HK1220074A1 - 電子部件及其連接方法、連接體及其製造方法、緩衝材料 - Google Patents

電子部件及其連接方法、連接體及其製造方法、緩衝材料

Info

Publication number
HK1220074A1
HK1220074A1 HK16107976.5A HK16107976A HK1220074A1 HK 1220074 A1 HK1220074 A1 HK 1220074A1 HK 16107976 A HK16107976 A HK 16107976A HK 1220074 A1 HK1220074 A1 HK 1220074A1
Authority
HK
Hong Kong
Prior art keywords
connector
manufacturing
electronic component
cushioning material
connection method
Prior art date
Application number
HK16107976.5A
Other languages
English (en)
Inventor
三宅健
光浪龍廣
深谷達朗
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of HK1220074A1 publication Critical patent/HK1220074A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
HK16107976.5A 2014-09-11 2016-07-08 電子部件及其連接方法、連接體及其製造方法、緩衝材料 HK1220074A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014185735 2014-09-11
JP2015148753A JP6562750B2 (ja) 2014-09-11 2015-07-28 電子部品、接続体、接続体の製造方法、電子部品の接続方法、緩衝材

Publications (1)

Publication Number Publication Date
HK1220074A1 true HK1220074A1 (zh) 2017-04-21

Family

ID=55757474

Family Applications (1)

Application Number Title Priority Date Filing Date
HK16107976.5A HK1220074A1 (zh) 2014-09-11 2016-07-08 電子部件及其連接方法、連接體及其製造方法、緩衝材料

Country Status (2)

Country Link
JP (1) JP6562750B2 (zh)
HK (1) HK1220074A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113163594B (zh) * 2020-01-07 2024-04-09 峻立科技股份有限公司 塑料组件与电路板的结合方法

Also Published As

Publication number Publication date
JP2016058718A (ja) 2016-04-21
JP6562750B2 (ja) 2019-08-21

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