HUE032381T2 - Eljárás nemesfémbevonat kialakítására fémes hordozón - Google Patents

Eljárás nemesfémbevonat kialakítására fémes hordozón Download PDF

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Publication number
HUE032381T2
HUE032381T2 HUE15709091A HUE15709091A HUE032381T2 HU E032381 T2 HUE032381 T2 HU E032381T2 HU E15709091 A HUE15709091 A HU E15709091A HU E15709091 A HUE15709091 A HU E15709091A HU E032381 T2 HUE032381 T2 HU E032381T2
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legalább legalább
substr
noble
silver
primer
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HUE15709091A
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English (en)
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Horst Neddermann
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Aumann Gmbh
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Publication of HUE032381T2 publication Critical patent/HUE032381T2/hu

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/43—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/745—Apparatus for manufacturing wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/4554—Coating
    • H01L2224/45599—Material
    • H01L2224/456—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45638—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45639—Silver (Ag) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Catalysts (AREA)
  • Chemically Coating (AREA)
  • Acyclic And Carbocyclic Compounds In Medicinal Compositions (AREA)

Description

MK CAI. COATING ÛM III ΓΛΙ-LIC SÜ WfRA'TF
SaiMKIALBŒ
lle:'tev^isa· Attife « ι»ΜΐΙ^:Ιίκ$κ«ά^ «.«sM« xoefo! teaihipg&t im? une region of a jtretaJli· sotelrste more of parent Plate. L
iMQRA&Z
Mfoteovm M&mÈâ&'Mmd fc eskkk« te ioptebiÄ^te the« svspecthc tcaeuvity aad the reoteltfous surrotstteteg them. lit .Ältest te: «sing sotateÄdtef M meiah ot ueusfck· alloys these métáin piuvided «i «Jtettef·
Its this cotttext, metals used te teetoelecuustere su she forts of teste wire hove ;<; etess extensive dotsitesis particularly as s result of these electrical corsducciuty. Boat! wire is thus este by way of example ist the marmiseture of microchips. it setves h*rs to emsteiitk she scotching circuit trttegreUfo therein or( by way of ï \.>mpkr, a worncondueto? dome« \Mth she i vUMt'g et she stoeseehtp. Au electrically < eteuctive connection b stehkved te this way between tits outer terminals of the microchip and its interns! structure. : Attempts are thereby stade to achsc-se tee smallest possible cross-ssetett ia the baud vor« to order that she required connect tests can tas est y be made so the narrowest possible space, 1rs order to proven! the wire Kxukiag during the nasesably, vdueh is mainly undertaken at high speed, the mstetels used for the tend. li; spute at the same time have no brittle or *ο If properties.
Where hood wires were preferably formed (Vorn gold, as a resolfpf dsipg mmem! costs these teitehow mainly made front «vre cost-estetive noterais such »a pesstelv cupper, teomteum, stiver or other electrically conductive metals, la addinon. bond vim made of gold or stiver curt teve so up to 50% lower tsrechoteessl streisgth compared to those mad« tern more cost etVctive reatesnists lo. ixarttcttW the low mechanicsd strength Of bond wares of gold or silver osa lesd to problems dadog subsequent prpeessiftg. Thus bund wires of this kind only show low processing speeds. la addition, bond acres of gold or «her whan its isterei «4 oxygen aïs» teve p tetsdenoy for Oxidation which can ultimately lead to undssxred hoe losses etetensting hi eotteet: pphtetss> 1st order to prevent this It is therefore sseeessary to apply a suitable coating, for tlsise prpteoisre ouki^peri fee fosrinedoos ioetallic substrate - by way of example sxt the form «fa core wire --- teougli diteteth ssethoda.
ItessacosstlssM forrnaimissteitgihotid who 'm'kmmx foam the;Wi> 2013;fr?te4>s a!> for:fols tte use: of a pore sä of silver or « säo alloy: fa proposed1 which is coated; with si kast otre of the matesMa goid, palladium. platinum or rhodfomi ásmsíaltetsgby«: her® a eoro wire ofot^per orre copper siteyvis tsseil which is coated with orte of thb:ts»t«Ä^ällölth::3^^^ rfeod;foso, sridipfo or rsttefoorsx 11¾ fetthersttofe prepttsedJÉefodóíSuaf 'dfo sore wire m#spfoaforstí.-witNg'·' fociig foto|rersrere ss shovelltatíöf tte core wire: sroddylstss: foplntl iÄkrsipre is below üd'Ö'f foe «sfe Ä Tte forihoc teaslan of tte htolldftstttdfotial for coalitg Äfodiiktheretore he above that of tte core ware. The coating thus produced hits 1 itighsfoslsfoocc fo ofodh iÄtSilfoh I« a restsptpture .tsxgr bvrweett tire «eking tempern tute o: the core :wifs::apdiite:t: of :t:te Oiatæ:réd%r diteitigi hitóöUS soittiog rtiefotes are fts.rilsersss>sp provuk-d for carrying out the seating of the- core wsre. The coatistg:: esti ssettrdhigly he tæÉssaken hy sxseaos of dcvttopktiug fgalvaïucally} or eurresstiess ss well as by snrerersion platine. vapout depwaituO, cathode atotnreation (spmtermg). metal-orgauîc dissolution. mctai-vdi dissolution, metal-ligand di.-wotunon, drenu&amp;l spraying.. conversion eoatutg. thermal decomposition, pyrotysw, Iherraolysis, ukravtolet radiation a«d dissolution as vari) as »tittering οi'-nattopanrietes, A thermal aka-treatment of the thus coated core vom k than carried ou; is a protective atmosphere is a temperature range írom '(K)® to bÔÔ* >' T ha ose of a coîc vue ci silver, &amp; silver ahoy sr odtet ekretncally ;.axîd conductive sobk' metals kas also me orreb equally high materia! costs. A dear cost reduction can indeed be achieves! by using copper or a csöpp;.'}' alloy for the core wire, but the methods and materials known for coating same stril also have so pari drawbacks ns respect of then resistance as regards oxidation. forming e siket coating os metallic substrates is furthermore also known in the prior art, Ííere during Ép ydgrre of a galvanic proem nidtvKlusl solid panicle? of silver (Ag) are deposited on the metallic substrate,.
Galvanic processes of tins. kind are to be regarded as evmpiivaied and lengthy pamcniatiy in connection with wire products which are being continuously processed. Furthermore the silver coating formed m this way cannot bet regarded as sand'actory by wav of example in respect s>f its resistance ;o oxidation. mzms&amp;miim
Against this background the subject of the present iav®ötiö® JS'ib hnprevriSiö' method for iortaihg a noble metal coating, preferably a ?sbrer coaling, tsa.a.nsetaÖtoubater^^.södh^ Üt® wit®: product thus: produced: has a high résistance tes oxide iomtaikm.
Tins is achieved % n medred having the· leshtres of paient elakn d,
Advantageous dtriher developments of dm basse sonsspi of the invetrikm ferm tire suigeet of ito respective dependent paretU claims.
According to tks anretlmd is disk prt^osed fer&amp;ming a treble metál eoatingsm at least: one region of a metallic substrate, The noble metal eosimg can preferably be a silver soatfeg, copper coating, palladium coating, gold coating: or moke! eoslmg. fie metallic sabsimfe can be ás pártreulár a methllfe wire or a string product. The tsyestfen then conidÄ theMiowäsg step; ·· preheating ke region of the substrate to he coated, » snore paÄknrly applpng, with or without contact, a nobie sretal sofetson to the prireated region of the solution can preferably bea sdyer solumm, - firing she noble- meal. solution, preferably the silver solution, applied to the substrate, - cooling the subsirstp winch has heest coated with the fired noble mphi! solution, preferably silver solution.
Contactless applying means that no application device is brought into contact kith the wire or taring Object,, s.g. through a spraying process. Contact applying means that contact is made b#y®Pd the application device and the string object or wire "Applying’' tv to atpip within the scope of this ditmlpsitre it general term to ipelude spreading or depositing coating tpaterisk
Fifing serves basically lo dry the noble tack! solution on dtp snlAtraie; Myitig mÄ» here dtatip refcb cere fetid -eonk0ue^:;:pif^;:Sife vaporised st> that substantially only the noble metal remains. This drying is ettmed; out at rempetiribes M preferably so more than .300 to· S00®€ atid dspbnds ohi 3he evaporation temperature of the kthsktrees sbetamed in tire noble metal solution and the specific heat capacity of the snbstiaie. if thisiis by wity ni" érampie able to condtut nttd store the heat satisfactorily, the« lower drying temperatures are sufficient. Tlx? drying is earned out ;ss;c«ydsRg k is« ííív^«íss>sí in a temperature range which lg bkpiy bedpw ifes iensperafetre range whhds is reqtrirckl ihr hsrekning end smkring the die- substrate after drying Tbe tssnpmtnrase more typk-a&amp;y Is tbe fâtmg.or drying sfsge. tk ai îoa&amp;t 8ô-iè iM% pteferably m to }<WC below the temperature which is reVfuirad for dis thesasal sfteheatraem Mibwhrg the preferably active. «bas pnratsäs^xmtroiiedrrawätHgi
Afkr «oolsng. the strbsûate whtelt. is coated with she tired nofek medal solntkng gralbrably a silver solution. goki solution. copper sohditm. palladium selnöo« or »tefcei· sofctlioa.. is dor the thermal after dreabam, A temperature of 4ÖÖI» böO* Ç k tnora%picaliy used to? feosifetg ffer The stipe treatment. depending os the choree of temperature m the drag stage
Th« partkular advantage of «he method aeeonfeng to the to«^^.:Öes:Wls!ly.%'#ei:äse':«i;'ä rtohk metal solution. Particularly preferred wühln dre scop« of the ibv^Äa%rillv^:-^lÄsas:|» eaeâ;McÉe rtofek metal solution. Th« «ss be applied Is a simple rasmser quasieotdianoosiy iö sohskak before dk latter passes through the farther method steps firing, cooling, preferably down ïo menti ksîpessbkppsfjore ^aMÿ M 2Ö lo 25k', and tbc Tb« eoelkg to moss tempraiore is pt&amp;hfsffy: alvsstsgooss since: :¾¾ thus: artsursi: Mie >miÊm coakd with ooik : metal is ski dássigsd wbm ibs wise or Âtg sislodsi is gsided iîs itrifc path through the eoPlrsg device üioii^ps^sdsí': .jeolhsa»: Tik alter-»eaun«»« skp through hedbng is nbsohtudy aebsi&amp;äfyÄ $β. indhktpPal solution would already N ceœpkteiy Trod during dk fírrng stage; thus the noble mPaTwtUsId pneöate savmdly The desired closed nofek metál ihn «ősid however thereby műibe pcsáeeeb. "fests have shows that s nen-dosed solde
Tik substrate, particularly kit îs made of «op^ kbo hasdiibi^yiid sev««ÄÖf. «vos at high tpogemures. wisch it- redősed by faovidk^d-^^ÄSi^illBi^he«? treatment.
Compared wnh galvaaie processes &amp;» possibility mdses Mid of forming « noble matai édsbhi|: :öb s tneialtic wnwirate which incurs only low costs, A silver coating is preferably termed is this way.
Through the.possible entiles» oykmliott tbc ibmsbott of tbs sobk rstciai coaUog, prtdcstbiy in the ίοπρ of a stiver eosiisig, can ibnbertaore bo achieved st tbc s&amp;ortcst time wbkh dearly redraws as a whole the psxketirjs costs for sseh ptMbfk, wisch .have to he-'be^^.;^'Ét^^bf.#:;pphiitÉtlg:4évtce and a ftnsg device as wdif äs a ebbiing devkc end an alterbarning devise used ibr ||é themal ttllcrdreatstem, clear advasfages is terms .of-energy are aehicskd. This is particukriy the case agamat the bacbgrötmá Ustti gaKanic· bslhs require conttsuous beating as s result of their mass which bus fo ha bsfted. Tetsponsily switching off the heat supply requires lodger standstill tsnes bet? until diese cas be brought tip again to operating temperatures. The devices which ate to be designed small compared to dus in the sense of the inventive ides for heating and cooling can then fee switched off tossporanly without problem since these can be brought to the operai ing température agatit wnhirs die shortest tune.
With regard to the nntnnlacmre of wire ptrahicts coated m this way the devices tequhed fot inrpl>sînomtng the insgmtion can funhentîore iiave small distiensions. The metalhc vnfesirate eaa fee ttans|gatet| fc®e In the fora of a wire orábing object in the auikss tgseraffbn through tiis ^divrdua|.,á^ke^t^^:'^i|i|p 'S ®"£0l»du dH < ' ·> Ο ΛΊΚΊ' U i »SSXjV't S ΐΛν-i" i täl 0><iV tiX 'V» S 0>\ "· SO h*ve V. 'S ik igu fesy potÄfe tieilac sions of foiling tocher with small tatiira ;;ln a pïx?tèrr^si further development of the measures tsecoediog te the invention H is proposed that tbc pteheasitig of the metallic substrate cas; be usrried ont at s temperáim® of 350;iC to 40Û*€. Preheating the substrate serves, primarily here to remove any undo red tief·.··>. > s a the wsiara of Λο irabvtrax II ev >.aa N by wa> «f caantpSsx ods, greases anchor lubricants. These at® ntmeakxi aude-r burned as a ra-etit of da-: intended temperature rasige. Furthermore the metalik substrate is made correspondingly soil as it is heated, hi this os y sts surfera can he prepát ed fix the subsequent application of the sixer solution, The material of the substrate soil moreover become correspondingly softer through the supply of fern, which Ihcilltsses by way of example sts rast·;."·sory sox hameal deflection.
According tr> an advantageous further development the timte, of the noble metal '•oissisou, ptefetsabiy a. stiver solution, previously applied to at least oat? to tara- of the substrats can be carried mu m a temperature of 500T to hUtTC. This temperature range has proved ideal Som lests is order to dissolve the solvesi costumed s.i the ix '· e >ee it w L ra> ' psvh xtbl> tbs vo^est ·. m t i> eo ox the mb. et »o a,a s , firisg the noble tnevti volutiou is preferably earner! oat at a temperature below the afexxreasmew temperature it is preferred Sere that tite temperature tot firtrg χ roughly bet uses do and feoX , p.eterahk between 100 aud I50!€ lower than the after-treatment temperature. 1st this way it ts ensured tb&amp;t tite noble stetui coating η. spread homogeneously over the substrate end ttusrepmtictdafiy dbiostpieisiy hardened msating ia harmed already as the noble tnefet coating tines. According to a of the method according to the invention it is proposed that solution, to a surface area of fife metallic substrate erase carded out by Its contact with an appifeatios means.
By a contitct of this kind is^ mpauf hdiÄÄ^s®opaof:tfes;fe of &amp;g:substrate witbihe applfeaboa moans* by way ofmanpk dtraogh a eosstast or a temporary entitást. Particularly prafemxi ties® is a eemsfani omtiacs during which the application moans- and the sdhirafe at® moved t&amp;hëm^-Ksm-meÉsSÎi Tbe: a^lleaioo sseass sas advantageously be losady Used te-üterys^il^bÄ substrateststdast of the appdeabo® raetms. in eotrsesbos: wiib the tnanufsetura of wit® products or string goods coated ht this xvay the raatxtetive stibsirate can then be draw® contimKHtsiy past, the g|spiieaidb^eaas or can be drawn Ibrou^t saom As a result through dse contact isetwees ftte appheeifes ipessss and tbs substrate a phefitsMy ctMitruous deposit of te noble tnutst.i ssdntonu pmtenshfe tite stiver solution. cuUsiutaec area of tlte aui-sttste tv dcUntf i he sppltcatsoo tuearts osas have for this b v wav of example au efesne K«dv Otis «an either be dxetlly attached or by way of example can be arranged roiatabfe in kh trimmer--.of u robor. Ute elastic boriv snust ihett have tin at lettst temporary storage esqtacity for the noble ruerai aoiution, which is preferably a silver solution, so that: ibis can be deposited fartit-free on the substrate. In this way the application means is saturated eithef toniitraousiy or at interval* with the noble psetal iStdubots^praiVs'abiy with the silver sohnion.
Tbc application means tv preferably m thud eonvevtrsg eonneetiou with a suitable supply utsi. The supply unit ears be by way of example a dosntg tmli Whieb either feeds s eonstam amonst cfedmuduslll, or a fixed atsount at timed intervals, of til» nohle metal sohitios, preferably the silver suiutiosg to tite applscatio.n means.
Ohvnassly the media meal application means cör also b« fapiac«! «5- sssppirowmtefe by an application vä 'hid t ' μ,^,-ί wd ' <Κ>ιη νΧΐ'ρΉΚ "h'î^Miiwi Λ «> substrate, ss wrntld hereby be conceivable by way of example to «se a spray assembly whkfet by me.ms oi mr pressure ot however purely material pressnsw (s»riess> enables a correspond btg acceleration of ihn noble me-al solution, preferably the silver solution, which k then thteded so and deposited otî the substrate.
Accord sag to a p&amp;rtieniarly advantageous főttbe ; development of :b® invention n ts proposed dsat she snh\®,tto wInch vs ehe&amp;dy oouhJ with Ihc rood noble meist solution, preferably wnh Us? silver solution, te odor goofing down healed up agsin to as is in ;hc Msisbsrure range from dÓSAP to MXbC Within the soupe of the thermal sihmtmatmeni taking place is the xubstrate already coated wok the noble oktal solution. preferably the silver coating, its mstsfcmee to oxidation it Increased to e maximum. M the latest during the sours® of the thermlif hlbttvtreathtbhf; pi Ifilénkekillk; phase is pttxipded between thé kohle metai costing. preferably with the ||νρ· ceatfng and the metailfc substrate as a tesnh of which a high resistance to oxidation is achieved.
The mvenitnn further proposes thai preheating the smbstrme can already be apleimken by naipg a pkiteedy® sinfekiphnre, Thus ibe preheating can gmfemifeiy be parried <Pi by using a ptnteeilva ps? In ebdihhpttnb wiib of p ah alternative to this, heating she substrate already oeafad ops also he «pried oni In codirection with this * pnfeeedve gas. Mirre ptfeevdariy. the reneilvify of the metals used with oxygen, which is mstssmi-.m·.^ iefnpfÄfes rise* la «ounierasted t&amp;e
proportion of sir oxygen which is reduced by or even ix>nxixisfent:thro»gh the proteofeve ps, lÁeprdnsg to a particularly preferred further ifeyblppntant of dar hasse dint the koÄ akidii! solution,. which is pteiltnbjy a silvra solution, geld safeifeiou, ®®gg« tarlnfeosg nichef ssifedlok. or psifadiins solution, which is nspf ssd Isdhbb 10½ appbed wi-hm Ils® scop ofds® method apeordlug tijithe ? tnvskttnnç srnnprises the Ml8wi^p^f!^mi»yM%:by weight: etlmtlf SI) ·*· US ~ nohfeksehfe eompaosid. more particularly silveb bdhlphtid. gold Cbbiddkhd, nick®! c^i^pid,, gsllddinm compound or vopp. « cosipoutP JO ~ 4 a - oygitmc an»»®« >band<10 - siahiferrv 5:-:111. furthermore ihe noble metal solution. preferably Use sliver safeuoon, gold solution, copper Mlutiorg jpiekel solutiot- nr p&amp;Hadiutn solnoon. cast ntelude an unavoidsble restdoe of tnspurisfess litcnrtbd dnrtsg prodociioo. The orgsnie amines contained in the noble metal solution have » pccpixUmof mofe ibga U.U % fe. w. end leas than 10 % b.vv, The noble metal compound m the |bnn of the prelbtred sstv or OOhlpipid, gtdd bompntruh wppr compound, oiekei cotnpund or pallsdiunt ootapotmd. fnrthemxire has· a solid body jprt^xxrUon of silver (Ag), gold (Ant, copper {Cajk, sfeekei (bill or pailatlium (Ud> of more Umn {>) 0,0% h. w. up so and incitidisg 40d)% b.w.
The contents indicated above for the noble·· metal solution have proved duiskg : tests tn voowrctuws with the inensures pt^vvovtsly described, Aa n restdi a noble hieidi ëfsyîlkg vvhbdl ib se>.wtant >c< o\xl ttion could K> fbnnt'd m oaow'ui w sn the ideas ot fete pmhmaJ sälv er «viking.
As a iv*ult vd the nsethvxi vvconhng to 'he atveano« pantossly dosenhed tt s» now possible to nan* on a metallic substrate a noble »teufe coating, which is psvfcrably « silver coanug. which is reeistanf to asvdatmti ^.οο wtoch wnK'\ »«xtueed wvh onb Vth c\;,wivx merni H usv 'fe'wwpU'· îhe ivf«fî:'!';v<i silver i.-Sgt in the form <=s' îh<i subie mêlai Wiluikai or the preferred silver soKuioa which is κ> be applied, has compared wlih gsl varia procès»»»-» ihe advantage of s rapid aad especially commerei&amp;Uy viable production ofeorresposdiräg product,
The invention advantageously proposes diai the application o.f ibe costing cas he carried oui sa several singes st die enne traie. hi ihlx way poxksctioo speeds of ap to 25 métrer» per second (mis) era bo readied. A costing a»tra*tgem*m will «tiw he described below which k suitable ibr ibtromg a. noble racial vOftiùxg, preferably a silver coating. on e metallic auhstrare. more particularly within the scope of the skpihoä rprevKiusly Indicated.
The costing arrangea»»: comprises here a preheat sttg device*.«» applicationdevise, a h#mg device as. well as a cooling devive arid an «fietborning device. The javaim' proposes here ihat the previously listed devices sue arranged m succession ir> aeouveyisg direction of the coating »witögetheni The spplestiôti device Is iiere designed do apply a nbhib be «ősied of fc substrate which hanprevdretsly ! beeo piebsaied by meam The noble restid sokdiott ees ptefemblyibe a silver solndhu.
Tie aâei-kaaaag withre the scope of a fbemisl sfleritreaftu^si; lie substrate which lies bees eostod: Mis fc fci ooil® metal ssdulion, preferably the silver aoMtotk ared hss ;hem:ssnded by ike rending idevles.
Ike advantages arising from this were already explained to farther detail to conneetkm with ike prevtbtisly erpiamed method according to ihe invention. To avoid attxibilotsTiObbloto referenséis reads et this ίΡίϋ to ike prevsoivs esplanathms Ftofheneoro alt the previous designs as well os eokfpoiimos sod further if evefopn tents of the tpvemton are to apply to the further development «χί^^ίΙ^^.-όΡ^ eluding orfhkgbOtetit as well as the wire produei according to the invention likewise iliustktied below and produced by osessos W the method aeconiiog to the invemios sod/or ike coating arrangementaecosdmg to tbe ii#uikm, so da« further developments raid cordiguraisoas artsing from these also apply here, and vice verset.
Aecotdmg to this à is proposed to as advantages* further development of the ebstlpg ahrinpmenf that die firing device has a catalyst arid a fan. The fas tv designed to produce so so stresst dssids the bring dcs\c dmxxxl agamat ike iiansport doectvo la tho connects'"» the fso and ike eatsltvt are m ranged tviabve cue aue Vt such that the an stream gv »x »ered by the Ian cas be directed towards tbe catalyst aber sulking Pie subsiratei írt oilier words, Ike \»bstrste to 4x »>x»uu .crecv oia .igavoi tire art soeam it.to tK firme devtce wot;oui t'x wo iiiieair; Ik'vis oioid ih. ^ k >"t .s If un ils V » ixeLstiog .or tkot the wslveota dolus, og >' »t s v'x tbe applied ooble metal solution, winch is preferably a silver Milutioo. cats be carried along by tbe air stream. The so stream contaisùssg tbe oolvenis w then due sied äiu<;ugh ike thus eosuu-g: i lowing direeiioo of the air stream to the tstslyst ?s order «0 relesce them again from tbe air slresuu.
Witt» regard to die wate product or siring siaieiia! wkicbeao he manutk tu»cd hv she lovenooo this can be a metallic substrate which lias a noble metal coating formed si icasi io «o»w mess m she subsi.ra.ts. The noble őseiül coat-rig is preferably s Silver csxuloy. kf»>re p'lotieulsrly prefetred the wife ptosluct sir the siring material w íu.síiíííIx hired vuh tbe fneiuosl prvvmioiy iodnuied audos the ixuiüug. atrjm»'» na'ttt orevioaviy deserilxai. ? he solde foetal coating, which can preferably be a ».fiver coating, icemed on tbe. substrat»' dum kas a high iitstusance in nerd« ibrm&amp;iios.
Ttewir» prodiset m stefeg penicsiiué wlöt &amp; jssttei àëfcs^àsg fp lise is^sttefte 8^t^Blíf«*ÍSiBaM:l»«oh85tícal properties cosnpte$: wife.-those ib&amp;s&amp;ag.a sabsious (bysvag of essmtde as s cor»"·'·»«*) of gold or Sides' ot a silver alloy. TüÉÉ eslvassages sap gerbeolarfy »oílseaifc -&amp;(&amp;$ **t sh» -mrc prodfel .or' string teeÉlí' eccorbktg -täMsimmtömi··, J;feöó^;Éerí'«Émíjp*iiíí' «íísmg msÉÉiál:88iKaiite8®^í m^otdidlldfelhfc feeette* lias est iosptvved esies^yfeeisnee oôa^a«di:iÂ^âjô^::pw^so#l»taï««^|®aàà^gatv»Â:p^^ Th« snhssmw used e&amp;ss b« .«Soyi ;Äiso iím wire ipssÄet er #5½¾ smsieäib swsnofclored according t© iho-day*»*»«« eHows higher production speedstlby way o:f:sxsmpl© 4im^^M^Íkaaá^|>.;'«»^5areá with itsm;poee«b ist eorrespondi*i|| gek®hie ptvsmsses. . .Iftsrtiter «sáf^utatteass of sh» meshed ;ss well <ss sh» «.oasiog «nangeinent ,¾¾ well *» fee vnre product ears hs pnÄced byhlhslhlücally expedient combination of individual or several features and measures ouilsned ln ihgipe^oav description, mi ase expressly ctaüned wiffcm fee scope cd' she mvcßtksn Further vh&amp;raetemties s^füfssüficalinss« of sh» iovmiskm eiui becotn« apparent snore particularly la coïaseeîios· «ash Figure I dexcrsbed below* which Is likewsse repaid as. and eltérned as part of she me««sts©a
Figure 1 shows a »oatiag arrangesrteat I which la miseibe accotdsng to the invention and which ia snisable by λ ‘V \ even be k> i » *Op txsi: k o cfeod ><.oie<uu e x. .xn1 is hi tenony » lokeocOS coathsg, preferably a siker costing, cas a? kast oste area of a mosaïste mbshbfe 3¾
The substrate 2 here is a metallic wire. which runs through she coating ertangement l sa it quasi endless string.
As can be seen, tbc snbssratc 2 wihscb la to be costed: ;ruSs ilwodgh the Indif IdUtd states» of fee seating sUrangemeot 1 sc a transport direction A. The costing arrangement 1 comprises individual devices 3 -- ? at fee force csf a preheating device 3. an hpplleatktn dhvfco 4, à #|sg device f # we|f as a cooling device 6 sod tsn aiiefetnubng devie© '7, lllsp psçircadng dcc#e 3 bas an «sfcy S through which st'.ffpt&amp;eiiVfLp» te he directed to form s protective aunospher© inside the greheatiirg device 3. the preheating device f Iptihcrrnoce has an input side 9 as well as ao ogtpdt side l(f wherein sh© snhsnase 2 cao esiter throngb fee it^ot side d isit© tkc inside of she píbiieadng cieviee 3. The çuhstiasc 2 ia petseasedlkscln tsnder die proteelios of fee protecti ve aormspherc is a tesipersiote songe Of preleiably 33(7X3 is dfe7X3. to this way any etthsiaoeeSs stseb as pot^felg oiiSi greats ahdAe febrieantsc adherfog to the sdrihceof ibeadi^trate 2 areosinealeti asídíor hotned. As she easno tisne. as the: snhstrate 2 beats ep so it becomes softer.
The thus preheated substrate 3 shea ktsves fee ps#.e;pin| device ? through the output side 10 festeof ird ΐ\ηξ'«χ»Ν to s'k apt isccnon dev v . t vhivh w ort wc ten so the « mud ^. e >.x six e h tsi <> dev ce ' The srpplscation devsee -3 w then atranged dsteedy in trosd of sso ingot side 1 i s>f the fsrstsg devh.x- 5 «s that the substrate 2 parses she csppbessiisxs devsec 4 belese enseraig salo tisc fstsssg devtce Ô. 'the appliccasiost device 4 is in fluid eonsmcisOsvwhites snpply orsis 12. The sopply east Í 2 esta helbsmei cits a dosing ussst. 'The supply unit 12 bas :bese a te8örvofedd;for a :sfehlc asetai seistuon 14 winch h dsrcctedms pump tosïi applieasien means lé as pa« of sheslgplseaisoss device 4. 1 ^êÂfe!*!'-«ïgîIIÂ4t M aaîvpîÂi'sMpS« a solution. Tha.japphsafeoa-deviec 4 ts thtss shscmed to apply ft ptesisahk us fee fern* «* a ssiu-f selets»». λ^ sbe nhends psvheaved wntave are» es' the ssSibsttxe» .' vn ebaisel of fca^lfeiPfciäx immi 16 v» ih the· ssshfeata 3,
Allera|fIkadM oflk sä»» &amp;« ieftt of ?»:á®r ssftosisnh fee portion of tik subslnxse 2 thus prepared then ruas through fe» fepi ide I I inso she Bring êw'm T The β| sáevic« 5 hasa bring tusáéi Π which has an skipns skin !$ sgjpwfen she rapes fesfer f|. À How esmslf W :® csumectad fer co&amp;vtyisg fend so she Ifeig masai I? bfttweess fe* fefsis aids I I isi the output wfe.M «fe fe« illrssg tmmi it The Hrsng device S 20 &amp;»d lessí oWMfef device-: 22 which are all siraisged in the Howcisxafe lé.
Us» fa» 2Ô is designed to generate as .sir stream B íssaide Ilse iss'srsg device 'fe-dlfeliéliplIM -fed mmspors dise-etks» Á. The as stream B then c-svifehe» through the festig tsmnel l? tasd she Sow eues»! té offen fsrmg device 5, Ilse fass 20 sad she catalyst 2 i are armsged sehstsxe so osso assofecr «ο ihat the sis- sins»» B after fefefeg the substrata 2 can he directed towards she catalysa 21. The catalyst 21 is here sssTcftgod sferwbsiteam of the tars 20 in relation so she dsxos uoa os" she asr sstvam B. I Ksrrng eoculasson ol' its» air sueafts: B she sir stream-ta hessied ssa she heaseig device 22. t he -ssteoded tampamssis» raupe of she ars sirens» B vis'shusg the vehftrase 2 &amp; preferably 5W. so WC. The easalyst 21 thereby :«rw m remow solvetsts (net «how» ia further detssl) which diffuse out from fee applied sable mesat solutsoss 14, preferably io fee fort» of the silver asfefeoo, snssslo she fltiog device 5. I» order so achieve aceetstnsfeig andrer ssscresfesg sh» pressure of fee air stream B isfedss dso Brlog maaei t7. the How oiressis 19 im eoire^xatdtag umrts 22 ssbtwtly before reasthisrg theisfesg s»tss»l Π. Its» iiwerla are preferably as tears ossss throstle tivrsesvssg the es»»s· vect;»i»il .oca of she Sow cra-oii to titter the ei-.hssrete 2 whseb ο coated woh sho s-.s»v fired rsohle meijrl soioooo 14, preferably wsth its» sited silver solution, has let's the fírissg devices d tlurou^h the otsipui aide lb thmeoC it ia is»« «applied fo É» cooling device 6, For dsR ils» ssooiksg device 6 aK< haa a storssiajKsotlisig inpsst sides 24 atsd &amp;s> output ski» 2$ ss> shat the substitue 2 can be dneesesl shrersgh the cooisrsg device S;isi the tsssiyport direosisot .4, fhe eoolissg detiee. 6 cott^jtiv«» sws> fans 2d, 27 sif sohidh s fmi&amp;η24 ses'vats So blow css>lksg air C in so fee enohssg dévie» b whiUs she corsntporsdissg veosasd: fasi 27 ί&amp; pnwid»d: fer drawing she »»óikig air i? ont from she eoolstsg device é. Both fan* 26, 27 are te tpetased its pismlici to tare atssfther Äswiät a flow sjf coolstso air C 4 mpsïsrated is fehs wayr 4v «soss as Ä» ftsns^^cöoiodíasbáfÉft 2 fes kft the coithng device si ifensogh its ssstSpsh alds 25 is lisxally nsns ksto the a&amp;fesirnitsg (levies 7, The áftesbssnlsg device t ses-ves ibr the shersnal afterdrsssssssem ef she alsesdy coated essfetsfee 2. Use ahethsmting device 7 shos has a.n iopni. aide 28 and ass eutpsst side 29 whssr&amp;lss she sabstnxle 2 h Intspdsseed .through the is-pot aide M ioto «iso aftesfesrshog device 7. Use sÄsfee 2 is heated ftkide tiie aftesfesrrdag devfee 7 whamiss she pdistçéd iemikshhsre range of 4öfe€ ts> ddifÜ 4 teaelsed* ilse dftefestmtsg sievice 7 ihsltesose ha» is:s ties segioa of the oulpsss side 29 aft egftafee ffi skosigh which pmketivs ggs^he diioctadmfcsn a fttoketive afttmaplsasft: iiaisleifeaftefesfti^ the snKtswe 2 vlawh hx* shsss Ksm she«-»s.fth ah»t he,bed then Scnuw she sfesfeamop TtiR ‘ ua she cssispsn shie 2§ shesx?of

Claims (2)

  1. ly ä# tiüi ; Ibîèïï4?^*if igén i g- nmk: 1. híjám nem«sÄieyö®Äs. Äsyhsest «ztksk'vois&amp;s, «rtmybevooai, têxbevooat. »Melbevoest vsgj· :|^ΙΙάΙϊ0®^3^^1Ι^^ΙίΙΙ^»:ϊ^ί^«?Μ!Λ·8^ν zzslagtormás« termák képezte losses hosdozo r2) legalább egy iiÂîôîàiîyàlïs.îîf amdynéS : * « feÄaS (2) havxmatöM ss^y^o2ö€-í*6rtá^yát «100« dijikk - s iiiÄx* (2> előba vite« tstkmsásyára samasíámoUlatot ( 14>, előnyőse« ezössokSatot. aranyokiatm, tézoWetot, Äliittt vagy [»iümlte (14) borának hij s hordozóra (2) kihordok nosssesfeHoléasoi i!41 r&amp;ishámek vesj(i:s!ï| ~s tà&amp;gmM sonsedlasokiatsol (14) bevont hozdozőt (2) fehütjOks ahoi s ràêgetesî amesfőmoktetsal (14) bevont líoedozót 12) lekötések kövesd tersrokus utókezeléséhez ism&amp;dfen Mhèvitiûk. aszsl JhÖ«5öe«*i hogy a «asgsÄssiiy (14) fiSággbesd 50Ô*€ es OOCik) kôxé eső Mm#§ÂÉe«;. vémemvKök. 2> As L sgèaypons szemsts eljárás, »xml j<4S«siwve; hogy ax eióhe vitést SSO® és 4004C közötti àômstsék Isten végezzük.
    3. Az előző igéstyponiok bármelyike szarta!! eljárás, azzal jellemezve, hogy a ««ssesíémoklat *14) riégetését az «iófcezelés higíérsékíeiértél aleeso&amp;yakb hAtoérsák!«tofis#|ó^|ite. 4. A 3. (seaypoot szeműi eljárás, azzal jellem****, bogy a rségeiüs hőmérséklete az ubrkezelés lÂ^i'sékksïéoéi Sö*\?0®C-kal> sunyikén liK)-l5Ü*C-ka[ alaesoayafcb. In Az előző Igöoypootok bármely ike szetinti eljárás, az«sí jellemezve, hogy a oesK'sfáoMíki ||4) IsMtoÄ&amp;t * hordozót (2) ielhotd» esrfcozze? il6) énatkeztetv« rőrtettik, «hol 8 íclhotdo eszköz |I:S) <r ntmmsl^mlöm·«: ΠΌ vsa áthatva £. As előző igénypontok bármelyike frzerioti eljárás, azzal j*H«me*ve, hogy a (14) íőlhoxdása ffelittadü Osszeállliss'vd, előnyőse« porlasztó ősszeállitással énatkezásmentcsen történik,
  2. 2. As gl^kb: IsPhyposítok bámtelyike *zeri«d eljárás, s?zal jellemezve, hogy a bevandbbgntps borckue$r (3f siitevliéséi ésöosgy a hotdeamk (2) a már bevonatost hordozó térnék»» utókezelésére szőlgéló iglhevaeset vMIglzi alWïossvayâgexitsL k. Az «10x0 Igénypontok bármelyike szerinti eljárás, azzal jeMeisesve, tmgy a HiiiMilitei: osmeÄnoldat (14) g követkézé összetevőket tartalmazza • 50-05 tömeges eianol. - 30-45 tömeg* s nensesietm'együkt, • > 0 es 10 tomes'?s szme» atom. • 5-10 töroeg% stabs 1 s zálőszsr, előállítástól (logo szenîtyszÔOések képezte fctstmaradó rész. Ä1; m- &amp;mmfém\tígyűMiysmmUm> előnyösen ezüst (Ag), ssbáokityogMoysOs nagyobb mini (>) 0,0 iosssglbooliegéaxest 40 tótseglSOg ietjotl,
HUE15709091A 2014-02-28 2015-02-27 Eljárás nemesfémbevonat kialakítására fémes hordozón HUE032381T2 (hu)

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