HK1244550A1 - 電子安全開關裝置 - Google Patents

電子安全開關裝置

Info

Publication number
HK1244550A1
HK1244550A1 HK18103840.6A HK18103840A HK1244550A1 HK 1244550 A1 HK1244550 A1 HK 1244550A1 HK 18103840 A HK18103840 A HK 18103840A HK 1244550 A1 HK1244550 A1 HK 1244550A1
Authority
HK
Hong Kong
Prior art keywords
switching device
safety switching
electronic safety
electronic
switching
Prior art date
Application number
HK18103840.6A
Other languages
English (en)
Inventor
Thorsten Godau
Norbert Froehlich
Matthias Holzaepfel
Hans Schwenkel
Original Assignee
皮爾茨公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 皮爾茨公司 filed Critical 皮爾茨公司
Publication of HK1244550A1 publication Critical patent/HK1244550A1/zh

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/04—Programme control other than numerical control, i.e. in sequence controllers or logic controllers
    • G05B19/042—Programme control other than numerical control, i.e. in sequence controllers or logic controllers using digital processors
    • G05B19/0428—Safety, monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/20—Pc systems
    • G05B2219/24—Pc safety
    • G05B2219/24008—Safety integrity level, safety integrated systems SIL SIS
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/20—Pc systems
    • G05B2219/24—Pc safety
    • G05B2219/24024—Safety, surveillance
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/20—Pc systems
    • G05B2219/24—Pc safety
    • G05B2219/24182—Redundancy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
HK18103840.6A 2015-01-23 2018-03-20 電子安全開關裝置 HK1244550A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102015101023.2A DE102015101023A1 (de) 2015-01-23 2015-01-23 Elektronisches Sicherheitsschaltgerät
PCT/EP2016/051149 WO2016116514A1 (de) 2015-01-23 2016-01-20 Elektronisches sicherheitsschaltgerät

Publications (1)

Publication Number Publication Date
HK1244550A1 true HK1244550A1 (zh) 2018-08-10

Family

ID=55221396

Family Applications (1)

Application Number Title Priority Date Filing Date
HK18103840.6A HK1244550A1 (zh) 2015-01-23 2018-03-20 電子安全開關裝置

Country Status (7)

Country Link
US (1) US10394211B2 (zh)
EP (2) EP4086714A1 (zh)
JP (1) JP6675406B2 (zh)
CN (1) CN107209491B (zh)
DE (1) DE102015101023A1 (zh)
HK (1) HK1244550A1 (zh)
WO (1) WO2016116514A1 (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6772887B2 (ja) * 2017-02-21 2020-10-21 オムロン株式会社 サーボシステム
JP6962795B2 (ja) * 2017-11-22 2021-11-05 ルネサスエレクトロニクス株式会社 半導体装置および半導体システム
WO2019139815A1 (en) 2018-01-12 2019-07-18 Duke University Apparatus, method and article to facilitate motion planning of an autonomous vehicle in an environment having dynamic objects
TWI822729B (zh) 2018-02-06 2023-11-21 美商即時機器人股份有限公司 用於儲存一離散環境於一或多個處理器之一機器人之運動規劃及其改良操作之方法及設備
US11738457B2 (en) 2018-03-21 2023-08-29 Realtime Robotics, Inc. Motion planning of a robot for various environments and tasks and improved operation of same
DE102018115243A1 (de) * 2018-06-25 2020-01-02 Pilz Gmbh & Co. Kg Sicherheitsschaltgerät mit versenkten Einstellbauelementen
CN113905855B (zh) 2019-04-17 2023-08-25 实时机器人有限公司 运动规划图生成用户界面、系统、方法和规则
US20220126451A1 (en) * 2020-10-26 2022-04-28 Realtime Robotics, Inc. Safety systems and methods employed in robot operations
DE102021103952A1 (de) 2021-02-19 2022-08-25 Sick Ag Optoelektronische Sicherheitsvorrichtung
DE102022212498B3 (de) 2022-11-23 2024-05-23 Kuka Deutschland Gmbh Manipulationsschutz für ein Handgerät

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10053820A1 (de) 2000-10-30 2002-05-29 Pilz Gmbh & Co Elektronisches Sicherheitsschaltgerät
KR100611204B1 (ko) * 2005-05-10 2006-08-10 삼성전자주식회사 멀티 스택 패키징 칩 및 그 제조방법
KR20080067328A (ko) * 2005-09-06 2008-07-18 비욘드 블라데스 리미티드 3ｄｍｃ 아키텍처
US8134235B2 (en) * 2007-04-23 2012-03-13 Taiwan Semiconductor Manufacturing Co., Ltd. Three-dimensional semiconductor device
US8373439B2 (en) * 2009-04-14 2013-02-12 Monolithic 3D Inc. 3D semiconductor device
DE102010062653A1 (de) * 2010-12-08 2012-06-14 Robert Bosch Gmbh Steuermodul und Verfahren zu seiner Herstellung
US8804394B2 (en) * 2012-01-11 2014-08-12 Rambus Inc. Stacked memory with redundancy
US8538558B1 (en) * 2012-03-01 2013-09-17 Texas Instruments Incorporated Systems and methods for control with a multi-chip module with multiple dies
ITVI20120060A1 (it) * 2012-03-19 2013-09-20 St Microelectronics Srl Sistema elettronico avente un' aumentata connessione tramite l'uso di canali di comunicazione orizzontali e verticali

Also Published As

Publication number Publication date
WO2016116514A1 (de) 2016-07-28
EP4086714A1 (de) 2022-11-09
CN107209491B (zh) 2020-06-30
JP2018505557A (ja) 2018-02-22
US20170315530A1 (en) 2017-11-02
US10394211B2 (en) 2019-08-27
DE102015101023A1 (de) 2016-07-28
JP6675406B2 (ja) 2020-04-01
EP3248073A1 (de) 2017-11-29
CN107209491A (zh) 2017-09-26

Similar Documents

Publication Publication Date Title
HK1244550A1 (zh) 電子安全開關裝置
GB201501297D0 (en) Device
HK1246501A1 (zh) 電子裝置
EP3725383C0 (de) Sicherungsgerät
GB2559510B (en) Electronic device
HUE046450T2 (hu) Kapcsolókészülék
GB2556786B (en) Electronic device
GB201503409D0 (en) Device
PL3884796T3 (pl) Urządzenie zabezpieczające
ZA201708649B (en) Integrated circuit initiator device
SG11201707314VA (en) Electronic device
GB201609030D0 (en) Safety Device
HK1211788A2 (zh) 開關裝置
GB201504409D0 (en) Disconnector device
GB2538840B (en) An improved safety switching device
GB201613371D0 (en) Electronic device
EP3097753C0 (de) Sicherungsvorrichtung
GB201611225D0 (en) Safety device
GB201602995D0 (en) Safety device
PL3224846T3 (pl) Urządzenie przełączające
GB201411830D0 (en) Circuit breaker
ZA201800634B (en) Switching device
GB2559517B (en) Electronic device
GB2545040B (en) Fuse retaining device
HK1211418A2 (zh) 電子裝置