020-05-08 | 苏州市晶协高新电子材料有限公司 | Novel welding slag cleaning agent and preparation method thereof |
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| CN104032323B (en) | 2016-08-31 |
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