HK73895A - A semiconductor substrate having a superconducting thin film - Google Patents
A semiconductor substrate having a superconducting thin filmInfo
- Publication number
- HK73895A HK73895A HK73895A HK73895A HK73895A HK 73895 A HK73895 A HK 73895A HK 73895 A HK73895 A HK 73895A HK 73895 A HK73895 A HK 73895A HK 73895 A HK73895 A HK 73895A
- Authority
- HK
- Hong Kong
- Prior art keywords
- thin film
- semiconductor substrate
- superconducting thin
- superconducting
- semiconductor
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
- 239000010409 thin film Substances 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/32058—Deposition of superconductive layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/0242—Crystalline insulating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02491—Conductive materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02494—Structure
- H01L21/02496—Layer structure
- H01L21/02502—Layer structure consisting of two layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/02546—Arsenides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76886—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
- H01L21/76891—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances by using superconducting materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/53204—Conductive materials
- H01L23/53285—Conductive materials containing superconducting materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/01—Manufacture or treatment
- H10N60/0268—Manufacture or treatment of devices comprising copper oxide
- H10N60/0661—Processes performed after copper oxide formation, e.g. patterning
- H10N60/0716—Passivating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/20—Permanent superconducting devices
- H10N60/203—Permanent superconducting devices comprising high-Tc ceramic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Superconductor Devices And Manufacturing Methods Thereof (AREA)
Applications Claiming Priority (12)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62328481A JPH01170067A (ja) | 1987-12-25 | 1987-12-25 | 超電導体層を有する半導体基板 |
JP62328480A JPH01170066A (ja) | 1987-12-25 | 1987-12-25 | 超電導体層を有する半導体基板 |
JP62328478A JPH01170064A (ja) | 1987-12-25 | 1987-12-25 | 超電導体層を有する半導体基板 |
JP62328477A JPH01170063A (ja) | 1987-12-25 | 1987-12-25 | 超電導体層を有する半導体基板 |
JP62328472A JPH01170058A (ja) | 1987-12-25 | 1987-12-25 | 超電導体層を有する半導体基板 |
JP62328473A JPH01170059A (ja) | 1987-12-25 | 1987-12-25 | 超電導体層を有する半導体基板 |
JP62328476A JPH01170062A (ja) | 1987-12-25 | 1987-12-25 | 超電導体層を有する半導体基板 |
JP62328474A JPH01170060A (ja) | 1987-12-25 | 1987-12-25 | 超電導体層を有する半導体基板 |
JP62328475A JPH01170061A (ja) | 1987-12-25 | 1987-12-25 | 超電導体層を有する半導体基板 |
JP62328479A JPH01170065A (ja) | 1987-12-25 | 1987-12-25 | 超電導体層を有する半導体基板 |
JP62328482A JPH01170068A (ja) | 1987-12-25 | 1987-12-25 | 超電導体層を有する半導体基板 |
JP62328471A JPH01170057A (ja) | 1987-12-25 | 1987-12-25 | 超電導体層を有する半導体基板 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK73895A true HK73895A (en) | 1995-05-19 |
Family
ID=27583546
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK73895A HK73895A (en) | 1987-12-25 | 1995-05-11 | A semiconductor substrate having a superconducting thin film |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0323342B1 (fr) |
DE (1) | DE3850084T2 (fr) |
HK (1) | HK73895A (fr) |
SG (1) | SG28390G (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL8801032A (nl) * | 1988-04-21 | 1989-11-16 | Philips Nv | Inrichting en werkwijze voor het vervaardigen van een inrichting. |
US5256897A (en) * | 1988-11-28 | 1993-10-26 | Hitachi, Ltd. | Oxide superconducting device |
DE3903432C1 (en) * | 1989-02-06 | 1990-04-26 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt, De | Method for fabricating a component containing a superconductor and a semiconductor |
JPH06302872A (ja) * | 1993-04-14 | 1994-10-28 | Sumitomo Electric Ind Ltd | 酸化物超電導薄膜上に上層の薄膜を積層する方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0282012A3 (fr) * | 1987-03-09 | 1989-09-13 | Semiconductor Energy Laboratory Co., Ltd. | Dispositif semi-conducteur supraconducteur |
-
1988
- 1988-12-26 DE DE3850084T patent/DE3850084T2/de not_active Expired - Fee Related
- 1988-12-26 SG SG1995906426A patent/SG28390G/en unknown
- 1988-12-26 EP EP88403324A patent/EP0323342B1/fr not_active Expired - Lifetime
-
1995
- 1995-05-11 HK HK73895A patent/HK73895A/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE3850084D1 (de) | 1994-07-14 |
EP0323342B1 (fr) | 1994-06-08 |
SG28390G (en) | 1995-09-01 |
EP0323342A2 (fr) | 1989-07-05 |
DE3850084T2 (de) | 1995-01-19 |
EP0323342A3 (en) | 1989-08-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |