HK73895A - A semiconductor substrate having a superconducting thin film - Google Patents

A semiconductor substrate having a superconducting thin film

Info

Publication number
HK73895A
HK73895A HK73895A HK73895A HK73895A HK 73895 A HK73895 A HK 73895A HK 73895 A HK73895 A HK 73895A HK 73895 A HK73895 A HK 73895A HK 73895 A HK73895 A HK 73895A
Authority
HK
Hong Kong
Prior art keywords
thin film
semiconductor substrate
superconducting thin
superconducting
semiconductor
Prior art date
Application number
HK73895A
Other languages
English (en)
Inventor
Itozaki Hideo
Harada Keizo
Fujimori Naoji
Yazu Shuji
Original Assignee
Sumitomo Electric Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP62328472A external-priority patent/JPH01170058A/ja
Priority claimed from JP62328476A external-priority patent/JPH01170062A/ja
Priority claimed from JP62328481A external-priority patent/JPH01170067A/ja
Priority claimed from JP62328480A external-priority patent/JPH01170066A/ja
Priority claimed from JP62328478A external-priority patent/JPH01170064A/ja
Priority claimed from JP62328477A external-priority patent/JPH01170063A/ja
Priority claimed from JP62328471A external-priority patent/JPH01170057A/ja
Priority claimed from JP62328482A external-priority patent/JPH01170068A/ja
Priority claimed from JP62328475A external-priority patent/JPH01170061A/ja
Priority claimed from JP62328474A external-priority patent/JPH01170060A/ja
Priority claimed from JP62328473A external-priority patent/JPH01170059A/ja
Priority claimed from JP62328479A external-priority patent/JPH01170065A/ja
Application filed by Sumitomo Electric Industries filed Critical Sumitomo Electric Industries
Publication of HK73895A publication Critical patent/HK73895A/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/32058Deposition of superconductive layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/0237Materials
    • H01L21/0242Crystalline insulating materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02436Intermediate layers between substrates and deposited layers
    • H01L21/02439Materials
    • H01L21/02491Conductive materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02436Intermediate layers between substrates and deposited layers
    • H01L21/02494Structure
    • H01L21/02496Layer structure
    • H01L21/02502Layer structure consisting of two layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02538Group 13/15 materials
    • H01L21/02546Arsenides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76886Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
    • H01L21/76891Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances by using superconducting materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204Conductive materials
    • H01L23/53285Conductive materials containing superconducting materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00Superconducting devices
    • H10N60/01Manufacture or treatment
    • H10N60/0268Manufacture or treatment of devices comprising copper oxide
    • H10N60/0661Processes performed after copper oxide formation, e.g. patterning
    • H10N60/0716Passivating
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00Superconducting devices
    • H10N60/20Permanent superconducting devices
    • H10N60/203Permanent superconducting devices comprising high-Tc ceramic materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Superconductor Devices And Manufacturing Methods Thereof (AREA)
HK73895A 1987-12-25 1995-05-11 A semiconductor substrate having a superconducting thin film HK73895A (en)

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
JP62328481A JPH01170067A (ja) 1987-12-25 1987-12-25 超電導体層を有する半導体基板
JP62328480A JPH01170066A (ja) 1987-12-25 1987-12-25 超電導体層を有する半導体基板
JP62328478A JPH01170064A (ja) 1987-12-25 1987-12-25 超電導体層を有する半導体基板
JP62328477A JPH01170063A (ja) 1987-12-25 1987-12-25 超電導体層を有する半導体基板
JP62328472A JPH01170058A (ja) 1987-12-25 1987-12-25 超電導体層を有する半導体基板
JP62328473A JPH01170059A (ja) 1987-12-25 1987-12-25 超電導体層を有する半導体基板
JP62328476A JPH01170062A (ja) 1987-12-25 1987-12-25 超電導体層を有する半導体基板
JP62328474A JPH01170060A (ja) 1987-12-25 1987-12-25 超電導体層を有する半導体基板
JP62328475A JPH01170061A (ja) 1987-12-25 1987-12-25 超電導体層を有する半導体基板
JP62328479A JPH01170065A (ja) 1987-12-25 1987-12-25 超電導体層を有する半導体基板
JP62328482A JPH01170068A (ja) 1987-12-25 1987-12-25 超電導体層を有する半導体基板
JP62328471A JPH01170057A (ja) 1987-12-25 1987-12-25 超電導体層を有する半導体基板

Publications (1)

Publication Number Publication Date
HK73895A true HK73895A (en) 1995-05-19

Family

ID=27583546

Family Applications (1)

Application Number Title Priority Date Filing Date
HK73895A HK73895A (en) 1987-12-25 1995-05-11 A semiconductor substrate having a superconducting thin film

Country Status (4)

Country Link
EP (1) EP0323342B1 (fr)
DE (1) DE3850084T2 (fr)
HK (1) HK73895A (fr)
SG (1) SG28390G (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8801032A (nl) * 1988-04-21 1989-11-16 Philips Nv Inrichting en werkwijze voor het vervaardigen van een inrichting.
US5256897A (en) * 1988-11-28 1993-10-26 Hitachi, Ltd. Oxide superconducting device
DE3903432C1 (en) * 1989-02-06 1990-04-26 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt, De Method for fabricating a component containing a superconductor and a semiconductor
JPH06302872A (ja) * 1993-04-14 1994-10-28 Sumitomo Electric Ind Ltd 酸化物超電導薄膜上に上層の薄膜を積層する方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0282012A3 (fr) * 1987-03-09 1989-09-13 Semiconductor Energy Laboratory Co., Ltd. Dispositif semi-conducteur supraconducteur

Also Published As

Publication number Publication date
DE3850084D1 (de) 1994-07-14
EP0323342B1 (fr) 1994-06-08
SG28390G (en) 1995-09-01
EP0323342A2 (fr) 1989-07-05
DE3850084T2 (de) 1995-01-19
EP0323342A3 (en) 1989-08-23

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)