HK1226025A1 - 工作表面清理系統和方法 - Google Patents

工作表面清理系統和方法

Info

Publication number
HK1226025A1
HK1226025A1 HK16114421A HK16114421A HK1226025A1 HK 1226025 A1 HK1226025 A1 HK 1226025A1 HK 16114421 A HK16114421 A HK 16114421A HK 16114421 A HK16114421 A HK 16114421A HK 1226025 A1 HK1226025 A1 HK 1226025A1
Authority
HK
Hong Kong
Prior art keywords
working surface
cleaning system
surface cleaning
working
cleaning
Prior art date
Application number
HK16114421A
Other languages
English (en)
Inventor
Alan E Humphrey
Jerry J Broz
James H Duvall
Original Assignee
Int Test Solutions Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/961,127 external-priority patent/US9833818B2/en
Application filed by Int Test Solutions Inc filed Critical Int Test Solutions Inc
Publication of HK1226025A1 publication Critical patent/HK1226025A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02076—Cleaning after the substrates have been singulated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0028—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by adhesive surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/50—Cleaning by methods involving the use of tools involving cleaning of the cleaning members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02082—Cleaning product to be cleaned
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02096—Cleaning only mechanical cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3512—Cracking
    • H01L2924/35121—Peeling or delaminating

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
HK16114421A 2013-08-07 2016-12-20 工作表面清理系統和方法 HK1226025A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/961,127 US9833818B2 (en) 2004-09-28 2013-08-07 Working surface cleaning system and method

Publications (1)

Publication Number Publication Date
HK1226025A1 true HK1226025A1 (zh) 2017-09-22

Family

ID=52462041

Family Applications (1)

Application Number Title Priority Date Filing Date
HK16114421A HK1226025A1 (zh) 2013-08-07 2016-12-20 工作表面清理系統和方法

Country Status (9)

Country Link
EP (1) EP3030356B1 (zh)
JP (2) JP6279734B2 (zh)
KR (2) KR102127059B1 (zh)
CN (2) CN113851399A (zh)
HK (1) HK1226025A1 (zh)
MY (1) MY188974A (zh)
PH (3) PH12016500253A1 (zh)
SG (1) SG11201600461XA (zh)
WO (1) WO2015021287A2 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9825000B1 (en) * 2017-04-24 2017-11-21 International Test Solutions, Inc. Semiconductor wire bonding machine cleaning device and method
CN109309026B (zh) * 2017-07-28 2021-03-23 无锡华润华晶微电子有限公司 晶圆贴膜方法及治具
CN108941061B (zh) * 2018-05-18 2021-02-05 中国人民解放军国防科技大学 光学元件的定量化清洁装置及方法
US11756811B2 (en) 2019-07-02 2023-09-12 International Test Solutions, Llc Pick and place machine cleaning system and method
US11318550B2 (en) * 2019-11-14 2022-05-03 International Test Solutions, Llc System and method for cleaning wire bonding machines using functionalized surface microfeatures

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63204728A (ja) 1987-02-20 1988-08-24 Fukuoka Nippon Denki Kk 半導体装置のゴミ除去装置
US5690749A (en) * 1996-03-18 1997-11-25 Motorola, Inc. Method for removing sub-micron particles from a semiconductor wafer surface by exposing the wafer surface to clean room adhesive tape material
US6019663A (en) * 1998-02-20 2000-02-01 Micron Technology Inc System for cleaning semiconductor device probe
US7202683B2 (en) * 1999-07-30 2007-04-10 International Test Solutions Cleaning system, device and method
JP2006013185A (ja) * 2004-06-28 2006-01-12 Nitto Denko Corp 半導体装置用クリーニング部材の再生方法
US20060065290A1 (en) 2004-09-28 2006-03-30 Jerry Broz Working surface cleaning system and method
KR20080053937A (ko) * 2005-10-25 2008-06-16 닛토덴코 가부시키가이샤 클리닝 시트, 클리닝 기능 탑재 반송 부재 및 기판 처리장치의 클리닝 방법
US20100258144A1 (en) * 2009-04-14 2010-10-14 International Test Solutions Wafer manufacturing cleaning apparatus, process and method of use
US8371316B2 (en) * 2009-12-03 2013-02-12 International Test Solutions, Inc. Apparatuses, device, and methods for cleaning tester interface contact elements and support hardware

Also Published As

Publication number Publication date
CN105705258A (zh) 2016-06-22
KR102127059B1 (ko) 2020-06-25
MY188974A (en) 2022-01-17
JP6662918B2 (ja) 2020-03-11
EP3030356A2 (en) 2016-06-15
KR20160044499A (ko) 2016-04-25
WO2015021287A2 (en) 2015-02-12
SG11201600461XA (en) 2016-02-26
PH12021551346A1 (en) 2021-11-22
CN113851399A (zh) 2021-12-28
EP3030356A4 (en) 2017-08-09
WO2015021287A3 (en) 2015-04-09
PH12016500253A1 (en) 2016-05-16
JP2016531440A (ja) 2016-10-06
KR101883311B1 (ko) 2018-07-31
JP2018067737A (ja) 2018-04-26
KR20180086529A (ko) 2018-07-31
PH12021551347A1 (en) 2021-11-22
EP3030356B1 (en) 2022-09-14
JP6279734B2 (ja) 2018-02-14

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