GB2323555B - Encapsulation molding equipment - Google Patents

Encapsulation molding equipment

Info

Publication number
GB2323555B
GB2323555B GB9814587A GB9814587A GB2323555B GB 2323555 B GB2323555 B GB 2323555B GB 9814587 A GB9814587 A GB 9814587A GB 9814587 A GB9814587 A GB 9814587A GB 2323555 B GB2323555 B GB 2323555B
Authority
GB
United Kingdom
Prior art keywords
molding equipment
encapsulation molding
encapsulation
equipment
molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9814587A
Other versions
GB2323555A (en
GB9814587D0 (en
Inventor
Horst Karl Neu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Neu Dynamics Corp
Original Assignee
Neu Dynamics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/271,149 external-priority patent/US5409362A/en
Application filed by Neu Dynamics Corp filed Critical Neu Dynamics Corp
Publication of GB9814587D0 publication Critical patent/GB9814587D0/en
Publication of GB2323555A publication Critical patent/GB2323555A/en
Application granted granted Critical
Publication of GB2323555B publication Critical patent/GB2323555B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
GB9814587A 1994-07-06 1995-04-24 Encapsulation molding equipment Expired - Fee Related GB2323555B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/271,149 US5409362A (en) 1992-11-24 1994-07-06 Encapsulation molding equipment
GB9508293A GB2293130B (en) 1994-07-06 1995-04-24 Encapsulation molding equipment

Publications (3)

Publication Number Publication Date
GB9814587D0 GB9814587D0 (en) 1998-09-02
GB2323555A GB2323555A (en) 1998-09-30
GB2323555B true GB2323555B (en) 1999-01-13

Family

ID=26306922

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9814587A Expired - Fee Related GB2323555B (en) 1994-07-06 1995-04-24 Encapsulation molding equipment

Country Status (1)

Country Link
GB (1) GB2323555B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6319450B1 (en) * 1999-07-12 2001-11-20 Agere Systems Guardian Corp. Encapsulated circuit using vented mold
US6508970B2 (en) 1999-07-15 2003-01-21 Infineon Technologies North America Corp. Liquid transfer molding system for encapsulating semiconductor integrated circuits

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5316463A (en) * 1992-11-24 1994-05-31 Neu Dynamics Corporation Encapsulating molding equipment
GB2277295A (en) * 1993-04-23 1994-10-26 Neu Dynamics Corp Mould for encapsulation of multiple articles on a carrier strip

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5316463A (en) * 1992-11-24 1994-05-31 Neu Dynamics Corporation Encapsulating molding equipment
GB2277295A (en) * 1993-04-23 1994-10-26 Neu Dynamics Corp Mould for encapsulation of multiple articles on a carrier strip

Also Published As

Publication number Publication date
GB2323555A (en) 1998-09-30
GB9814587D0 (en) 1998-09-02

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20000424