HK140395A - Encapsulation molding equipment and method - Google Patents

Encapsulation molding equipment and method

Info

Publication number
HK140395A
HK140395A HK140395A HK140395A HK140395A HK 140395 A HK140395 A HK 140395A HK 140395 A HK140395 A HK 140395A HK 140395 A HK140395 A HK 140395A HK 140395 A HK140395 A HK 140395A
Authority
HK
Hong Kong
Prior art keywords
molding equipment
encapsulation molding
encapsulation
equipment
molding
Prior art date
Application number
HK140395A
Other languages
English (en)
Inventor
Horst Karl Neu
Original Assignee
Neu Dynamics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/052,545 external-priority patent/US5405255A/en
Application filed by Neu Dynamics Corp filed Critical Neu Dynamics Corp
Publication of HK140395A publication Critical patent/HK140395A/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14098—Positioning or centering articles in the mould fixing or clamping inserts having variable dimensions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/2673—Moulds with exchangeable mould parts, e.g. cassette moulds

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
HK140395A 1993-04-23 1995-09-07 Encapsulation molding equipment and method HK140395A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/052,545 US5405255A (en) 1992-11-24 1993-04-23 Encapsulaton molding equipment
US10833593A 1993-08-18 1993-08-18

Publications (1)

Publication Number Publication Date
HK140395A true HK140395A (en) 1995-09-15

Family

ID=26730733

Family Applications (1)

Application Number Title Priority Date Filing Date
HK140395A HK140395A (en) 1993-04-23 1995-09-07 Encapsulation molding equipment and method

Country Status (3)

Country Link
KR (1) KR100191736B1 (ko)
GB (1) GB2277295B (ko)
HK (1) HK140395A (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5409362A (en) * 1992-11-24 1995-04-25 Neu Dynamics Corp. Encapsulation molding equipment
EP0688650B1 (en) * 1994-01-13 2000-11-02 Citizen Watch Co. Ltd. Method of resin-sealing semiconductor devices
GB2323555B (en) * 1994-07-06 1999-01-13 Neu Dynamics Corp Encapsulation molding equipment
NL1002939C2 (nl) * 1996-04-24 1997-10-28 Boschman Holding Bv Matrijsdeel met hoogte-compenserende middelen.
US6319450B1 (en) * 1999-07-12 2001-11-20 Agere Systems Guardian Corp. Encapsulated circuit using vented mold
CN111421761B (zh) * 2019-11-15 2022-03-25 上海阿莱德实业股份有限公司 一种塑包金产品防变形注塑模具
CN111452305B (zh) * 2020-05-29 2022-02-11 江苏华海诚科新材料股份有限公司 一种环氧模塑料大颗粒试验模具及其试验方法
KR102498076B1 (ko) * 2022-08-22 2023-02-10 에스피반도체통신 주식회사 탑 몰드 블럭 무빙 구조를 갖는 미세 체적 변화 캐비티형 반도체칩용 금형

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3606673A (en) * 1968-08-15 1971-09-21 Texas Instruments Inc Plastic encapsulated semiconductor devices
US4332537A (en) * 1978-07-17 1982-06-01 Dusan Slepcevic Encapsulation mold with removable cavity plates
US4793785A (en) * 1986-04-11 1988-12-27 Michio Osada Apparatus of multiplunger type for enclosing semiconductor elements with resin
US4915608A (en) * 1987-07-20 1990-04-10 Mitsubishi Denki Kabushiki Kaisha Device for resin sealing semiconductor devices

Also Published As

Publication number Publication date
GB9407839D0 (en) 1994-06-15
KR100191736B1 (ko) 1999-06-15
GB2277295B (en) 1995-05-03
GB2277295A (en) 1994-10-26

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)