HK488A - Sputtering apparatus - Google Patents

Sputtering apparatus

Info

Publication number
HK488A
HK488A HK4/88A HK488A HK488A HK 488 A HK488 A HK 488A HK 4/88 A HK4/88 A HK 4/88A HK 488 A HK488 A HK 488A HK 488 A HK488 A HK 488A
Authority
HK
Hong Kong
Prior art keywords
sputtering apparatus
sputtering
Prior art date
Application number
HK4/88A
Inventor
Hideharu Kiyota
Mitsuaki Horiuchi
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of HK488A publication Critical patent/HK488A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3423—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Helmets And Other Head Coverings (AREA)
HK4/88A 1982-10-22 1988-01-07 Sputtering apparatus HK488A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57184577A JPS5976875A (en) 1982-10-22 1982-10-22 Magnetron type sputtering device

Publications (1)

Publication Number Publication Date
HK488A true HK488A (en) 1988-01-15

Family

ID=16155636

Family Applications (1)

Application Number Title Priority Date Filing Date
HK4/88A HK488A (en) 1982-10-22 1988-01-07 Sputtering apparatus

Country Status (10)

Country Link
US (1) US4547279A (en)
JP (1) JPS5976875A (en)
KR (1) KR840006557A (en)
DE (1) DE3338377A1 (en)
FR (1) FR2535109A1 (en)
GB (1) GB2129021B (en)
HK (1) HK488A (en)
IT (1) IT1169862B (en)
MY (1) MY8700801A (en)
SG (1) SG87987G (en)

Families Citing this family (50)

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NL185372C (en) * 1980-02-18 1990-03-16 Teco Societe Anonyme MULTI-POLE ELECTRICAL SAFETY SWITCH.
FR2476384B1 (en) * 1980-02-18 1985-11-29 Teco Sa IMPROVEMENTS ON A MANUALLY CLOSED SAFETY CIRCUIT BREAKER AND MAGNETIC AND THERMAL UNLOCKING UNITS
US4515675A (en) * 1983-07-06 1985-05-07 Leybold-Heraeus Gmbh Magnetron cathode for cathodic evaportion apparatus
NL8402012A (en) * 1983-07-19 1985-02-18 Varian Associates MICROWAVE SPETTER COATING APPLICATION SOURCE FOR BOTH MAGNETIC AND NON-MAGNETIC TARGET MATERIALS.
DE3442206A1 (en) * 1983-12-05 1985-07-11 Leybold-Heraeus GmbH, 5000 Köln Magnetron cathode for atomising ferromagnetic targets
US4486287A (en) * 1984-02-06 1984-12-04 Fournier Paul R Cross-field diode sputtering target assembly
US4606806A (en) * 1984-05-17 1986-08-19 Varian Associates, Inc. Magnetron sputter device having planar and curved targets
US4627904A (en) * 1984-05-17 1986-12-09 Varian Associates, Inc. Magnetron sputter device having separate confining magnetic fields to separate targets and magnetically enhanced R.F. bias
US4569746A (en) * 1984-05-17 1986-02-11 Varian Associates, Inc. Magnetron sputter device using the same pole piece for coupling separate confining magnetic fields to separate targets subject to separate discharges
US4661228A (en) * 1984-05-17 1987-04-28 Varian Associates, Inc. Apparatus and method for manufacturing planarized aluminum films
DE3581558D1 (en) * 1984-05-17 1991-03-07 Varian Associates MAGNETRONIC SPRAYING DEVICE WITH PLANES AND CONCAVE ROLLING PLATES.
US4610774A (en) * 1984-11-14 1986-09-09 Hitachi, Ltd. Target for sputtering
JPS61183467A (en) * 1985-02-08 1986-08-16 Hitachi Ltd Sputtering electrode
US4855033A (en) * 1986-04-04 1989-08-08 Materials Research Corporation Cathode and target design for a sputter coating apparatus
DE3787390T2 (en) * 1986-04-04 1994-06-16 Materials Research Corp Cathode and target arrangement for a coating device for atomization.
US4834860A (en) * 1987-07-01 1989-05-30 The Boc Group, Inc. Magnetron sputtering targets
GB2209769A (en) * 1987-09-16 1989-05-24 Ion Tech Ltd Sputter coating
JPH0246854U (en) * 1988-09-19 1990-03-30
US5403663A (en) * 1989-06-12 1995-04-04 Leybold Aktiengesellschaft Process for coating a polycarbonate substrate with an aluminum-silicon alloy
DE3919147C2 (en) * 1989-06-12 1998-01-15 Leybold Ag Process for coating a plastic substrate with aluminum
JP3047917B2 (en) * 1989-10-20 2000-06-05 東京エレクトロン株式会社 Sputtering target and sputtering method
JPH0733576B2 (en) * 1989-11-29 1995-04-12 株式会社日立製作所 Sputter device, target exchanging device, and exchanging method thereof
JPH03191058A (en) * 1989-12-19 1991-08-21 Toshiba Corp Sputtering device
US5080772A (en) * 1990-08-24 1992-01-14 Materials Research Corporation Method of improving ion flux distribution uniformity on a substrate
JPH04114210U (en) * 1991-03-26 1992-10-07 日立化成工業株式会社 Planar antenna housing structure
US5334302A (en) * 1991-11-15 1994-08-02 Tokyo Electron Limited Magnetron sputtering apparatus and sputtering gun for use in the same
DE9217937U1 (en) * 1992-01-29 1993-04-01 Leybold Ag, 6450 Hanau, De
US6605198B1 (en) * 1993-07-22 2003-08-12 Sputtered Films, Inc. Apparatus for, and method of, depositing a film on a substrate
EP0661728B1 (en) * 1993-12-28 1997-06-11 Shin-Etsu Chemical Co., Ltd. Dipole ring magnet for use in magnetron sputtering or magnetron etching
EP0704878A1 (en) * 1994-09-27 1996-04-03 Applied Materials, Inc. Uniform film thickness deposition of sputtered materials
US5697827A (en) * 1996-01-11 1997-12-16 Rabinowitz; Mario Emissive flat panel display with improved regenerative cathode
GB9606920D0 (en) * 1996-04-02 1996-06-05 Applied Vision Ltd Magnet array for magnetrons
DE19614595A1 (en) * 1996-04-13 1997-10-16 Singulus Technologies Gmbh Apparatus for cathode sputtering in substrate coating
DE19614598A1 (en) * 1996-04-13 1997-10-16 Singulus Technologies Gmbh Cathode sputtering device
US5863399A (en) * 1996-04-13 1999-01-26 Singulus Technologies Gmbh Device for cathode sputtering
US6042706A (en) * 1997-01-14 2000-03-28 Applied Materials, Inc. Ionized PVD source to produce uniform low-particle deposition
US5985115A (en) 1997-04-11 1999-11-16 Novellus Systems, Inc. Internally cooled target assembly for magnetron sputtering
KR19990023327A (en) * 1997-08-05 1999-03-25 토마스 엠. 알바레즈 Apparatus and method for depositing first and second materials onto a substrate
TW460599B (en) * 1998-01-14 2001-10-21 Toshiba Corp Method for forming fine wiring pattern
US6217716B1 (en) 1998-05-06 2001-04-17 Novellus Systems, Inc. Apparatus and method for improving target erosion in hollow cathode magnetron sputter source
JP2000098582A (en) * 1998-09-17 2000-04-07 Ulvac Seimaku Kk Phase shift photomask blank, phase shift photomask, their fabrication and equipment for fabrication of the same photomask blank
US6783638B2 (en) 2001-09-07 2004-08-31 Sputtered Films, Inc. Flat magnetron
US6846396B2 (en) * 2002-08-08 2005-01-25 Applied Materials, Inc. Active magnetic shielding
US20080083611A1 (en) * 2006-10-06 2008-04-10 Tegal Corporation High-adhesive backside metallization
US8691057B2 (en) * 2008-03-25 2014-04-08 Oem Group Stress adjustment in reactive sputtering
US20090246385A1 (en) * 2008-03-25 2009-10-01 Tegal Corporation Control of crystal orientation and stress in sputter deposited thin films
CN102405302B (en) * 2009-04-28 2016-09-14 磁性流体技术（美国）公司 It is characterised by the stripping depositing system of the HULA substrate support of taper settling chamber Midst density optimization
US8482375B2 (en) * 2009-05-24 2013-07-09 Oem Group, Inc. Sputter deposition of cermet resistor films with low temperature coefficient of resistance
JP6244103B2 (en) 2012-05-04 2017-12-06 ヴァイアヴィ・ソリューションズ・インコーポレイテッドＶｉａｖｉ Ｓｏｌｕｔｉｏｎｓ Ｉｎｃ． Method and reactive sputter deposition system for reactive sputter deposition
JP5343162B1 (en) * 2012-10-26 2013-11-13 エピクルー株式会社 Epitaxial growth equipment

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4046659A (en) * 1974-05-10 1977-09-06 Airco, Inc. Method for coating a substrate
US4060470A (en) * 1974-12-06 1977-11-29 Clarke Peter J Sputtering apparatus and method
US4100055A (en) * 1977-06-10 1978-07-11 Varian Associates, Inc. Target profile for sputtering apparatus
US4169031A (en) * 1978-01-13 1979-09-25 Polyohm, Inc. Magnetron sputter cathode assembly
US4219397A (en) * 1978-11-24 1980-08-26 Clarke Peter J Magnetron sputter apparatus
HU179482B (en) * 1979-02-19 1982-10-28 Mikroelektronikai Valalat Penning pulverizel source
GB2058143B (en) * 1979-07-31 1983-11-02 Nordiko Ltd Sputtering electrodes
US4457825A (en) * 1980-05-16 1984-07-03 Varian Associates, Inc. Sputter target for use in a sputter coating source
US4461688A (en) * 1980-06-23 1984-07-24 Vac-Tec Systems, Inc. Magnetically enhanced sputtering device having a plurality of magnetic field sources including improved plasma trapping device and method
US4401539A (en) * 1981-01-30 1983-08-30 Hitachi, Ltd. Sputtering cathode structure for sputtering apparatuses, method of controlling magnetic flux generated by said sputtering cathode structure, and method of forming films by use of said sputtering cathode structure
US4422896A (en) * 1982-01-26 1983-12-27 Materials Research Corporation Magnetically enhanced plasma process and apparatus
US4414086A (en) * 1982-11-05 1983-11-08 Varian Associates, Inc. Magnetic targets for use in sputter coating apparatus
US4428816A (en) * 1983-05-25 1984-01-31 Materials Research Corporation Focusing magnetron sputtering apparatus

Also Published As

Publication number Publication date
IT8323382A0 (en) 1983-10-20
JPH021909B2 (en) 1990-01-16
GB2129021A (en) 1984-05-10
GB2129021B (en) 1986-09-10
SG87987G (en) 1988-06-03
JPS5976875A (en) 1984-05-02
MY8700801A (en) 1987-12-31
FR2535109A1 (en) 1984-04-27
DE3338377A1 (en) 1984-04-26
KR840006557A (en) 1984-11-30
US4547279A (en) 1985-10-15
GB8328208D0 (en) 1983-11-23
IT1169862B (en) 1987-06-03

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)