HK43194A - Amorphous-polypropylene-based hot melt adhesive - Google Patents

Amorphous-polypropylene-based hot melt adhesive

Info

Publication number
HK43194A
HK43194A HK43194A HK43194A HK43194A HK 43194 A HK43194 A HK 43194A HK 43194 A HK43194 A HK 43194A HK 43194 A HK43194 A HK 43194A HK 43194 A HK43194 A HK 43194A
Authority
HK
Hong Kong
Prior art keywords
amorphous
polypropylene
hot melt
melt adhesive
based hot
Prior art date
Application number
HK43194A
Other languages
English (en)
Inventor
Toshinori Wakabayashi
Shinji Sugii
Original Assignee
Minnesota Mining & Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining & Mfg filed Critical Minnesota Mining & Mfg
Publication of HK43194A publication Critical patent/HK43194A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/10—Homopolymers or copolymers of propene
    • C09J123/12—Polypropene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
HK43194A 1987-04-03 1994-05-05 Amorphous-polypropylene-based hot melt adhesive HK43194A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8277887 1987-04-03

Publications (1)

Publication Number Publication Date
HK43194A true HK43194A (en) 1994-05-13

Family

ID=13783878

Family Applications (1)

Application Number Title Priority Date Filing Date
HK43194A HK43194A (en) 1987-04-03 1994-05-05 Amorphous-polypropylene-based hot melt adhesive

Country Status (9)

Country Link
EP (1) EP0285430B1 (de)
AU (1) AU608588B2 (de)
BR (1) BR8801527A (de)
CA (1) CA1334875C (de)
DE (1) DE3880725T2 (de)
ES (1) ES2040844T3 (de)
HK (1) HK43194A (de)
MX (1) MX172100B (de)
MY (1) MY104301A (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992008764A1 (en) * 1990-11-16 1992-05-29 Eastman Kodak Company Elastomeric composition
US5210136A (en) * 1990-11-16 1993-05-11 Eastman Kodak Company Elastomeric composition
US6657009B2 (en) 2000-12-29 2003-12-02 Kimberly-Clark Worldwide, Inc. Hot-melt adhesive having improved bonding strength
US20020123538A1 (en) 2000-12-29 2002-09-05 Peiguang Zhou Hot-melt adhesive based on blend of amorphous and crystalline polymers for multilayer bonding
US6774069B2 (en) 2000-12-29 2004-08-10 Kimberly-Clark Worldwide, Inc. Hot-melt adhesive for non-woven elastic composite bonding
US6872784B2 (en) * 2000-12-29 2005-03-29 Kimberly-Clark Worldwide, Inc. Modified rubber-based adhesives
KR20020075317A (ko) * 2002-07-12 2002-10-04 부성폴리콤 주식회사 폴리 올레핀 형태의 열용융형 접착제 조성물
DE10317403A1 (de) * 2003-01-29 2004-08-05 Tesa Ag Verfahren zur Verklebung von FPCB's
US7955710B2 (en) 2003-12-22 2011-06-07 Kimberly-Clark Worldwide, Inc. Ultrasonic bonding of dissimilar materials
JP5850683B2 (ja) * 2011-09-16 2016-02-03 ヘンケルジャパン株式会社 ホットメルト接着剤
JP5924894B2 (ja) 2011-09-16 2016-05-25 ヘンケルジャパン株式会社 使い捨て製品用ホットメルト接着剤
JP5850682B2 (ja) 2011-09-16 2016-02-03 ヘンケルジャパン株式会社 ホットメルト接着剤
JP5947153B2 (ja) 2012-08-28 2016-07-06 ヘンケルジャパン株式会社 ホットメルト接着剤

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3686107A (en) * 1968-06-25 1972-08-22 Flintkote Co Pressure-sensitive hot-melt adhesives
EP0178062A3 (de) * 1984-09-10 1989-05-10 UNIROYAL CHEMICAL COMPANY, Inc. Thermoplastische elastomere druckempfindliche Heissschmelzklebstoffzusammensetzung

Also Published As

Publication number Publication date
AU608588B2 (en) 1991-04-11
BR8801527A (pt) 1988-11-08
EP0285430A2 (de) 1988-10-05
ES2040844T3 (es) 1993-11-01
AU1417988A (en) 1988-10-06
MX172100B (es) 1993-12-03
DE3880725D1 (de) 1993-06-09
DE3880725T2 (de) 1993-10-14
EP0285430B1 (de) 1993-05-05
CA1334875C (en) 1995-03-21
MY104301A (en) 1994-03-31
EP0285430A3 (de) 1991-03-13

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)