HRP20180022T1 - Metalni materijali s uklopljenim luminiscentnim česticama - Google Patents
Metalni materijali s uklopljenim luminiscentnim česticama Download PDFInfo
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- HRP20180022T1 HRP20180022T1 HRP20180022TT HRP20180022T HRP20180022T1 HR P20180022 T1 HRP20180022 T1 HR P20180022T1 HR P20180022T T HRP20180022T T HR P20180022TT HR P20180022 T HRP20180022 T HR P20180022T HR P20180022 T1 HRP20180022 T1 HR P20180022T1
- Authority
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- Croatia
- Prior art keywords
- luminescent particles
- metal substrate
- metal layer
- metal
- galvanized
- Prior art date
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- 239000002245 particle Substances 0.000 title claims 13
- 239000007769 metal material Substances 0.000 title claims 2
- 229910052751 metal Inorganic materials 0.000 claims 28
- 239000002184 metal Substances 0.000 claims 28
- 239000000758 substrate Substances 0.000 claims 14
- 238000000034 method Methods 0.000 claims 10
- 238000009713 electroplating Methods 0.000 claims 6
- 239000000203 mixture Substances 0.000 claims 3
- 229910001369 Brass Inorganic materials 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- 239000010951 brass Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 2
- 229910000906 Bronze Inorganic materials 0.000 claims 1
- 229910052688 Gadolinium Inorganic materials 0.000 claims 1
- 229910001209 Low-carbon steel Inorganic materials 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 239000010974 bronze Substances 0.000 claims 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims 1
- 238000000151 deposition Methods 0.000 claims 1
- UIWYJDYFSGRHKR-UHFFFAOYSA-N gadolinium atom Chemical compound [Gd] UIWYJDYFSGRHKR-UHFFFAOYSA-N 0.000 claims 1
- 238000005246 galvanizing Methods 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 239000011159 matrix material Substances 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 claims 1
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 claims 1
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 229910052761 rare earth metal Inorganic materials 0.000 claims 1
- 229910001404 rare earth metal oxide Inorganic materials 0.000 claims 1
- 150000002910 rare earth metals Chemical class 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 239000010935 stainless steel Substances 0.000 claims 1
- 229910001220 stainless steel Inorganic materials 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/005—Jewels; Clockworks; Coins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1637—Composition of the substrate metallic substrate
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1662—Use of incorporated material in the solution or dispersion, e.g. particles, whiskers, wires
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/16—Apparatus for electrolytic coating of small objects in bulk
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- G—PHYSICS
- G07—CHECKING-DEVICES
- G07D—HANDLING OF COINS OR VALUABLE PAPERS, e.g. TESTING, SORTING BY DENOMINATIONS, COUNTING, DISPENSING, CHANGING OR DEPOSITING
- G07D5/00—Testing specially adapted to determine the identity or genuineness of coins, e.g. for segregating coins which are unacceptable or alien to a currency
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- G—PHYSICS
- G07—CHECKING-DEVICES
- G07D—HANDLING OF COINS OR VALUABLE PAPERS, e.g. TESTING, SORTING BY DENOMINATIONS, COUNTING, DISPENSING, CHANGING OR DEPOSITING
- G07D7/00—Testing specially adapted to determine the identity or genuineness of valuable papers or for segregating those which are unacceptable, e.g. banknotes that are alien to a currency
- G07D7/06—Testing specially adapted to determine the identity or genuineness of valuable papers or for segregating those which are unacceptable, e.g. banknotes that are alien to a currency using wave or particle radiation
- G07D7/12—Visible light, infrared or ultraviolet radiation
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- G—PHYSICS
- G07—CHECKING-DEVICES
- G07F—COIN-FREED OR LIKE APPARATUS
- G07F7/00—Mechanisms actuated by objects other than coins to free or to actuate vending, hiring, coin or paper currency dispensing or refunding apparatus
- G07F7/08—Mechanisms actuated by objects other than coins to free or to actuate vending, hiring, coin or paper currency dispensing or refunding apparatus by coded identity card or credit card or other personal identification means
- G07F7/0806—Details of the card
- G07F7/0813—Specific details related to card security
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/22—Electroplating: Baths therefor from solutions of zinc
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
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- Electroplating Methods And Accessories (AREA)
- Luminescent Compositions (AREA)
- Chemically Coating (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Claims (12)
1. Postupak deponiranje metalnog sloja s uklopljenim luminiscentnim česticama na metalnu podlogu, koji se sastoji u:
miješanju luminiscentnih čestica s metalnim materijalom kako bi se dobilo otopinu za galvaniziranje;
stavljanju metalne podloge u otopinu za galvaniziranje; i
provođenju postupka oblaganja kako bi se obložilo metalnu podlogu metalnim slojem, gdje metalni sloj sadrži uklopljene luminiscentne čestice, gdje je postupak oblaganja postupak galvaniziranja i naznačen time što postupak galvaniziranja uključuje rotiranje bubnja u kojem se nalazi metalna podloga kada se stavi u otopinu za galvaniziranje;
gdje se luminiscentne čestice dispergirane u otopini za galvaniziranje fizički raspodijele po cijelom metalnom matriksu prilikom formiranja galvaniziranog sloja.
2. Postupak u skladu s patentnim zahtjevom 1, naznačen time što postupak galvaniziranja sastoji uključuje povremeno rotiranje bubnja dok se metalni sloj galvanizira na metalnu podlogu.
3. Postupak u skladu s patentnim zahtjevom 2, naznačen time što se bubanj povremeno vrti u jednom ili više vremenskih perioda kraćih od vremenskih perioda u kojima se bubanj ne vrti.
4. Postupak u skladu s patentnim zahtjevom 3, naznačen time što je svaki od jednog ili više vremenskih perioda otprilike 25% od svakog od vremenskih perioda u kojima se bubanj ne vrti.
5. Postupak u skladu s patentnim zahtjevom 1, naznačen time što se luminiscentne čestice bira između fosfora na bazi itrijevog oksida dopiranih rijetkom zemljom s gustoćom iznad 5,0 g/cm3 i fosfora na bazi oksida rijetke zemlje gadolinija s gustoćama iznad 7,4 g/cm3.
6. Postupak u skladu s patentnim zahtjevom 1, naznačen time što se uklopljene luminiscentne čestice deponira na svim stranama metalne podloge.
7. Metalna podloga koja ima galvanizirani metalni sloj na metalnoj podlozi, gdje galvanizirani metalni sloj sadrži uklopljene luminiscentne čestice, gdje galvanizirani metalni sloj sadrži luminiscentne čestice deponirane na metalnoj podlozi postupkom u skladu s patentnim zahtjevom 1, naznačena time što galvanizirani metalni sloj ima sastav u kojem su uklopljene luminiscentne čestice raspodijeljene po cijelom galvaniziranom metalnom sloju.
8. Metalna podloga u skladu s patentnim zahtjevom 7, naznačen time što uklopljene luminiscentne čestice imaju sastav podešen za emitiranje energije druge valne duljine kada ih se pobudi energijom prve valne duljine.
9. Metalna podloga u skladu s patentnim zahtjevom 8, naznačen time što se galvanizirani metalni sloj bira iz skupine koju čine nikal, niklo-fosfor, bakar, mjed, zlato, srebro, te platina.
10. Metalna podloga u skladu s patentnim zahtjevom 9, naznačena time što se metalnu podlogu bira iz skupine koju čine bakar, mjed, bronca, niskougljični čelik, nehrđajući čelik, te titanij.
11. Metalna podloga u skladu s patentnim zahtjevom 9, naznačena time što je metalna podloga prenosiva kovanica.
12. Metalna podloga u skladu s patentnim zahtjevom 7, naznačena time što ima drugi galvanizirani metalni sloj, koji sadrži uklopljene luminiscentne čestice drugačijeg sastava nego ranije uklopljene luminiscentne čestice.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US35333310P | 2010-06-10 | 2010-06-10 | |
| US13/156,794 US20110305919A1 (en) | 2010-06-10 | 2011-06-09 | Metallic materials with embedded luminescent particles |
| EP11728732.6A EP2580374B1 (en) | 2010-06-10 | 2011-06-10 | Metallic materials with embedded luminescent particles |
| PCT/US2011/039918 WO2011156676A2 (en) | 2010-06-10 | 2011-06-10 | Metallic materials with embedded luminescent particles |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| HRP20180022T1 true HRP20180022T1 (hr) | 2018-02-09 |
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ID=45096450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| HRP20180022TT HRP20180022T1 (hr) | 2010-06-10 | 2018-01-08 | Metalni materijali s uklopljenim luminiscentnim česticama |
Country Status (23)
| Country | Link |
|---|---|
| US (5) | US20110305919A1 (hr) |
| EP (2) | EP2580374B1 (hr) |
| JP (1) | JP2013533924A (hr) |
| KR (1) | KR20140004056A (hr) |
| CN (1) | CN103080376A (hr) |
| AU (1) | AU2011264736B2 (hr) |
| BR (1) | BR112012031134A2 (hr) |
| CA (1) | CA2801418A1 (hr) |
| CL (1) | CL2012003442A1 (hr) |
| DK (1) | DK2580374T3 (hr) |
| ES (1) | ES2655612T3 (hr) |
| HR (1) | HRP20180022T1 (hr) |
| HU (1) | HUE036260T2 (hr) |
| MX (1) | MX337379B (hr) |
| NO (1) | NO2580374T3 (hr) |
| PH (1) | PH12016501949B1 (hr) |
| PL (1) | PL2580374T3 (hr) |
| PT (1) | PT2580374T (hr) |
| RS (1) | RS56730B1 (hr) |
| RU (1) | RU2013100159A (hr) |
| SG (1) | SG186188A1 (hr) |
| WO (1) | WO2011156676A2 (hr) |
| ZA (3) | ZA201209181B (hr) |
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| US20120021120A1 (en) * | 2010-07-23 | 2012-01-26 | Michael David Feldstein | Coatings with identification and authentication properties |
| WO2012172018A1 (en) | 2011-06-15 | 2012-12-20 | Fábrica Nacional De Moneda Y Timbre - Real Casa De La Moneda | Use of luminescent nanosystems for authenticating security documents |
| EP2535390A1 (en) | 2011-06-15 | 2012-12-19 | Universidade De Santiago De Compostela | Luminescent nanosystems |
| US8864038B2 (en) | 2011-11-17 | 2014-10-21 | The Trustees Of Columbia University In The City Of New York | Systems and methods for fraud prevention, supply chain tracking, secure material tracing and information encoding using isotopes and other markers |
| DE102012017914A1 (de) | 2012-09-11 | 2014-03-13 | Giesecke & Devrient Gmbh | Münze sowie Verfahren zum Prüfen und zur Herstellung einer Münze |
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| US9302322B2 (en) | 2012-12-12 | 2016-04-05 | Nanogap Sub Nm Powder, S.A. | Luminescent nanocompounds |
| GB201308473D0 (en) * | 2013-05-10 | 2013-06-19 | Authentix Inc | Plating of articles |
| CN103205793B (zh) * | 2013-05-13 | 2016-02-03 | 兰州理工大学 | 镍基荧光粒子功能指示复合共生涂层的制备方法 |
| US9387719B2 (en) | 2013-10-28 | 2016-07-12 | Honeywell International Inc. | Cold-worked metal articles including luminescent phosphor particles, methods of forming the same, and methods of authenticating the same |
| US9918344B2 (en) | 2015-04-09 | 2018-03-13 | Intel IP Corporation | Random access procedure for enhanced coverage support |
| GB2551318A (en) * | 2016-06-07 | 2017-12-20 | Scan Coin Ab | Method and apparatus for sensing taggants |
| US20180125088A1 (en) * | 2016-10-13 | 2018-05-10 | Devin Jamroz | Coffee beans having improved shelf life by utilizing cannabinoids and method of infusion |
| WO2018083496A1 (en) * | 2016-11-04 | 2018-05-11 | The Royal Mint Limited | Authentication and tamper-detection of precious metal items and other items |
| US10502690B2 (en) * | 2017-07-18 | 2019-12-10 | Ford Global Technologies, Llc | Indicator system for vehicle wear components |
| US20200230640A1 (en) * | 2019-01-22 | 2020-07-23 | Honeywell International Inc. | Metal article embedded with taggant and methods of making |
| IT201900003463A1 (it) * | 2019-03-11 | 2020-09-11 | Nuovo Pignone Tecnologie Srl | Componente di turbomacchine avente un rivestimento metallico |
| US20200325589A1 (en) | 2019-04-09 | 2020-10-15 | United States Of America As Represented By The Secretary Of The Navy | Bathless metal-composite electroplating |
| EP3943573A1 (fr) * | 2020-07-21 | 2022-01-26 | Richemont International S.A. | Materiau metallique luminescent, procede de preparation et utilisation |
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