HRPK20070106B3 - Prototype modules for production of electronic devices with electronic tubes - Google Patents

Prototype modules for production of electronic devices with electronic tubes

Info

Publication number
HRPK20070106B3
HRPK20070106B3 HR20070106A HRP20070106A HRPK20070106B3 HR PK20070106 B3 HRPK20070106 B3 HR PK20070106B3 HR 20070106 A HR20070106 A HR 20070106A HR P20070106 A HRP20070106 A HR P20070106A HR PK20070106 B3 HRPK20070106 B3 HR PK20070106B3
Authority
HR
Croatia
Prior art keywords
electronic
tubes
prototype
production
modules
Prior art date
Application number
HR20070106A
Other languages
Croatian (hr)
Inventor
Bralić Aleksa
Original Assignee
Bralić Aleksa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bralić Aleksa filed Critical Bralić Aleksa
Priority to HR20070106A priority Critical patent/HRPK20070106B3/en
Priority to PCT/HR2007/000052 priority patent/WO2008114066A1/en
Publication of HRP20070106A2 publication Critical patent/HRP20070106A2/en
Publication of HRPK20070106B3 publication Critical patent/HRPK20070106B3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • H05K7/08—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses on perforated boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09963—Programming circuit by using small elements, e.g. small PCBs

Abstract

Postupak za dobivanje prototipnih modula za izradu elektronskih uređaja s elektronskim cijevima, naznačen time, da obuhvaća tri faze, i to: I faza - razlaganje topologije elektronskog uređaja s elektronskim cijevima na elementarne topologije s jednom, ili više, elektronskih cijevi i pripadajućim elektroničkim komponentama, koje treba smjestiti na prototipni modul, II faza - projektiranje prototipnih modula sa shemom za smještaj elektroničkih komponenti i jednog, ili više, podnožja za elektronsku cijev, prema definiranoj topologiji, iIII faza - obrada tiskane pločice prema montažnoj shemi. Patent sadrži još 3 patentna zahtjeva.A process for obtaining prototype modules for making electronic devices with electronic tubes, comprising three phases, namely: Phase I - decomposing the topology of an electronic tube device to elemental topologies with one or more electronic tubes and associated electronic components, to be placed on the prototype module, Phase II - design of prototype modules with schematics for placement of electronic components and one or more electronic tube sockets, according to the defined topology, and phase III - processing of the printed circuit board according to the assembly scheme. The patent contains 3 more patent claims.

HR20070106A 2007-03-16 2007-03-16 Prototype modules for production of electronic devices with electronic tubes HRPK20070106B3 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
HR20070106A HRPK20070106B3 (en) 2007-03-16 2007-03-16 Prototype modules for production of electronic devices with electronic tubes
PCT/HR2007/000052 WO2008114066A1 (en) 2007-03-16 2007-12-24 Prototype modules for construction of electronic devices incorporating electronic tubes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
HR20070106A HRPK20070106B3 (en) 2007-03-16 2007-03-16 Prototype modules for production of electronic devices with electronic tubes

Publications (2)

Publication Number Publication Date
HRP20070106A2 HRP20070106A2 (en) 2008-10-31
HRPK20070106B3 true HRPK20070106B3 (en) 2010-03-31

Family

ID=39523520

Family Applications (1)

Application Number Title Priority Date Filing Date
HR20070106A HRPK20070106B3 (en) 2007-03-16 2007-03-16 Prototype modules for production of electronic devices with electronic tubes

Country Status (2)

Country Link
HR (1) HRPK20070106B3 (en)
WO (1) WO2008114066A1 (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB803794A (en) * 1955-07-08 1958-11-05 Siemens Edison Swan Ltd Improvements relating to the mounting and electrical inter-connection of electrical circuit components
US3880610A (en) * 1973-12-14 1975-04-29 Us Transport Universal function module
AU2979395A (en) * 1994-07-01 1996-01-25 Werner Will Electronic system
US7413481B2 (en) * 2003-09-26 2008-08-19 Redmond Iii Frank E Systems for and methods of circuit construction
US20060172614A1 (en) * 2005-02-03 2006-08-03 Ta Sang H Universal systems printed circuit blocks and method for interconnecting the same

Also Published As

Publication number Publication date
WO2008114066A1 (en) 2008-09-25
HRP20070106A2 (en) 2008-10-31

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Legal Events

Date Code Title Description
A1OB Publication of a patent application
AKOB Publication of a request for the grant of a patent not including a substantive examination of a patent application (a consensual patent)
PKB1 Consensual patent granted
ODRP Renewal fee for the maintenance of a patent

Payment date: 20120305

Year of fee payment: 6

PBKO Lapse due to non-payment of renewal fee for consensual patent

Effective date: 20130317